DLA SMD-5962-89775 REV A-2009 MICROCIRCUIT LINEAR FAST QUAD PNP TRANSISTOR ARRAY MONOLITHIC SILICON.pdf

《DLA SMD-5962-89775 REV A-2009 MICROCIRCUIT LINEAR FAST QUAD PNP TRANSISTOR ARRAY MONOLITHIC SILICON.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-89775 REV A-2009 MICROCIRCUIT LINEAR FAST QUAD PNP TRANSISTOR ARRAY MONOLITHIC SILICON.pdf（9页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Redraw. Update drawing to current requirements. - drw 09-04-14 Joseph D. Rodenbeck THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY R

2、ick C. Officer CHECKED BY Charles E. Besore DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY Michael A. Frye STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 9

3、1-02-11 MICROCIRCUIT, LINEAR, FAST QUAD PNP TRANSISTOR ARRAY, MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-89775 SHEET 1 OF 8 DSCC FORM 2233 APR 97 5962-E229-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICR

4、OCIRCUIT DRAWING SIZE A 5962-89775 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, a

5、ppendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89775 01 C A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device types. The device types identify the circuit function as follows: Device type Ge

6、neric number Circuit function 01 EP2015 Fast quad PNP transistor array 02 EP2015A Fast quad PNP transistor array 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line

7、 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Collector-base voltage (VCB) 40 V Emitter-base voltage (VEB). 5 V Collector-emitter voltage (VCE). 40 V Collector current (IC) 50 mA Base curren

8、t (IB) 10 mA Power dissipation (PD) (TA= +25C): Each transistor . 500 mW Total package. 1.25 W Junction temperature (TJ) 175C Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC). See MIL-STD-1835 Thermal resistance, junctio

9、n-to-ambient (JA): Case C . 86C/W Case 2 100C/W 1.4 Recommended operating conditions. Ambient operating temperature range (TA) -55C to +125C Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89775 DEFENSE SUPPL

10、Y CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwis

11、e specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-183

12、5 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Stand

13、ardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersede

14、s applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that

15、 is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval i

16、n accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “Q

17、ML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. T

18、he case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and

19、 shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-3

20、8535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the dev

21、ice. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QM

22、L flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89775 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical perform

23、ance characteristics. Test Symbol Conditions -55C TA+125C Group A subgroupsDevice type Limits Unit unless otherwise specified Min Max Change in base-emitter voltage 1/ delta VBEVCE= 4 V, IC= 1 mA 1 01 5.0 mV 2, 3 10.0 1 02 1.0 2, 3 2.0 delta hFE1VCE= 1 V, IC= 0.1 mA 1 01 10.0 % Static forward curren

24、t ratio between each of six possible pairs of transistors 1/ 2/ 2, 3 20.0 1 02 5.0 2, 3 10.0 delta hFE2VCE= 1 V, IC= 1 mA 1 01 10.0 2, 3 20.0 1 02 5.0 2, 3 10.0 delta hFE3VCE= 1 V, IC= 10 mA 1 01 10.0 2, 3 20.0 1 02 5.0 2, 3 10.0 Static forward current transfer ratio 3/ hFE1VCE= 1 V, IC= 0.1 mA 1 01

25、 75 2, 3 30 1 02 150 2, 3 60 See footnotes at end of table.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89775 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 223

26、4 APR 97 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions -55C TA+125C Group A subgroupsDevice type Limits Unit unless otherwise specified Min Max Static forward current transfer ratio 3/ hFE2VCE= 1 V, IC= 1 mA 1 01 75 2, 3 30 1 02 150 2, 3 60 hFE3VCE= 1 V, IC= 10

27、mA 1 01 75 2, 3 30 1 02 100 2, 3 40 Base to emitter saturation voltage 3/ VBEIC= 10 mA, IB= 1 mA 1 All 0.9 V 2, 3 1.1 Collector to emitter saturation voltage 3/ VCEIC= 10 mA, IB= 1 mA 1 All 0.2 V 2, 3 0.3 Breakdown voltage collector to emitter 3/ BVCEIC= 1 mA, IB= 0 mA 1, 2, 3 All 40 V Breakdown vol

28、tage collector to base 3/ BVCBIC= 10 A, IE= 0 mA 1, 2, 3 All 40 V Breakdown voltage emitter to base 3/ BVEBIE= 10 A, IC= 0 mA 1, 2, 3 All 5 V Collector cutoff current 3/ ICBVCB= 30 V, IE= 0 mA 1, 2, 3 All 50 nA Emitter cutoff current 3/ IEBVEB= 4 V, IC= 0 mA 1, 2, 3 All 50 nA 1/ Delta VBEand delta h

29、FEare measured between each of six possible pairs of transistors. 2/ Delta hFEis calculated based on the difference divided by the larger of the two readings. 3/ Applies to all four transistors. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDAR

30、D MICROCIRCUIT DRAWING SIZE A 5962-89775 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 Device types 01 and 02 Case outlines C 2 Terminal number Terminal symbol 1 Q1 COLLECTOR NC 2 Q1 BASE Q1 COLLECTOR 3 Q1 EMITTER Q1 BASE 4 SUB Q1 EMITTER 5 Q

31、2 EMITTER Q1 EMITTER 6 Q2 BASE SUB 7 Q2 COLLECTOR Q2 EMITTER 8 Q3 COLLECTOR Q2 EMITTER 9 Q3 BASE Q2 BASE 10 Q3 EMITTER Q2 COLLECTOR 11 SUB NC 12 Q4 EMITTER Q3 COLLECTOR 13 Q4 BASE Q3 BASE 14 Q4 COLLECTOR Q3 EMITTER 15 - - - Q3 EMITTER 16 - - - SUB 17 - - - Q4 EMITTER 18 - - - Q4 EMITTER 19 - - - Q4

32、BASE 20 - - - Q4 COLLECTOR NC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89775 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SH

33、EET 7 DSCC FORM 2234 APR 97 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved sour

34、ce of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered t

35、o this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required document

36、ation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-

37、STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A or B. The test circuit shall be maintained by the manufacturer under document revision level contro

38、l and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final ele

39、ctrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 500

40、5, table I) Interim electrical parameters (method 5004) 1 Final electrical test parameters (method 5004) 1*, 2, 3 Group A test requirements (method 5005) 1, 2, 3 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. Provided by IHSNot for ResaleNo reproduc

41、tion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89775 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance

42、with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.

43、4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A or B. The test circuit shall be maintained by the manufacturer under document revision level control a

44、nd shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 ho

45、urs, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit

46、applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existin

47、g SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application re

48、quires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this