BS EN 61189-2-719-2016 Test methods for electrical materials printed boards and other interconnection structures and assemblies Test methods for materials for interconnection struc0.pdf

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1、Test methods for electrical materials, printed boards and other interconnection structures and assembliesPart 2-719: Test methods for materials for interconnection structures Relative permittivity and loss tangent(500 MHz to 10 GHz)BS EN 61189-2-719:2016BSI Standards PublicationWB11885_BSI_StandardC

2、ovs_2013_AW.indd 1 15/05/2013 15:06National forewordThis British Standard is the UK implementation of EN 61189-2-719:2016.It is identical to IEC 61189-2-719:2016. The UK participation in its preparation was entrusted to TechnicalCommittee EPL/501, Electronic Assembly Technology.A list of organizatio

3、ns represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2016.Published by BSI Standards Limited 2016ISBN 97

4、8 0 580 88266 1ICS 31.180Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 31 October 2016.Amendments/corrigenda issued since publicationDate Text affectedBRITISH ST

5、ANDARDBS EN 61189-2-719:2016EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 61189-2-719 October 2016 ICS 31.180 English Version Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection

6、structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (IEC 61189-2-719:2016) Mthode dessai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles - Partie 2-719: Mthodes dessai des matriaux pour structures dinterconnexion - Permittivit r

7、elative et tangente de perte (500 MHz 10 GHz) (IEC 61189-2-719:2016) Prfverfahren fr Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-719: Prfverfahren fr Materialien von Verbindungsstrukturen - Relative Permittivitt und Verlustfaktor (500 MHz bis 10 GHz) (I

8、EC 61189-2-719:2016) This European Standard was approved by CENELEC on 2016-08-16. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists

9、 and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation und

10、er the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Es

11、tonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committe

12、e for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC

13、 Members. Ref. No. EN 61189-2-719:2016 E BS EN 61189-2-719:2016EN 61189-2-719:2016 2 European foreword The text of document 91/1366/FDIS, future edition 1 of IEC 61189-2-719, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELE

14、C as EN 61189-2-719:2016. The following dates are fixed: latest date by which the document has to beimplemented at national level bypublication of an identical nationalstandard or by endorsement(dop) 2017-05-16 latest date by which the nationalstandards conflicting with thedocument have to be withdr

15、awn(dow) 2019-08-16 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 6118

16、9-2-719:2016 was approved by CENELEC as a European Standard without any modification. BS EN 61189-2-719:2016EN 61189-2-719:2016 3 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are n

17、ormatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publication has been modified

18、 by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu Publication Year Title EN/HD Year IEC 60194 - Printed board design, manufacture and assembly

19、 - Terms and definitions - - BS EN 61189-2-719:2016 2 IEC 61189-2-719:2016 IEC 2016 CONTENTS FOREWORD. 4 1 Scope 6 2 Normative references 6 3 Terms and definitions 6 4 Test methods. 6 4.1 Test specimens . 6 4.1.1 General . 6 4.1.2 Size . 6 4.1.3 Thickness of dielectric 6 4.1.4 Thickness of copper fo

20、il . 6 4.2 Test set 7 4.3 Test fixture 9 4.4 Test equipment . 11 4.5 Procedure . 11 4.5.1 Measurements . 11 4.5.2 Calculations . 12 5 Report . 14 6 Additional information 14 6.1 Accuracy . 14 6.2 Additional information concerning fixtures and results 14 Annex A (informative) Example of test fixture

21、and test results . 15 A.1 Dimension example of a test fixture . 15 A.2 Example of test results 19 Figure 1 One side of board A . 7 Figure 2 Another side of board A 7 Figure 3 Cross section between X1 and X2 of board A 8 Figure 4 Cross section between Y1 and Y2 of board A 8 Figure 5 One side of board

22、 B . 8 Figure 6 Another side of board B 9 Figure 7 Cross-section between X1 and X2 of board B 9 Figure 8 Cross section between Y1 and Y2 of board B 9 Figure 9 Top view of test fixture . 10 Figure 10 Horizontal cross section of test fixture with test set . 10 Figure 11 Side view of test fixture 10 Fi

23、gure 12 Vertical cross-section of test fixture with test set . 11 Figure 13 Example of VNA raw data . 12 Figure 14 Envelopes of raw data from VNA measurement . 14 Figure A.1 Parts of test fixture 17 Figure A.2 Construction of parts . 18 Figure A.3 Part for connector attachment . 18 Figure A.4 Attach

24、ment with connector 19 Figure A.5 An example of measured rdata, PTFE CCL . 19 BS EN 61189-2-719:2016IEC 61189-2-719:2016 IEC 2016 3 Figure A.6 An example of measured tan data, PTFE CCL 20 BS EN 61189-2-719:2016 4 IEC 61189-2-719:2016 IEC 2016 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ TEST METHODS

25、FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 2-719: Test methods for materials for interconnection structures Relative permittivity and loss tangent (500 MHz to 10 GHz) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide

26、 organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activi

27、ties, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject d

28、ealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determin

29、ed by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committee

30、s. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which the

31、y are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication a

32、nd the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not resp

33、onsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical co

34、mmittees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publica

35、tions. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of pa

36、tent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61189-2-719 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting

37、91/1366/FDIS 91/1380/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. BS EN 61189-2-719:2016IEC 61189-2-719:2016 IEC 2016 5 A li

38、st of all parts in the IEC 61189 series, published under the general title Test methods for electrical materials, printed boards and other interconnection structures and assemblies, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged

39、 until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this pu

40、blication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. BS EN 61189-2-719:2016 6 IEC 61189-2-719:2016 IEC 2016 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD

41、S AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 2-719: Test methods for materials for interconnection structures Relative permittivity and loss tangent (500 MHz to 10 GHz) 1 Scope This part of IEC 61189 specifies a test method of relative permittivity and loss tangent of printed board and

42、 assembly materials, expected to be determined 2 to 10 of relative permittivity and 0,001 to 0,050 of loss tangent at 500 MHz to 10 GHz. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dat

43、ed references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions 3 Terms and definitions For the purposes of this document, the term

44、s and definitions given in IEC 60194 apply. 4 Test methods 4.1 Test specimens 4.1.1 General The requirements with respect to test specimens are as follows. a) Specimens shall be copper clad laminate. b) Specimens shall be cut not less than 25 mm from the edge of the sheet. c) A minimum of four speci

45、mens shall be tested. 4.1.2 Size The size of each specimen shall be (200 0,5) (50 1) mm. 4.1.3 Thickness of dielectric The dielectric thickness of each specimen shall be 0,6 mm to 1,6 mm. Typically 0,8 mm is suitable. 4.1.4 Thickness of copper foil The copper foil thickness of each specimen should b

46、e 0,010 mm to 0,040 mm. BS EN 61189-2-719:2016IEC 61189-2-719:2016 IEC 2016 7 4.2 Test set The setup of the test shall be as follows. a) The test set consists of two boards. Board A shall be a board with a conductive line on one side and with a copper foil on another side. The width of conductive li

47、ne shall be 0,9 mm 0,2 mm. Board B shall be a board without copper foil on one side and with a copper foil on another side. These boards shall be shown in Figure 1, Figure 2, Figure 3, Figure 4, Figure 5, Figure 6, Figure 7 and Figure 8. b) Board A and board B are produced from test specimens. Coppe

48、r foil on copper clad laminate shall be etched for the test set design. c) After etching, the test set shall be etched laminate. d) The test set shall be dried 1 h in the oven with 105 C 2 C, and kept 96 h in 20 C /65 %RH. Key WL is the width of the conductor line, in m WB is the width of the test v

49、ehicle, in m Figure 1 One side of board A Key L is the length of the test vehicle, in m WB is the width of the test vehicle, in m Figure 2 Another side of board A IEC L WBWLY1 Y2 X1 X2 IEC L WBBS EN 61189-2-719:2016 8 IEC 61189-2-719:2016 IEC 2016 Key WL is the width of the conductor line, in m tL is the thickness of the conductor line, in m tB is the thickness of the test vehicle, in m Figure 3 Cross section between X1 and