DLA DSCC-VID-V62 12607 REV A-2012 MICROCIRCUIT DIGITAL 9 CHANNEL RS-422 RS-485 TRANSCEIVER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Correct vendor part in section 6.3. - phn 12-06-04 Thomas M. Hess Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV A A PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Phu H. Nguyen DLA LAND AND
2、 MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil/ Original date of drawing YY MM DD CHECKED BY Phu H. Nguyen TITLE MICROCIRCUIT, DIGITAL, 9 CHANNEL RS-422/ RS-485 TRANSCEIVER, MONOLITHIC SILICON 12-05-01 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/12607 R
3、EV A PAGE 1 OF 14 AMSC N/A 5962-V059-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/12607 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements
4、of a high performance 9 channel RS-422/ RS-485 transceiver microcircuit, with an operating temperature range of -40C to +85C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control numb
5、er for identifying the item on the engineering documentation: V62/12607 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 SN65HVD09-EP 9 channel RS-422/ RS-485 transceiver 1.2.2 Case outline(
6、s). The case outlines are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 56 JEDEC MO-153 Plastic small outline 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Ho
7、t solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/12607 REV PAGE 3 1.3 Absolute maximum r
8、atings. 1/ Supply voltage range, (VCC) . -0.3 V to 6.0 V 2/ Bus voltage range -10 V to 15 V Data I/O and control (A side) voltage range . -0.3 V to VCC+ 0.5 V Receiver output current (IO) . 40 mA Electrostatic discharge: B side and GND, ESD HBM 12 kV B side and GND, ESD MM 400 V All terminals, ESD H
9、BM 4 kV All terminals, ESD MM 400 V Continuous total power dissipation . Internally limited 3/ Dissipation ratings Package TA 25C Operating factor 4/ above TA= 25C TA= 70C Power rating TA= 70C Power rating Case X 2500 mW 20 mW/C 1600 mW 1300 mW Thermal characteristics Typical Unit Junction to ambien
10、t thermal resistance (JA) 50 C/W Junction to case (top) thermal resistance (JA) 27 Thermal shutdown temperature (TSD) 165 C 1.4 Recommended operating conditions. Supply voltage, (VCC) . 4.75 V to 5.25 V Minimum high level input voltage, (VIH) (except nB+, nB-) 5/ 2.0 V Maximum low level input voltag
11、e, (VIL) (except nB+, nB-) 5/ . 0.8 V Voltage at any bus terminal, (VO, VI, VIC) (separately or common mode) (nB+ or nB-) - 7.0 V to 12.0 V Output current: Driver -60 mA to 60 mA Receiver -8 mA to 8 mA Operating free air temperature, (TA) . -40C to 85C 2. APPLICABLE DOCUMENTS JEDEC SOLID STATE TECHN
12、OLOGY ASSOCIATION (JEDEC) JEP95 Registered and Standard Outlines for Semiconductor Devices (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201.) 1/ Stresses beyond those liste
13、d under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute maximum rated condi
14、tions for extended periods may affect device reliability. 2/ All voltage values are with respect to the GND terminals. 3/ The maximum operating junction temperature is internally limited. Use the Dissipation Rating Table to operate below this temperature. 4/ This is inverse of the junction to ambien
15、t temperature when board mounted and with no air flow. 5/ n = 1 9. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/12607 REV PAGE 4 3. REQUIREMENTS 3.1 Marking. Parts shall
16、be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and wi
17、th items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physic
18、al dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Terminal function. The terminal function shall be as shown in figure 3. 3.5.4 L
19、ogic diagram. The logic diagram shall be as shown in figure 4. 3.5.5 Driver test circuit, RS-422 and RS-485 loading. The driver test circuit, RS-422 and RS-485 loading shall be as shown in figure 5. 3.5.6 Driver test circuit, pull-up and pull down loading. The driver test circuit, pull-up and pull-d
20、own loading shall be as shown in figure 6. 3.5.7 Driver delay and transition time test waveforms. The Driver delay and transition time test waveforms shall be as shown in figure 7. 3.5.8 Receiver propagation delay and transition time test circuit. The receiver propagation delay and transition time t
21、est circuit shall be as shown in figure 8. 3.5.9 Receiver delay and transition time waveforms. The receiver delay and transition time waveforms shall be as shown in figure 9. 3.5.10 Driver enable and disable time test circuit. The driver enable and disable time test circuit shall be as shown in figu
22、re 10. 3.5.11 Driver enable time waveforms. The driver enable time waveforms shall be as shown in figure 11. 3.5.12 Receiver enable and disable time test circuit. The receiver enable and disable time test circuit shall be as shown in figure 12. 3.5.13 Receiver enable and disable time waveforms. The
23、receiver enable and disable time waveforms shall be as shown in figure 13. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/12607 REV PAGE 5 TABLE I. Electrical performance c
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