DLA SMD-5962-88701 REV F-2008 MICROCIRCUIT HYBRID LINEAR HIGH CURRENT OPERATIONAL AMPLIFIER《运算放大器高电流线性混合微电路》.pdf
《DLA SMD-5962-88701 REV F-2008 MICROCIRCUIT HYBRID LINEAR HIGH CURRENT OPERATIONAL AMPLIFIER《运算放大器高电流线性混合微电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-88701 REV F-2008 MICROCIRCUIT HYBRID LINEAR HIGH CURRENT OPERATIONAL AMPLIFIER《运算放大器高电流线性混合微电路》.pdf(14页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Remove vendor CAGE 13919. Add vendor CAGE 69210. Add case outline Y. Changed to reflect MIL-H-38534 processing. Update document with editorial changes throughout. 93-03-29 K. A. Cottongim B Add vendor CAGE 51651, case outlines U and Z, and device
2、 type 02. Make corrections to table I. 95-02-08 K. A. Cottongim C Figure 1, case outline U, correct dimension A min. from 0.255“ to 0.200“. Figure 1, case outline U, correct dimension D min. from 1.350“ to 1.035“. Figure 1, case outline Y, change dimension C max. from .260“ to .265“. Figure 1, case
3、outline Z, add dimension L, which was omitted. Table I, IOP, subgroups 5 and 6, add note 2. Update drawing boilerplate to most current format. 02-05-21 Raymond Monnin D Add device type 03. Table I, delete note 2 from table I. Table I, Output current peak test, conditions column, add minimum to both
4、VOUTconditions. Table I, Slew rate, subgroups column, correct subgroup 7 to subgroup 4. Table II, delete subgroup 7 (2 places). 4.3.1.b, add subgroup 7. 06-06-02 Raymond Monnin E Table I, Output voltage peak test, subgroups 5 and 6, delete device type 03. Add new test conditions for subgroups 5 and
5、6 for device type 03 with the minimum test limit of 28 V. Table I, Output current peak test, subgroups 5 and 6, delete device type 03. Add new test conditions for subgroups 5 and 6 for device type 03 with the minimum test limit of 3 A. -gz 07-10-25 Robert M. Heber F Table I: Input bias current, devi
6、ce type 03, subgroups 2 and 3, change the min/max limits from 50 nA to 150 nA. Input offset current, device type 03, subgroups 2 and 3, change the min/max limits from 20 nA to 50 nA. -gz 08-03-17 Robert M. Heber THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STAT
7、US REV F F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Steve L. Duncan DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Donald R. Osborne COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPA
8、RTMENTS APPROVED BY William K. Heckman MICROCIRCUIT, HYBRID, LINEAR, HIGH CURRENT, OPERATIONAL AMPLIFIER AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-10-16 AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 67268 5962-88701 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E293-08Provided by IH
9、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88701 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements f
10、or class H hybrid microcircuits to be processed in accordance with MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). 1.2 PIN. The PIN shall be as shown in the following example: 5962-88701 01 X X Drawing number Devi
11、ce type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit function 01 OMA541SKB, MSK 541B, High power, operational amplifier MSK 145B, MSK 146B, MSK 147B 02 OMA541SK
12、CB High power, operational amplifier 03 MSK 541B, MSK 145B, High power, operational amplifier MSK 146B, MSK 147B 1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style U See figure 1 8 Dual-in-li
13、ne (Z-tab power) X See figure 1 8 Flange mount Y See figure 1 8 Dual-in-line (power) Z See figure 1 6 Single-in-line 1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC) 40 V dc Differential input voltage VCCCommon mode inpu
14、t voltage. VCC Maximum power dissipation (PD) 2/ 3/. 125 W Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC): Device types 01and 03. 2.2C/W Device type 02 1.5C/W Junction temperature (TJ) +200C 1.4 Recommended operating c
15、onditions. Supply voltage (VCC) 34 V dc Ambient operating temperature range (TA) -55C to +125C 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Derate 2.2C/W above +25C.
16、 3/ TA +25C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88701 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Governmen
17、t specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION
18、MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Dr
19、awings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of p
20、recedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item req
21、uirements. The individual item performance requirements for device class H shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the appli
22、cable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or func
23、tion of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1
24、. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperatur
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