BS EN 61188-7-2017 Printed boards and printed board assemblies Design and use Electronic component zero orientation for CAD library construction《印制电路板和印制电路板组件 设计和使用 CAD文库结构的电子元件零定位.pdf

《BS EN 61188-7-2017 Printed boards and printed board assemblies Design and use Electronic component zero orientation for CAD library construction《印制电路板和印制电路板组件 设计和使用 CAD文库结构的电子元件零定位.pdf》由会员分享，可在线阅读，更多相关《BS EN 61188-7-2017 Printed boards and printed board assemblies Design and use Electronic component zero orientation for CAD library construction《印制电路板和印制电路板组件 设计和使用 CAD文库结构的电子元件零定位.pdf（28页珍藏版）》请在麦多课文档分享上搜索。

1、Printed boards and printed board assemblies Design and usePart 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017)BS EN 61188-7:2017BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM

2、EN 61188-7 June 2017 ICS 31.180 Supersedes EN 61188-7:2009 English Version Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017) Cartes imprimes et cartes imprimes quipes - Conception et utilisatio

3、n - Partie 7: Orientation nulle des composants lectroniques pour llaboration de la bibliothque CAO (IEC 61188-7:2017) Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 7: Nullorientierung elektronischer Bauelemente fr CAD-Bibliotheksaufbau (IEC 61188-7:2017) This European Standar

4、d was approved by CENELEC on 2017-05-15. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning

5、 such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member

6、into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic o

7、f Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardiza

8、tion Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 61188-7:2017

9、 E National forewordThis British Standard is the UK implementation of EN 61188-7:2017. It is identical to IEC 61188-7:2017. It supersedes BS EN 61188-7:2009, which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic Assembly Technology.A list

10、 of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.ISBN 978 0 580 92421 7ICS 31.180Compliance with a British Standard ca

11、nnot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 September 2017.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 61188-7:2017EUROPEAN STANDARD NORME EUROPENNE

12、EUROPISCHE NORM EN 61188-7 June 2017 ICS 31.180 Supersedes EN 61188-7:2009 English Version Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017) Cartes imprimes et cartes imprimes quipes - Concepti

13、on et utilisation - Partie 7: Orientation nulle des composants lectroniques pour llaboration de la bibliothque CAO (IEC 61188-7:2017) Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 7: Nullorientierung elektronischer Bauelemente fr CAD-Bibliotheksaufbau (IEC 61188-7:2017) This

14、European Standard was approved by CENELEC on 2017-05-15. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical refer

15、ences concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a

16、 CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yug

17、oslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechn

18、ical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No.

19、 EN 61188-7:2017 E BS EN 61188-7:2017EN 61188-7:2017 2 European foreword The text of document 91/1382/CDV, future edition 2 of IEC 61188-7, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61188-7:2017. The following

20、 dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2018-02-15 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2020-05-15 This documen

21、t supersedes EN 61188-7:2009. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61188

22、-7:2017 was approved by CENELEC as a European Standard without any modification. BS EN 61188-7:2017EN 61188-7:2017 2 European foreword The text of document 91/1382/CDV, future edition 2 of IEC 61188-7, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel

23、vote and approved by CENELEC as EN 61188-7:2017. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2018-02-15 latest date by which the national standards conflicting with t

24、he document have to be withdrawn (dow) 2020-05-15 This document supersedes EN 61188-7:2009. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights. Endor

25、sement notice The text of the International Standard IEC 61188-7:2017 was approved by CENELEC as a European Standard without any modification. EN 61188-7:2017 3 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following docume

26、nts, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an Internationa

27、l Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu. Publication Year Title EN/HD Year IEC 61188-5 series Printed

28、 boards and printed board assemblies - Design and use EN 61188-5 series BS EN 61188-7:2017This page deliberately left blank 2 IEC 61188-7:2017 IEC 2017 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope 6 2 Normative references 6 3 Terms and definitions 6 4 Basic rules 6 4.1 Common rules. 6 4.2 General

29、basic rules . 6 4.3 Level A basic rule . 7 4.4 Level B basic rule . 7 4.5 File description definition 7 4.6 Component orientations 8 5 Origin point of land pattern 18 5.1 General . 18 5.2 Surface mount components . 18 5.3 Through-hole leaded components . 19 6 Land pattern to footprint comparison . 1

30、9 7 Components with one terminal . 20 7.1 Surface mount components . 20 7.2 Through-hole leaded components . 20 Figure 1 Example of level A orientation concepts . 8 Figure 2 Connector and switch library symbol examples 19 Figure 3 Through-hole components with terminal point of origin orientation . 1

31、9 Figure 4 Circular or square one-terminal component 20 Figure 5 Rectangular or oval one-terminal component . 20 Figure 6 Surface mount components with one lead offset . 20 Table 1 Discrete component land pattern conventions . 9 Table 2 Diode and transistor land pattern conventions . 10 Table 3 Tran

32、sistor and IC land pattern conventions . 11 Table 4 Integrated circuit packages land pattern conventions 12 Table 5 Integrated circuit packages land pattern conventions 14 Table 6 BGA land pattern conventions . 15 Table 7 Resistor array and connector land pattern conventions 16 Table 8 Level A land

33、pattern convention summary . 17 Table 9 Level B land pattern convention summary . 18 2 IEC 61188-7:2017 IEC 2017 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope 6 2 Normative references 6 3 Terms and definitions 6 4 Basic rules 6 4.1 Common rules. 6 4.2 General basic rules . 6 4.3 Level A basic rule

34、. 7 4.4 Level B basic rule . 7 4.5 File description definition 7 4.6 Component orientations 8 5 Origin point of land pattern 18 5.1 General . 18 5.2 Surface mount components . 18 5.3 Through-hole leaded components . 19 6 Land pattern to footprint comparison . 19 7 Components with one terminal . 20 7

35、.1 Surface mount components . 20 7.2 Through-hole leaded components . 20 Figure 1 Example of level A orientation concepts . 8 Figure 2 Connector and switch library symbol examples 19 Figure 3 Through-hole components with terminal point of origin orientation . 19 Figure 4 Circular or square one-termi

36、nal component 20 Figure 5 Rectangular or oval one-terminal component . 20 Figure 6 Surface mount components with one lead offset . 20 Table 1 Discrete component land pattern conventions . 9 Table 2 Diode and transistor land pattern conventions . 10 Table 3 Transistor and IC land pattern conventions

37、. 11 Table 4 Integrated circuit packages land pattern conventions 12 Table 5 Integrated circuit packages land pattern conventions 14 Table 6 BGA land pattern conventions . 15 Table 7 Resistor array and connector land pattern conventions 16 Table 8 Level A land pattern convention summary . 17 Table 9

38、 Level B land pattern convention summary . 18 BS EN 61188-7:2017IEC 61188-7:2017 IEC 2017 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES DESIGN AND USE Part 7: Electronic component zero orientation for CAD library construction FOREWORD 1) The International

39、Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fie

40、lds. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IE

41、C National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardizat

42、ion (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has represent

43、ation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC can

44、not be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publicatio

45、ns. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, ac

46、cess to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including in

47、dividual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upo

48、n, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements

49、of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61188-7 has been prepared by IEC technical committee 91: Electronics assembly technology. This second edition cancels and replaces the first edition published in 2009. This edition constitutes a technical revision. This edition includes the following significant technical changes wit