BS EN 61189-2-2006 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structu.pdf
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1、 g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58other interconnection structures and assemblies Part 2: Test methods for materials for interconnect
2、ion structuresThe European Standard EN 61189-2:2006 has the status of a British StandardICS 31.180Test methods for electrical materials, printed boards and BRITISH STANDARDBS EN 61189-2:2006BS EN 61189-2:2006This British Standard was published under the authority of the Standards Policy and Strategy
3、 Committee on 30 November 2006 BSI 2006ISBN 0 580 49650 3Amendments issued since publicationAmd. No. Date CommentsThis publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard cannot conf
4、er immunity from legal obligations.National forewordThis British Standard was published by BSI. It is the UK implementation of EN 61189-2:2006. It is identical with IEC 61189-2:2006. It supersedes BS EN 61189-2:1997, which will be withdrawn on 1 September 2009.The UK participation in its preparation
5、 was entrusted to Technical Committee EPL/501, Electronic assembly technology.A list of organizations represented on EPL/501 can be obtained on request to its secretary.EUROPEAN STANDARD EN 61189-2 NORME EUROPENNE EUROPISCHE NORM September 2006 CENELEC European Committee for Electrotechnical Standar
6、dization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61189-2:2006
7、 E ICS 31.180 Supersedes EN 61189-2:1997 + A1:2000English version Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006) Mthodes dessais pour les matriaux lectrique
8、s, les cartes imprimes et autres structures dinterconnexion et ensembles Partie 2: Mthodes dessai des matriaux pour structures dinterconnexion (CEI 61189-2:2006) Prfverfahren fr Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen Teil 2: Prfverfahren fr Materialien fr V
9、erbindungsstrukturen (IEC 61189-2:2006) This European Standard was approved by CENELEC on 2006-09-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteratio
10、n. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by transl
11、ation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Fran
12、ce, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Foreword The text of document 91/564/FDIS, future edition 2 of IEC 61189-2, prepared
13、 by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61189-2 on 2006-09-01. This European Standard supersedes EN 61189-2:1997 + A1:2000. The significant technical changes with respect to EN 61189-2:1997 + A1:2000 concern the
14、 addition of several new tests in the following categories: - C: Chemical test methods - D: Dimensional test methods - E: Electrical test methods - M: Mechanical test methods - N: Environmental test methods - X: Miscellaneous test methods This standard forms part of a series and should be used in co
15、njunction with other parts in the same series, under the main title Test methods for electrical materials, interconnection structures and assemblies: Part 1: General test methods and methodology Part 2: Test methods for materials for interconnection structures Part 3: Test methods for interconnectio
16、n structures (printed boards) Part 4: Test methods for electronic components assembling characteristics Part 5: Test methods for printed board assemblies Part 6: Test methods for materials used in electronic assemblies It should also be read in conjunction with EN 60068, Environmental testing. The f
17、ollowing dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2007-06-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2009-09-01 Annex ZA has be
18、en added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61189-2:2006 was approved by CENELEC as a European Standard without any modification. _ EN 61189-2:2006 2 3 EN 61189-2:2006 CONTENTS INTRODUCTION . H7 1 Scope . H8 2 Normative references H8 3 Accuracy, precision and
19、 resolution H8 3.1 Accuracy H9 3.2 Precision H9 3.3 Resolution H10 3.4 Report H10 3.5 Students “t“ distribution . H10 3.6 Suggested uncertainty limits . H11 4 Catalogue of approved test methods H12 5 P: Preparation/conditioning test methods . H12 5.1 Test 2P01: Dry heat (under consideration) H12 5.2
20、 Test 2P02: Solder float stress (under consideration) . H12 6 V: Visual test methods. H12 7 D: Dimensional test methods . H12 7.1 Test 2D01: Thickness of base materials and rigid boards H12 8 C: Chemical test methods H14 8.1 Test 2C01: Resistance to sodium hydroxide of base materials H14 8.2 Test 2C
21、02: Gel time of epoxy based prepreg materials H15 8.3 Test 2C03: Resin content of prepreg materials by treated weight H16 8.4 Test 2C04: Volatile content of prepreg materials . H18 8.5 Test 2C05: Blistering during heat shock H20 8.6 Test 2C06: Flammability, vertical burning test for rigid materials
22、. H22 8.7 Test 2C07: Flammability; horizontal burning test for rigid materials . H26 8.8 Test 2C08: Flammability, flex material H29 8.9 Test 2C09: Melting viscosity of prepreg materials . H33 8.10 Test 2C10: Resin content of prepreg materials by sublimation. H35 8.11 Test 2C11: UV blocking character
23、istics of laminates . H37 8.12 Test 2C12: Total halogen content in base materials H38 9 M: Mechanical test methods H42 9.1 Test 2M01: Test method for bow and twist H42 9.2 Test 2M02: Bow/twist after etching and heating. H43 9.3 Test 2M03: Cure factor of base materials by differential scanning calori
24、metry (DSC) or thermomechanical analysis (TMA) H45 9.4 Test 2M04: Twist after heating (under consideration) H46 9.5 Test 2M05: Pull-off strength H46 9.6 Test 2M06: Peel strength after exposure to solvent vapour . H49 9.7 Test 2M07: Peel strength after immersion in solvent . H51 9.8 Test 2M08: Flexur
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