DLA SMD-5962-96736-1996 MICROCIRCUIT DIGITAL RADIATION HARDENED CMOS HIGH SPEED 8-BIT BIDIRECTIONAL CMOS TTL INTERFACE LEVEL CONVERTER MONOLITHIC SILICON《的互补金属氧化物半导体 硅单片电路数字微电路8-BI.pdf
《DLA SMD-5962-96736-1996 MICROCIRCUIT DIGITAL RADIATION HARDENED CMOS HIGH SPEED 8-BIT BIDIRECTIONAL CMOS TTL INTERFACE LEVEL CONVERTER MONOLITHIC SILICON《的互补金属氧化物半导体 硅单片电路数字微电路8-BI.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-96736-1996 MICROCIRCUIT DIGITAL RADIATION HARDENED CMOS HIGH SPEED 8-BIT BIDIRECTIONAL CMOS TTL INTERFACE LEVEL CONVERTER MONOLITHIC SILICON《的互补金属氧化物半导体 硅单片电路数字微电路8-BI.pdf(20页珍藏版)》请在麦多课文档分享上搜索。
1、SMD-5962-96736 W 9999996 0084223 969 REVISIONS LTR DESCRIPTION DATE (YRMO-DA) APPROVED PREPAREDBY Thomas M. Hess CHECKED BY Thomas M. Hess APPROVED BY Monica L. Poelking DRAWING APPROVAL DATE 96-01 -1 6 REVISION LEVEL REV I I I DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 MICROCIRCUIT, DIGIT
2、AL, RADIATION HARDENED, INTERFACE LEVEL CONVERTER, MONOLITHIC SILICON CMOS, HIGH SPEED 8-BIT BIDIRECTIONAL CMOSATL 5962-96736 SIZE CAGE CODE SHEET 1 OF 19 SHEET REV STATUS OF SHEETS PMIC NIA STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPART
3、MENT OF DEFENSE AMSC NIA 1ECC FORM 193 JUL 94 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 5962-E239-96 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-9b73b W 9999996 0084224 8T5 SIZE STANDARD A MICROCIR
4、CUIT DRAWING DEFENSEELECTRONICSSUPPLYCENTER DAYTON, OHIO 45444 REVISION LEVEL 1. SCOPE 5962-96736 SHEET 2 1.1 m. This drawing forms a part of a one part - one part nvnber docunentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes and
5、M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, IIProvisions for the use o
6、f MIL-STD-883 in conjunction with compliant non-JAN devicesBB. Uhen available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. I 1.2 m. The PIN shall be as shown in the following example: 96736 f f Federa 1 R HA Device Device Case Lead stock class designator type c 1
7、ass outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) li LA (see 1.2.3) w Drawing nunber 1.2.1 RHA desimator. Device class M RHA marked devices shall meet the MIL-1-38535 appendix A specified RHA Levels and shall be marked with the appropriate RHA designator. MIL-1
8、-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-1 indicates a non-RHA device. Device classes Q and V RHA marked devices shall meet the 1.2.2 pevice tvrre(s1 . The device type(s) shall identify the circuit function as follows: pevi ce tvDe Generic number
9、Ci rcui t function o1 GP511 Radiation hardened CMOS/SOS high speed 8-bit directional CMOS/TTL interface level converter 1.2.3 pevice class desimator. The device class designator shall be a single letter identifying the product assurance level as follows: evice class Device reauirements docunenta tio
10、n I9 M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certificat i on and qual if icat ion to MIL- 1-38535 1.2.4 Case outline(s). The case outline(s1 shall be as designated in MIL-STD-1835 and as follows: outline letter
11、Descriotive desimator Termina 1% Package stvle X CDFP3-FZ8 28 Flatpack package 1.2.5 Lead finish. The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-1-38535 for classes Q and V. designation is for use in specifications when lead finishes A, B, and C are consider
12、ed acceptable and interchangeable Finish letter BBXBB shall not be marked on the microcircuit or its packaging. The “XIB DESC FORM 193A JUL 94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- SMD-5962-96736 9997976 0084225 731 W MIL I TARY MIL-STD-88
13、3 - Test Methods and Procedures for Microelectronics. MIL-STD-973 - Configuration Management. MIL-STD-1835 - Microcircuit Case Outlines. BULLETIN 1.3 pbsolute maximum ratinss .I/ supply voltage (VCC) - - - - - - - - - - - - - - - - - - - - - - Supply voltage (VD,) - - - - - - - - - - - - - - - - - -
14、 - Input voltage range: Data inputs, CMOS to TTL - - - - - - - - - - - - - - - - - - - Data inputs, TTL to CMOS - - - - - - - - - - - - - - - - - - - Storage temperature range (TSTG) - - - - - - - - - - - - - - - - Junction temperature (TJ) - - - - - - - - - - - - - - - - - - - Lead temperature (sol
15、dering 10 seconds) (TS) - - - - - - - - - - Thermal resistance junction-to-case (JC): Case x - - - - - - - - - - - - - - - - - - - - Thermal resistance junction-to-ambient (8JA): Maximun package power dissipation TA = +125C (PD): 1/ Caseoutlinex -_- - - - - - Case x - - - - - - - - - - - - - - - - -
16、 - - - - - - MILITARY MIL-BUL-103 - List of Standardized Military Drawings (SMDIS). 1 HANDBOOK -0.5 V to VDD -0.5 V dc to 11 V dc STANDARD MICROCIRCUIT DRAWING DEFENSEELECTRONICSSUPPLYCENTER DAYTON, OHIO 45444 I -0.5 V to VDD + 0.5 V -0.5 V to V + 0.5 V -65.C to +1!% +175C +265c 1 OC/U 65WU 0.77 u 4
17、.5 V dc to +5.5 V dc or VDD 4.5 V dc to +10.5 V dc -55C to +125C O V to 0.2 x VDD VDD to 0.8 x V O V to 0.5 V 8 Vcc to 2.3 V I/ 10 k Rads(S1) 10“ RAD(SI)/sec 4/ 100 MEV/(rng/cm2) 4/ 2. APPLICABLE DOCUMENTS 2.1 Government specification. standards, bulletin, and handbook. Unless otherwise specified, t
18、he following specification, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATION MI LITARY MIL-1-38535 - Integrat
19、ed Circuits, Manufacturing, General Specification for. STANDARDS MI LI TARY MIL-HDBK-780 - Standardized Military Drawings. - 1/ a Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliabili
20、ty. If device power exceeds package dissipation capability provide heat sinking or derate linearly (the derating is based on eJA) at the following rate, case X = 15.4 W/“C Guaranteed by process or design, not tested. 5/ VDD = 10 v, vcc = 5.0 v. 4/ 5962-96736 REVISION LEVEL SHEET DESC FORM 193A JUL 9
21、4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-96736 9999996 0084226 678 STANDARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE A 5962-96736 REVISION LEVEL SHEET 4 DESC FORM 193A JUL 94 Provided by IHSNot
22、for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-96736 7779%7b 0084227 504 Limits Unit Supply current Input current in CMOS inputs to TTL outputs Output current high CMOS inputs to TTL outputs Output current low (CMOS inputs to TTL outputs) TTL three-state outp
23、ut leakage current (CMOS inputs to TTL outputs) Icc Vcc = 5.5 VI VDD = 10.5 V Vcc 5.5 V, VDD = 10.5 V 1 ,Z13 IIN VIN = O or VDD 1 A3 Vcc = 4.5 V, VDD = 9.5 V vOH = = 0 V I12J vcc = 4.5 VI VDD = 9.5 v IOL VOL = 0.4 V 1,213 IwT Enable = 1, VIlo = O 1,2,3 Vcc = 5.5 VI VDD = 10.5 V TTL three-state outpu
24、t leakage current (CMOS inputs to TTL outputs) Input current low (TTL inputs to CMOS outputs) input current high (TTL inputs to CMOS outputs) IWT IIL IIH Vcc = 5.5 V, VDD = 10.5 V Enable = O 1,2,3 Vcc = 5.5 V, V = 10.5 V VIL = O V, EnaBe = I 11213 input current in (TTL inputs to CMOS outputs) Fc f 5
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