DLA DSCC-VID-V62 12606 REV A-2012 MICROCIRCUIT LINEAR DUAL HIGH SPEED DIFFERENTIAL LINE DRIVER MONOLITHIC SILICON.pdf
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1、 REVISIONSLTR DESCRIPTION DATE APPROVEDPrepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY RICK OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Original date of drawing YY-MM-DD CHECKED BY
2、RAJESH PITHADIA TITLE MICROCIRCUIT, LINEAR, DUAL, HIGH SPEED DIFFERENTIAL LINE DRIVER, MONOLITHIC SILICON 12-01-04 APPROVED BY CHARLES F. SAFFLE SIZE A CODE IDENT. NO. 16236 DWG NO. V62/12606 REV PAGE 1 OF 12 AMSC N/A 5962-V013-12 Provided by IHSNot for ResaleNo reproduction or networking permitted
3、without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/12606 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance dual high speed differential line driver microcircuit, with an operating temperature ra
4、nge of -40C to +85C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/12606 - 01 X E Drawing Device type Case
5、 outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 uA9638C-EP Dual high speed differential line driver 1.2.2 Case outline(s). The case outline(s) are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package sty
6、le X 8 MS-012-AA Plastic small outline1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish designator Material A Hot solder dip B Tin-lead plateC Gold plateD PalladiumE Gold flash palladium Z Other 1.3 Absolute maximum rat
7、ings. 1/ Supply voltage range (VCC) . -0.5 V to 7 V 2/ Input voltage range -0.5 V to 7 V Continuous total power dissipation (PD) . See 1.5 dissipation rating table Lead temperature 1.6 mm (1/16 inch) from 10 seconds . 260C Storage temperature range (TSTG) -65C to +150C _ 1/ Stresses beyond those lis
8、ted under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated cond
9、itions for extended periods may affect device reliability. 2/ Voltage values except differential output voltages (VOD) are with respect to network GND. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE I
10、DENT NO. 16236 DWG NO. V62/12606 REV PAGE 3 1.4 Recommended operating conditions. 3/ Supply voltage range (VCC) . 4.75 V to 5.25 V High level input voltage (VIH) . 2 V minimum Low level input voltage (VIL) 0.8 V maximum High level output current (IOH) . -50 mA maximum Low level output current (IOL)
11、50 mA maximum Operating free-air temperature range (TA) . -40C to +85C 1.5 Dissipation ratings. Package Power rating TA= 25C Derating factor TA 70C Power rating TA= 85C Case X 725 mW 5.8 mW/C 377 mW 1.6 Thermal characteristics. Thermal metric Symbol Case X Unit Thermal resistance, junction-to-ambien
12、t 4/ JA114.3 C/W Thermal resistance, junction-to-case JC59.1 C/W Thermal resistance, junction-to-board 5/ JB55.3 C/W Characterization parameter, junction-to-top 6/ JT12.7 C/W Characterization parameter, junction-to-board 7/ JB54.7 C/W 3/ Use of this product beyond the manufacturers design rules or s
13、tated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. 4/ The thermal resistance, junction-to-ambient under natural convection is obtained in a simulation on a JEDEC standard, high-K board, as
14、 specified in JESD51-7, in an environment described in JESD51-2a. 5/ The thermal resistance, junction-to-board is obtained by simulating in an environment with a ring cold plate fixture to control the printed circuit board (PCB) temperature, as described in JESD51-8. 6/ Characterization parameter, j
15、unction-to-top (JT) estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining JA, using a procedure described in JESD51-2a (sections 6 and 7). 7/ Characterization parameter, junction-to-board (JB) estimates the junction temperature of a d
16、evice in a real system and is extracted from the simulation data for obtaining JA, using a procedure described in JESD51-2a (sections 6 and 7). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO.
17、 16236 DWG NO. V62/12606 REV PAGE 4 2. APPLICABLE DOCUMENTS JEDEC Solid State Technology Association JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices EIA/JESD51-2a Integrated Circuits Thermal Test Method Environment Conditions Natural Convection (Still Air) EIA/JESD51-7 High E
18、ffective Thermal Conductivity Test Board for Leaded Surface Mount Packages EIA/JESD51-8 Integrated Circuits Thermal Test Method Environment Conditions Junction-to-Board EIA-422 Electrical Characteristics of Balanced Voltage Digital Interface Circuits. (Applications for copies should be addressed to
19、the JEDEC Office, 3103 North 10th Street, Suite 240-S, Arlington, VA 22201-2107 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or
20、logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performan
21、ce characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal
22、 connections. The terminal connections shall be as shown in figure 2. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/12606 REV PAGE 5 TABLE I. Electrical performance charac
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