DLA SMD-5962-92199 REV B-2013 MICROCIRCUIT DIGITAL ADVANCED CMOS 10-BIT BUFFER LINE DRIVER WITH NONINVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf
《DLA SMD-5962-92199 REV B-2013 MICROCIRCUIT DIGITAL ADVANCED CMOS 10-BIT BUFFER LINE DRIVER WITH NONINVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-92199 REV B-2013 MICROCIRCUIT DIGITAL ADVANCED CMOS 10-BIT BUFFER LINE DRIVER WITH NONINVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf(18页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update the boilerplate to current requirements as specified in MIL-PRF-38535. Editorial changes throughout. jak 06-11-13 Thomas M. Hess B Updated DC output current (ICC, IGND) in section 1.3, add source of supply information cage 0C7V7. Update th
2、e boilerplate paragraphs to current requirements as specified in MIL-PRF-38535. jwc 13-04-24 Thomas M. Hess REV SHEET REV B B B SHEET 15 16 17 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Thanh V. Nguyen DLA LAND AND MARITIME COLUMB
3、US, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY Thanh V. Nguyen THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, ADVANCED CMOS, 10-BIT BUFFER/LINE DRIVER WITH NONINVERTING THREE-STATE OUTPUTS, TT
4、L COMPATIBLE INPUTS, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 94-01-27 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-92199 SHEET 1 OF 17 DSCC FORM 2233 APR 97 5962- E277-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without
5、license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92199 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) an
6、d space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following exam
7、ples: 5962 - 92199 01 M K A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535
8、 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) iden
9、tify the circuit function as follows: Device type Generic number Circuit function 01 54ACTQ827 10-bit buffer/line driver with noninverting three-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level
10、as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The ca
11、se outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 Flat pack L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 3 CQCC1-N28 28 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified
12、in MIL-PRF-38535 for device classes Q, and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92199 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEV
13、EL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage (VIN) -0.5 V dc to VCC+ 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc DC input clamp current (IIK): VIN= -0.5 V 20 mA VIN= VCC+0.5 V . +
14、20 mA DC output clamp current (IOK): VIN= -0.5 V 20 mA VIN= VCC+0.5 V . +20 mA DC output current (IOUT) per output pin 50 mA DC VCCor GND current (ICC, IGND) per pin 50mA Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-
15、case (JC) . See MIL-STD-1835 Junction temperature (TJ). +175C Maximum power dissipation (PD) . 500 mW 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT) . +0.0 V dc to VCCMaximum low leve
16、l input voltage (VIL) 0.8 V Minimum high level input voltage (VIH) . 2.0 V Case operating temperature range (TC) . -55C to +125C Minimum input edge rate (V/t): (VINfrom 0.8 V to 2.0 V or VINfrom 2.0 V to 0.8 V) . 125 mV/ns Maximum high level output current (IOH) -24 mA Maximum low level output curre
17、nt (IOL) 24 mA 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified he
18、rein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92199 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LE
19、VEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those ci
20、ted in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlin
21、es. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Buildin
22、g 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIAT
23、ION (JEDEC) JESD20 - Standard for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201-2701.) 2.3
24、Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.
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