BS IEC 62528-2007 Standard testability method for embedded core-based integrated circuits《嵌入式基于芯片的集成电路的标准可试性方法》.pdf
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1、BRITISH STANDARDBS IEC 62528:2007Standard Testability Method for Embedded Core-based Integrated CircuitsICS 31.200g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43
2、g55g3g47g36g58BS IEC 62528:2007This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 December 2007 BSI 2007ISBN 978 0 580 59318 5National forewordThis British Standard is the UK implementation of IEC 62528:2007.The UK participation in its prepar
3、ation was entrusted to Technical Committee GEL/93, Design automation.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct applic
4、ation.Compliance with a British Standard cannot confer immunity from legal obligations.Amendments issued since publicationAmd. No. Date CommentsIEC 62528Edition 1.0 2007-11INTERNATIONAL STANDARD Standard Testability Method for Embedded Core-based Integrated Circuits IEEE 1500BS IEC 62528:2007IEE 150
5、0-20051. Overview 61.1 Scope.171.2 Purpose172. Normative references173. Definitions, acronyms, and abbreviations.183.1 Definitions 183.2 Acronyms and abbreviations 134. Structure of this standard 144.1 Specifications144.2 Descriptions . 155. Introduction and motivations of two compliance levels 156.
6、 Overview of the IEEE 1500 scalable hardware architecture . 166.1 Wrapper serial port (WSP) 166.2 Wrapper parallel port (WPP) . 166.3 Wrapper instruction register (WIR). 176.4 Wrapper bypass register (WBY) 176.5 Wrapper boundary register (WBR) 177. WIR instructions 187.1 Introduction 187.2 Response
7、of the wrapper circuitry to instructions . 187.3 Wrapper instruction rules and naming convention 207.4 WS_BYPASS Instruction 217.5 WS_EXTEST instruction 227.6 WP_EXTEST instruction 247.7 Wx_EXTEST instruction. 267.8 WS_SAFE instruction 277.9 WS_PRELOAD instruction. 297.10 WP_PRELOAD instruction. 297
8、.11 WS_CLAMP instruction 317.12 WS_INTEST_RING instruction 337.13 WS_INTEST_SCAN instruction. 347.14 Wx_INTEST instruction 378. Wrapper serial port (WSP) 388.1 WSP terminals . 399. Wrapper parallel port (WPP) . 409.1 WPP terminals . 4010. Wrapper instruction register (WIR). 4010.1 WIR configuration
9、and DR selection. 4010.2 WIR design 4110.3 WIR operation 4411. Wrapper bypass register (WBY) 4711.1 WBY register configuration and selection. 47CONTENTSIEE Introduction . 4BS IEC 62528:2007IEE 1500-2005 2 11.3 WBY operation 4812. Wrapper boundary register (WBR) 4912.1 WBR structure and operation 511
10、2.2 WBR cell structure and operation 5212.3 WBR operation events . 5312.4 WBR operation modes. 5612.5 Parallel access to the WBR 5712.6 WBR cell naming. 6012.7 WBR cell examples . 6112.8 IEEE 1500 WBR example . 6513. Wrapper states 6813.1 Wrapper Disabled and Wrapper Enabled states 6814. WSP timing
11、diagram.6914.1 Specifications. 6914.2 Description. 7014.3 Synchronous reset timing. 7415. WSP configurations for IEEE 1500 system chips . 7515.1 Connecting multiple WSPs 7516. Plug-and-play (PnP). 7816.1 Background and definition. 7816.2 PnP aspects of standard instructions 7916.3 PnP limitations on
12、 protocols 8016.4 Non-PnP in IEEE Std 1500 8017. Compliance definitions common to wrapped and unwrapped cores . 8017.1 General rules 8017.2 Per-terminal rules. 8217.3 Test pattern information rules 8318. Compliance definitions specific to unwrapped cores 8618.1 General rules 8618.2 Per-terminal rule
13、s. 8718.3 Additional test information rules . 8719. Compliance definitions specific to wrapped cores 8819.1 General rules 8819.2 Per-terminal rules. 8919.3 Wrapper protocol information rules 8920. IEEE 1500 application . 9020.1 CTL (IEEE P1450.6) overview . 9020.2 IEEE 1500 examples 91Annex A (norma
14、tive) Bubble diagram definition 107Annex B (informative) WBR cell examples 109Annex C (informative) Relationship of IEEE Std 1500 to IEEE Std 1149.1 11811.2 WBY design 47Annex D (informative) List of participants. 121BS IEC 62528:2007IEE 1500-2005 3 IEEE Std 1500 is a scalable standard architecture
15、for enabling test reuse and integration for embedded coresand associated circuitry. It foregoes addressing analog circuits and focuses on facilitating efficient test ofdigital aspects of systems on chip (SoCs). IEEE Std 1500 has serial and parallel test access mechanisms(TAMs) and a rich set of inst
16、ructions suitable for testing cores, SoC interconnect, and circuitry. In addition,IEEE Std 1500 defines features that enable core isolation and protection. IEEE Std 1500 will reduce test costthrough improved automation, promote good design-for-test (DFT) technique, and improve test qualitythrough im
17、proved access.Core test language (CTL) is the official mechanism for describing IEEE 1500 wrappers and test data associ-ated with cores. CTL is defined in IEEE P1450.6 aand was originally begun as part of the development ofIEEE Std 1500. IEEE Std 1500 was broadly influenced by the past work of the I
18、EEE Std 1149.1 Working Group and hasseveral members from that group. IEEE Std 1149.1 and IEEE Std 1500 have similar goals at different levelsof integration. IEEE Std 1149.1 describes a wrapper architecture and access mechanism designed for thepurpose of testing components of a board whereas IEEE Std
19、 1500 has a similar structure targeted towardstesting cores in an SoC.IEEE Std 1500 has been a continuous effort for its participants due to the goal of resolving the needs of rec-onciling and accommodating disparate test strategies and motives. The greatest effort has been put into sup-porting as m
20、any requirements as possible while still producing a cohesive and consistent standard.Objective of the IEEE 1500 effortThe Embedded Core Test Working Group was approved in 1997 with the charter to develop a standard testmethod for integrated circuits (ICs) containing embedded cores, i.e., reusable m
21、egacells. That method wouldbe independent of the underlying functionality of the IC or its individual embedded cores. The method willcreate the necessary testability requirements for detection and diagnosis of such ICs, while allowing for easeof interoperability of cores originated from distinct sou
22、rces. This method will be usable for all classes of dig-ital cores including hierarchical ones (subclause 15.1 discusses hierarchical core-wrapper configurations).In order to satisfy that charter, the Embedded Core Test Working Group was organized into several taskforces:Core Test LanguageScalable A
23、rchitectureCompliance Definition/Information ModelTerminology/GlossaryEditionMergeable Cores TestBenchmarkingIndustry for output wrapper cells, the cells input, which is connected to a core output. NOTESee CFI pin in Figure 16.3.1.6 cell functional output (CFO): For input wrapper cells, the cells ou
24、tput, which is connected to a coreinput; for output wrapper cells, the cells output, which is connected to a wrapper functional output (WFO). NOTESee CFO pin in Figure 16.3.1.7 cell test input (CTI): A wrapper boundary register (WBR) cells test data input.3.1.8 cell test output (CTO): A wrapper boun
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