BS EN 62421-2007 Electronics assembly technology Electronic modules《电子组装技术 电子模块》.pdf
《BS EN 62421-2007 Electronics assembly technology Electronic modules《电子组装技术 电子模块》.pdf》由会员分享,可在线阅读,更多相关《BS EN 62421-2007 Electronics assembly technology Electronic modules《电子组装技术 电子模块》.pdf(20页珍藏版)》请在麦多课文档分享上搜索。
1、BRITISH STANDARDBS EN 62421:2007Electronics assembly technology Electronic modules The European Standard EN 62421:2007 has the status of a British StandardICS 31.190g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g
2、48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN 62421:2007This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 December 2007 BSI 2007ISBN 978 0 580 55762 0National forewordThis British Standard is the UK implementation of
3、 EN 62421:2007. It is identical to IEC 62421:2007.The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport t
4、o include all the necessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from legal obligations.Amendments issued since publicationAmd. No. Date CommentsEUROPEAN STANDARD EN 62421 NORME EUROPENNE EUROPISCHE NORM
5、 October 2007 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2007 CENELEC - All rights of exploitation in any form and by any m
6、eans reserved worldwide for CENELEC members. Ref. No. EN 62421:2007 E ICS 31.190 English version Electronics assembly technology - Electronic modules (IEC 62421:2007) Techniques dassemblage des composants lectroniques - Modules lectroniques (CEI 62421:2007) Montageverfahren fr elektronische Baugrupp
7、en - Elektronikmodule (IEC 62421:2007) This European Standard was approved by CENELEC on 2007-10-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration
8、. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by transla
9、tion under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finl
10、and, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Foreword The text of document 91/689/FDIS, future edition 1 of IEC 62421, p
11、repared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62421 on 2007-10-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national sta
12、ndard or by endorsement (dop) 2008-07-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2010-10-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 62421:2007 was approved by CENELEC as a European Stan
13、dard without any modification. _ EN 62421:2007 2 CONTENTS 1 Scope and object5 2 Normative references .5 3 Terms and definitions .6 4 Business model and interface between supplier and user .6 4.1 Business model (see Figure 1 and Figure 2)6 4.1.1 General .6 4.1.2 E-type business model 7 4.1.3 M-type b
14、usiness model8 4.1.4 F-type business model.8 4.2 S-U interface (see Figure 1) 8 4.2.1 S-U interface 1 8 4.2.2 S-U interface2 .8 4.2.3 S-U interface3 .8 4.3 Standardization areas .8 5 Preferred ratings 9 5.1 General .9 5.2 Preferred operating temperature range10 5.3 Preferred rated voltage10 6 Tests
15、and measuring methods10 6.1 Standard atmospheric conditions.10 6.1.1 Standard atmospheric conditions for testing 10 6.1.2 Referee conditions 10 6.1.3 Reference conditions.11 6.2 Electrical performance tests 11 6.2.1 General .11 6.2.2 Protection of electronic modules and test equipment .11 6.2.3 Accu
16、racy of measurement .11 6.3 Mechanical performance tests .12 6.3.1 Robustness of terminations and integral mounting devices 12 6.3.2 Resistance to soldering heat .13 6.3.3 Solderability 13 6.3.4 Shock 13 6.3.5 Vibration (sinusoidal).13 6.3.6 Resistance to solvents.14 6.4 Climatic performance tests 1
17、4 6.4.1 Dry heat 14 6.4.2 Cold 14 6.4.3 Damp heat, steady state15 6.4.4 Change of temperature15 EN 62421:2007 3 Annex ZA (normative) Normative references to international publications with their corresponding European publications16Figure 1 S-U interfaces in each business model.7 Figure 2 Standardiz
18、ation areas in M-type and F-type business models 9 Table 1 Preferred temperatures to be selected for temperature ranges (C).10 Table 2 Referee conditions 11 Table 3 Application 13 EN 62421:2007 4 ELECTRONICS ASSEMBLY TECHNOLOGY ELECTRONIC MODULES 1 Scope and object This International Standard provid
19、es a generic standard of electronic modules on which their sectional standards are based. This standard provides a definition, business model, interface between the trading partners, and related areas of standardization of electronic modules. In addition a generic set of test method is provided. 2 N
20、ormative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068 (all parts), Enviro
21、nmental testing IEC 60068-1:1988, Environmental testing Part 1: General and guidance IEC 60068-2-1: Environmental Testing Part 2-1: Tests Test A: Cold IEC 60068-2-2: Environmental testing Part 2-2: Tests Tests B: Dry heat IEC 60068-2-6: Environmental testing Part 2-6: Tests Test Fc: Vibration (sinus
22、oidal) IEC 60068-2-14: Environmental testing Part 2-14: Tests Test N: Change of temperature IEC 60068-2-20: Environmental testing Part 2-20: Tests Test T: Soldering IEC 60068-2-21: Environmental testing Part 2-21: Tests Test U: Robustness of terminations and integral mounting devices IEC 60068-2-27:
23、 Environmental testing Part 2-27: Tests Test Ea and guidance: Shock IEC 60068-2-45: Environmental testing Part 2-45: Tests Test XA and guidance: Immersion in cleaning solvents IEC 60068-2-58: Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of
24、 metallization and to soldering heat of surface mounting devices (SMD) IEC 60068-2-78: Environmental testing Part 2-78: Tests Test Cab: Damp heat, steady state ISO 3: Preferred numbers Series of preferred numbers EN 62421:2007 5 3 Terms and definitions For the purposes of this document, the terms an
- 1.请仔细阅读文档,确保文档完整性,对于不预览、不比对内容而直接下载带来的问题本站不予受理。
- 2.下载的文档,不会出现我们的网址水印。
- 3、该文档所得收入(下载+内容+预览)归上传者、原创作者;如果您是本文档原作者,请点此认领!既往收益都归您。
下载文档到电脑,查找使用更方便
10000 积分 0人已下载
下载 | 加入VIP,交流精品资源 |
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- BSEN624212007ELECTRONICSASSEMBLYTECHNOLOGYELECTRONICMODULES 电子 组装 技术 模块 PDF

链接地址:http://www.mydoc123.com/p-578470.html