DLA SMD-5962-87560 REV F-2006 MICROCIRCUIT DIGITAL TTL-TO-ECL TRANSLATOR MONOLITHIC SILICON《硅单块 晶体管-晶体管逻辑电路到发射极耦合逻辑的翻译 数字微型电路》.pdf
《DLA SMD-5962-87560 REV F-2006 MICROCIRCUIT DIGITAL TTL-TO-ECL TRANSLATOR MONOLITHIC SILICON《硅单块 晶体管-晶体管逻辑电路到发射极耦合逻辑的翻译 数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-87560 REV F-2006 MICROCIRCUIT DIGITAL TTL-TO-ECL TRANSLATOR MONOLITHIC SILICON《硅单块 晶体管-晶体管逻辑电路到发射极耦合逻辑的翻译 数字微型电路》.pdf(16页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Made technical changes in Table I. Editorial changes throughout. mlp 92-01-27 Monica L. Poelking B Changes in accordance with NOR 5962-R268-92. tvn 92-08-04 Monica L. Poelking C Add package CDFP4-F16. Use new boilerplate. ljs 98-02-04 Raymond Mon
2、nin D Figure 4 modified to be consistent with Table I. ljs 98-08-12 Raymond Monnin E Add VCCpositive supply voltage specifications to para. 1.3 and 1.4. ljs 98-10-20 Raymond Monnin F Update to current requirements. Editorial changes throughout. gap 06-04-06 Raymond Monnin The original first page of
3、this drawing has been replaced. REV SHET REV F SHET 15 REV STATUS REV F F F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY David Queenan DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. Dicenzo COLUMBUS, OHIO 43218-3990 THIS D
4、RAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Robert P. Evans MICROCIRCUIT, DIGITAL, TTL-TO-ECL AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 87-11-24 TRANSLATOR, MONOLITHIC SILICON AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 67268 5962-87560 SHEET 1 OF 15 DSCC FORM 223
5、3 APR 97 5962-E193-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87560 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This dra
6、wing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87560 01 E X Drawing number Device type (see 1.2.1) Case o
7、utline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 10H524 Quad TTL-to-ECL translator 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Out
8、line letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual -in-line F GDFP2-F16 or CDFP3-F16 16 Flat package X CDFP4-F16 16 Flat-package 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute m
9、aximum ratings. Positive supply voltage range (VCC) . 0.0 V dc to 7.0 V dc Negative supply voltage range ( VEE) . -8.0 V dc to 0.0 V dc Total supply voltage range (VCC+ | VEE |) 12 V dc Input voltage range . -5.2 V dc to 0.0 V dc Storage temperature range . -65C to +165C Lead temperature (soldering,
10、 10 seconds) +300C Junction temperature (TJ) +165C Maximum power dissipation (PD) . 530 mW Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 1.4 Recommended operating conditions. Positive supply voltage range (VCC) . 4.5 V dc minimum to 5.5 V dc maximum Negative supply voltage range (VEE)
11、 . -5.46 V dc minimum to -4.94 V dc maximum Case operating temperature range (TC) -55C to +125C Minimum high level input voltage (VIH): TA= +25C -0.780 V dc TA= +125C -0.650 V dc TA= -55C . -0.840 V dc Maximum low level input voltage (VIL) -1.950 V dc Provided by IHSNot for ResaleNo reproduction or
12、networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87560 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following spec
13、ification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General S
14、pecification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawin
15、gs. (Copies of these documents are available online at http:/assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of
16、 this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in a
17、ccordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-P
18、RF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modification
19、s shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. T
20、he design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tab
21、le(s). The truth table(s) shall be as specified on figure 2. 3.2.4 Logic diagram(s). The logic diagram(s) shall be as specified on figure 3. 3.2.5 Test circuit and switching waveforms. Test circuit and switching waveforms shall be as specified on figure 4. 3.3 Electrical performance characteristics.
22、 Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING S
23、IZE A 5962-87560 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3
24、.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufact
- 1.请仔细阅读文档,确保文档完整性,对于不预览、不比对内容而直接下载带来的问题本站不予受理。
- 2.下载的文档,不会出现我们的网址水印。
- 3、该文档所得收入(下载+内容+预览)归上传者、原创作者;如果您是本文档原作者,请点此认领!既往收益都归您。
下载文档到电脑,查找使用更方便
10000 积分 0人已下载
下载 | 加入VIP,交流精品资源 |
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- DLASMD596287560REVF2006MICROCIRCUITDIGITALTTLTOECLTRANSLATORMONOLITHICSILICON 硅单块 晶体管 逻辑电路 发射极 耦合 逻辑

链接地址:http://www.mydoc123.com/p-699003.html