BS EN 61189-3-2008 Test methods for electrical materials printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boa.pdf

《BS EN 61189-3-2008 Test methods for electrical materials printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boa.pdf》由会员分享，可在线阅读，更多相关《BS EN 61189-3-2008 Test methods for electrical materials printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boa.pdf（122页珍藏版）》请在麦多课文档分享上搜索。

1、BRITISH STANDARDBS EN 61189-3:2008Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3: Test methods for interconnection structures (printed boards)ICS 31.180g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g5

2、4g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN 61189-3:2008This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 March 2008 BSI 2008ISBN 978 0 580 61279 4National forew

3、ordThis British Standard is the UK implementation of EN 61189-3:2008. It is identical to IEC 61189-3:2007. It supersedes BS EN 61189-3:1997 which is withdrawn. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology.A list of organizations

4、 represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from legal obligations.Amend

5、ments/corrigenda issued since publicationDate CommentsEUROPEAN STANDARD EN 61189-3 NORME EUROPENNE EUROPISCHE NORM January 2008 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Sec

6、retariat: rue de Stassart 35, B - 1050 Brussels 2008 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61189-3:2008 E ICS 31.180 Supersedes EN 61189-3:1997 + A1:1999English version Test methods for electrical materials, printed boar

7、ds and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:2007) Mthodes dessai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles - Partie 3: Mthodes dessai des structure

8、s dinterconnexion (cartes imprimes) (CEI 61189-3:2007) Prfverfahren fr Elektromaterialien, Leiterplatten und andere Verbindungs-strukturen und Baugruppen - Teil 3: Prfverfahren fr Verbindungs-strukturen (Leiterplatten) (IEC 61189-3:2007) This European Standard was approved by CENELEC on 2007-12-01.

9、CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained

10、on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central S

11、ecretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta,

12、 the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Foreword The text of document 91/698/FDIS, future edition 2 of IEC 61189-3, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vo

13、te and was approved by CENELEC as EN 61189-3 on 2007-12-01. This European Standard supersedes EN 61189-3:1997 + A1:1999. The major technical changes with regard to EN 61189-3:1997 + A1:1999 concern the addition of 25 new tests, as follows: 6 V: Visual test methods: 3V01, 3V02 and 3V03; 7 D: Dimensio

14、nal test methods: 3D03; 8 C: Chemical test methods: 3C02, 3C13 and 3C14; 9 M: Mechanical test methods: 3M01, 3M03, 3M04, 3M07 and 3M09; 10 E: Electrical test methods: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 and 3E18; 11 N: Environmental test methods: 3N03, 3N07 and 3N12; 12 X: Miscellaneous t

15、est methods: 3X01. EN 61189-3:2007 also includes the deletion of Annex B: Conversion table, as the referred documents have been withdrawn. Should anyone wish to consult such information, they should refer to EN 61189-3:1997. The new general title of EN 61189 series is Test methods for electrical mat

16、erials, printed boards and other interconnection structures and assemblies. Titles of existing standards in this series will be updated at the time of revision. This standard should be used in conjunction with the following parts: Part 1: General test methods and methodology Part 2: Test methods for

17、 materials for interconnection structures Part 5: Test methods for printed board assemblies Part 6: Test methods for materials used in manufacturing electronic assemblies It should also be read in conjunction with the series EN 60068, Environmental testing. The following dates were fixed: latest dat

18、e by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2008-09-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2010-12-01 Annex ZA has been added by CENELEC. _ Endorsement no

19、tice The text of the International Standard IEC 61189-3:2007 was approved by CENELEC as a European Standard without any modification. _ 2 EN 61189-3:2008CONTENTS 1 2 3 4 5 6 7 8 9 10 11 12 3 EN 61189-3:2008Annex ZA (normative) Normative references to international publications with their correspondi

20、ng European publications.118INTRODUCTION.5 Scope and object6 Normative references6 Accuracy, precision and resolution 7 Catalogue of approved test methods .10 P: Preparation/conditioning test methods 10 V: Visual test methods 10 D: Dimensional test methods 13 C: Chemical test methods .16 M: Mechanic

21、al test methods29 E: Electrical test methods .47 N: Environmental test methods .74 X: Miscellaneous test methods92 Annex A (informative) Worked examples.116 Figure 1 Glow wire .18 Figure 2 Test apparatus .19 Figure 3a Horizontal specimen Flame applied to surface23 Figure 3b Horizontal specimen Flame

22、 applied to edge .23 Figure 3c Vertical specimen Lower edge horizontal Flame applied to edge 24 Figure 3d Vertical specimen Lower edge horizontal Flame applied to surface 24 Figure 3e Needle burner test Side views of test board and burner 25 Figure 3 Needle burner test 25 Figure 4 Flux type classifi

23、cation by copper mirror test .29 Figure 5a Hold down clamping system31 Figure 5 Copper foil for peel test 32 Figure 5b Single load mode31 Figure 5c Multiple load mode31 Figure 5d Keyhole hold down fixture .32 Figure 6 Bow35 Figure 7 Twist 35 Figure 8 Test set-up for bow measurement.36 Figure 9 Speci

24、men set-up for twist measurement36 Figure 10a Specimen set-up for referee test for twist, raised parallel surfaces 38 Figure 10b Specimen setup for referee test for twist, supporting jacks or blocks .38 Figure 10c Specimen setup for referee test for twist measurements38 Figure 10 Specimen setup for

25、referee test 38 Figure 11 Bow measurement 39 4 EN 61189-3:2008Figure 12 Twist measurement 39 Figure 13 Measuring equipment for peel strength of flexible printed boards.42 Figure 14 Pencil holder.45 Figure 15a Location of test specimens53 Figure 15b Location of test specimens54 Figure 15 Composite te

26、st pattern54 Figure 16 Test specimen artwork60 Figure 17 Fluidized sand bath.63 Figure 18 Possible equipment configuration67 Figure 19 Schematic showing undisturbed interval67 Figure 20 Test wave form example.69 Figure 21 Incident wave voltage showing (2 X) air line delay .69 Figure 22 Details of te

27、st specimen71 Figure 23 Circuit diagram for measurement of contact resistance .72 Figure 24 Keypad contact patterns .74 Figure 25 Plier fixture for thermal shock test, dip soldering .81 Figure 26 Temperature cycles for moisture and insulation resistance test graph91 Figure 27 Insulation resistance c

28、oupon (m).91 Figure 28 Typical comb pattern .92 Figure 29 Suggested test specimen for surface mount features 103 Figure 30 Suggested test specimen for plated through holes.103 Figure 31 Rotary dip solderability test equipment 106 Figure 32 Effectiveness of solder wetting of plated through holes109 F

29、igure 33 Test specimen 115 Table 1 Students “t“ distribution 9 Table 2 Preferred land, hole and wire dimensions.43 Table 3 Resistance values60 Table 4 Chamber temperatures for one cycle85 Table 5 Accelerated ageing and test requirements104 Table 6 Maximum limits of solder bath contaminants 105 INTRO

30、DUCTION IEC 61189 relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. The standard is divided into separate parts, covering information for the designer and the test methodology en

31、gineer or technician. Each part has a specific focus; methods are grouped according to their application and numbered sequentially as they are developed and released. In some instances test methods developed by other TCs (e.g. TC 50) have been reproduced from existing IEC standards in order to provi

32、de the reader with a comprehensive set of test methods. When this situation occurs, it will be noted on the specific test method; if the test method is reproduced with minor revision, those paragraphs that are different are identified. This part of IEC 61189 contains test methods for evaluating prin

33、ted boards and other forms of interconnection structures. The methods are self-contained, with sufficient detail and description so as to achieve uniformity and reproducibility in the procedures and test methodologies. The tests shown in this standard are grouped according to the following principle

34、s: P: preparation/conditioning methods V: visual test methods D: dimensional test methods C: chemical test methods M: mechanical test methods E: electrical test methods N: environmental test methods X: miscellaneous test methods To facilitate reference to the tests, to retain consistency of presenta

35、tion, and to provide for future expansion, each test is identified by a number (assigned sequentially) added to the prefix (group code) letter showing the group to which the test method belongs. The test method numbers have no significance with respect to an eventual test sequence; that responsibili

36、ty rests with the relevant specification that calls for the method being performed. The relevant specification, in most instances, also describes pass/fail criteria. The letter and number combinations are for reference purposes, to be used by the relevant specification. Thus “3D02“ represents the se

37、cond dimensional test method described in this publication. In short, for this example, 3 is the part of IEC standard (61189-3), D is the group of methods, and 02 is the test number. A list of all test methods included in this standard, as well as those under consideration is given in Annex B. This

38、annex will be reissued whenever new tests are introduced. 5 EN 61189-3:2008TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 3: Test methods for interconnection structures (printed boards) 1 Scope This part of IEC 61189 is a catalogue of t

39、est methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated r

40、eferences, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60051 (all parts), Direct acting indicating analogue electrical measuring instruments and their accessories IEC 60068-1: 1988, Environmental testin

41、g Part 1: General and guidance IEC 60068-2-20: 1979, Environmental testing Part 2: Tests Test T: Soldering Amendment 2 (1987) IEC 60068-2-78, Environmental testing Part 2-78: Tests Test Cab: Damp heat, steady state IEC 6016915, Radio-frequency connectors Part 15: RF coaxial connectors with inner dia

42、meter of outer conductor 4,13 mm (0,163 in) with screw coupling Characteristic impedance 50 ohms (Type SMA) IEC 60454-1:1992, Specifications for pressure-sensitive adhesive tapes for electrical purposes Part 1: General requirements IEC 60454-3-1:1998, Pressure-sensitive adhesive tapes for electrical

43、 purposes Part 3: Specifications for individual materials Sheet 1: PVC film tapes with pressure-sensitive adhesive IEC 60584-1, Thermocouples Part 1: reference tables IEC 60695-11-5, Fire hazard testing Part 11-5: Test flames Needle flame test method Apparatus, confirmatory test arrangement and guid

44、ance IEC 61188-1-2:1998, Printed boards and printed board assemblies Design and use Part 1-2: Generic requirements Controlled impedance IEC 61189-1:1997, Test methods for electrical materials, interconnection structures and assemblies Part 1: General test methods and methodology IEC 61190-1-1, Attac

45、hment materials for electronic assembly Part 1-1: Requirements for soldering fluxes for high quality interconnections in electronics assembly IEC 61190-1-2, Attachment materials for electronic assembly Part 1-2: Requirements for 6 EN 61189-3:2008solder pastes for high quality interconnections in ele

46、ctronic assembly IEC 62326-4:1996, Printed boards Part 4: Rigid multilayer printed boards with interlayer connections Sectional specification IEC 62326-4-1:1996, Printed boards Part 4: Rigid multilayer printed boards with interlayer connections Sectional specification Section 1: Capability Detail Sp

47、ecification Performance levels A, B and C ISO 4046:1978, Paper, board, pulp and related terms Vocabulary (withdrawn)1ISO 9002:1994, Quality systems Model for quality assurance in production, installation and servicing (withdrawn) ISO 9453:2006, Soft solder alloys Chemical compositions and forms 3 Ac

48、curacy, precision and resolution Errors and uncertainties are inherent in all measurement processes. The information given below enables valid estimates of the amount of error and uncertainty to be taken into account. Test data serve a number of purposes which include: to monitor a process; to enhan

49、ce confidence in quality conformance; to arbitrate between customer and supplier. In any of these circumstances, it is essential that confidence can be placed upon the test data in terms of: accuracy: calibration of the test instruments and/or system; precision: the repeatability and uncertainty of the measurement; resolut