DLA SMD-5962-98627 REV A-2007 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY TTL DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS W CLEAR AND PRESET MONOLITHIC SILICON《微型电路 线型 双极改进型肖.pdf
《DLA SMD-5962-98627 REV A-2007 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY TTL DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS W CLEAR AND PRESET MONOLITHIC SILICON《微型电路 线型 双极改进型肖.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-98627 REV A-2007 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY TTL DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS W CLEAR AND PRESET MONOLITHIC SILICON《微型电路 线型 双极改进型肖.pdf(12页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update drawing to current requirements. Editorial changes throughout. - gap 07-03-12 Robert M. Heber REV SHET REV SHET REV STATUS REV A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Larry E. Shaw DEFENSE SUPPLY
2、CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Lee J. Surowiec COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Raymond Monnin MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, DUAL POSITIVE- AND AGENCIES OF THE DEPARTM
3、ENT OF DEFENSE DRAWING APPROVAL DATE 98-06-30 EDGE-TRIGGERED D-TYPE FLIP-FLOPS W/CLEAR AND PRESET, MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-98627 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E071-07 Provided by IHSNot for ResaleNo reproduction or networking permitted with
4、out license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98627 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classe
5、s Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the
6、following example: 5962 - 98627 01 Q C X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MI
7、L-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device t
8、ype(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54AS74A Dual positive-edge-triggered D-type flip-flops w/clear and preset 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows:
9、Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s
10、) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line 2 CQCC1-N20 20 Square chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-3853
11、5, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98627 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute max
12、imum ratings. 1/ Supply voltage (VCC) +7.0 V dc Maximum power dissipation (PD) 2/ 112 mW Input voltage (VI) . +7.0 V dc Storage temperature range . -65C to +150C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) +175C Case operating temperature range (TC) -55C to +
13、125C 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc to +5.5 V dc High-level input voltage (VIH) . +2.0 V minimum Low-level input voltage (VIL) +0.8 V maximum High-level output current (IOH) . -2.0 mA maximum Low-level output current (IOL) 20 mA maximum Clock Frequency (fc
14、lock) 0-90 MHz Pulse duration (tw) : PRE or CLR low . 4 ns minimum CLK high 4 ns minimum CLK low . 5.5 ns minimum Setup time before CLK (tsu) : Data: 4.5 ns minimum PRE or CLR inactive: . 2 ns minimum Hold time after CLK (th) Data . 0 ns minimum Case operating temperature (TC) -55C to +125C 2. APPLI
15、CABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTM
16、ENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK
17、-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphi
18、a, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtai
19、ned. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Maximum power dissipation is defined as VCCx ICC, and must withstand the added PDdue to short circuit test; e.g.,
20、 IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98627 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The i
21、ndividual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The indiv
22、idual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and
23、herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Function table. The function ta
24、ble shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Test circuit and timing waveforms. The test circuit and timing waveforms shall be as specified on figure 4. 3.3 Electrical performance characteristics and postirradiation parameter
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