BS EN 61182-2-2-2012 Printed board assembly products Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication .pdf
《BS EN 61182-2-2-2012 Printed board assembly products Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication .pdf》由会员分享,可在线阅读,更多相关《BS EN 61182-2-2-2012 Printed board assembly products Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication .pdf(48页珍藏版)》请在麦多课文档分享上搜索。
1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationPrinted board assembly products Manufacturing description data and transfer methodologyPart 2-2: Sectional requirements for implementation of printed board fabrication data descr
2、iptionBS EN 61182-2-2:2012National forewordThis British Standard is the UK implementation of EN 61182-2-2:2012. It isidentical to IEC 61182-2-2:2012.The UK participation in its preparation was entrusted to Technical CommitteeEPL/501, Electronic assembly technology title, such as senior designer, or
3、department name, such as purchasing department. Ideally, the ability to import all preferred supplier information from external sources will be available in order to include preferred suppliers in the LogisticHeader element. Below is a sample of the minimum data necessary for a complete LogisticHead
4、er element with optional fields populated. IEC 631/12 BS EN 61182-2-2:2012 12 61182-2-2 IEC:2012 5.4.2.3 HistoryRecord The HistoryRecord is the location of log type information for maintaining revision control of the IEC 61182-2 file for a designs life cycle. This does not mean that the entire histo
5、ry is present in any IEC 61182-2 file. It gives the OWNER a data record, which could be exported to a corporate database. The EDA tool shall create a HistoryRecord for each IEC 61182-2 file by providing a means to enter the HistoryRecord number and the FileRevision fileRevisionID. This data could be
6、 entered by manual manipulation such as using a dynamic dialog box. 5.4.3 Supply chain modifications 5.4.3.1 General A modification is added to the initial IEC 61182-2 file by a member of the supply chain. This modification can be as simple as adding a test coupon or panelizing the board to finding
7、problems with the design and requiring design modification in order to produce a finish board. 5.4.3.2 LogisticHeader update In order to add the ChangeRec to the HistoryRecord, the supply chain may need to update the LogisticHeader with additional information to provide the Role, Enterprise and Pers
8、on data for the supply chain. BS EN 61182-2-2:201261182-2-2 IEC:2012 13 The supplier shall not modify the information associated with any enterprise id other than their own. Updating the LogisticHeader shall create a ChangeRec even if no other data was modified. This will provide the means for the O
9、EM to update their contacts information. There are many methods for getting this information into the file that range from manual manipulation to importing a contacts.xml. Below is a sample of a contacts.xml file. 5.4.3.3 HistoryRecord update The HistoryRecord parent shall remain unchanged by the su
10、pply chains software. It is identified in the example by the use of underlined text. The supply chains software uses the FileRevision to identify the software used to create the updated IEC 61182-2 file. BS EN 61182-2-2:2012 14 61182-2-2 IEC:2012 5.4.4 OEM reviews modifications HistoryRecord update
11、The OEM and their supply chain can use the fileRevisionID to match IEC 61182-2 files to their predecessors. Maintaining consistency in the fileRevisionID field will facilitate the ability to reuse items during the designs lifecycle. 5.5 BOM (board fabrication materials) The BOM layer requirements sh
12、all be in accordance with IEC 61182-2. The following restrictions apply: Bom/BomItemcategory=MATERIAL This is a mandatory requirement for FAB1, FAB2, and FAB3. Table 2 shows the Bom restrictions for board fabrication. BS EN 61182-2-2:201261182-2-2 IEC:2012 15 Table 2 Bom restrictions Content/Functio
13、nMode FunctionModeType mode= FABRICATION level=1 mode= FABRICATION level=2 mode= FABRICATION level=3 Bom/BomItem BomItemType category=MATERIAL category=MATERIAL category=MATERIAL Bom/BomItem/RefDes. RefDesType Per Table 3 Per Table 3 Per Table 3 Bom/BomItem/RefDes/ Tuning TuningType 0 0 0 Bom/BomIte
14、m/RefDes/ Firmware FirmwareType 0 0 0 Bom/BomItem/RefDes/ Firmware/File FileType 0 0 0 Bom/BomItem/RefDes/ Firmware/CachedFirmware CachedFirmware Type 0 0 0 Bom/BomItem/RefDes/ Firmware/FirmwareRef FirmwareRefType 0 0 0 Bom/BomItem/ Characteristics CharacteristicsType category=MATERIAL category=MATE
15、RIAL category=MATERIAL Bom/BomItem/ Characteristics/ Measured MeasuredType IEC 61182-2 1-n 1-n Bom/BomItem/Characteristics/ Ranged RangedType IEC 61182-2 IEC 61182-2 1-n When reference designators are required, as indicated for BomItem, the RefDes shall be in accordance with Table 3. Since the RefDe
16、s element is normally restricted to electronic components, this table has been constructed as a recommended methodology for defining different materials within the Bom. RefDes has a 1-n cardinality requirement. This is still appropriate for FAB1, FAB2, and FAB3. When the RefDes element is instanced,
17、 the attribute name shall be in accordance with Table 3. IEC 61182-2/Bom/BomItem/RefDesname=Table 3 Table 3 Recommended reference designators for printed board material Material type Reference designator Comments Legend ink LEG Soldermask SDM Conductor CND Dielectric base material DBM Dielectric cor
18、e DIC Dielectric prepreg DPP Dielectric adhesive DIA Solder bump SBM Hole fill material HFM Resistive material ERM Capacitive material ECM Other OTH Additional restrictions for BomItem are that the Category attribute shall be listed as MATERIAL. BS EN 61182-2-2:2012 16 61182-2-2 IEC:2012 IEC 61182-2
19、/Bom/BomItemcategory=MATERIAL The Characteristic element also has some restrictions that pertain to FAB2 and FAB3. These relate to the occurrence of the Measured and Ranged elements which become mandatory in certain applications. IEC 61182-2/Bom/BomItem/Characteristiccategory=MATERIAL (same as BomIt
20、em) IEC 61182-2/Bom/BomItem/Characteristic/Measured=1 (for FAB2 and FAB3) IEC 61182-2/Bom/BomItem/Characteristic/Ranged=1 (for FAB3) 5.6 AVL (board material suppliers) The AVL requirements shall be in accordance with IEC 61182-2. The following restrictions apply and are detailed in Table 4: Avl/AvlH
21、eadermodRef=FABRICATION This is an optional requirement for FAB2 and FAB3. Table 4 Avl restrictions Avl/AvlHeader AvlHeaderType modRef= FABRICATION modRef= FABRICATION modRef= FABRICATION Avl/AvlItem AvlItemType 1-1 1-1 1-1 Avl/AvlItem/AvlVmpn AvlVmpnType qualified=FALSE chosen=FALSE qualified=FALSE
22、or TRUE chosen=FALSE or TRUE qualified=FALSE or TRUE chosen=FALSE or TRUE Avl/AvlItem/AvlVmpn/AvlMpn AvlMpnType 0-1 0-1 0-1 Avl/AvlItem/AvlVmpn/AvlVendor AvlVendorType 0-1 0-1 0-1 5.7 Documentation layers 5.7.1 General The documentation layer requirements shall be in accordance with IEC 61182-2. The
23、 following restrictions apply: Ecad/CadData/LayerLayerFunction=DOCUMENTATION Ecad/CadData/Layername=unique layer name recommended consistent with Step name This is a mandatory requirement for FAB1, FAB2 and FAB3. 5.7.2 Documentation layer restrictions The following functions shown in Table 5 are app
24、licable when a documentation layer is identified. BS EN 61182-2-2:201261182-2-2 IEC:2012 17 Table 5 Documentation layer restrictions To facilitate the interpretation, Table 6 provides a reference illustration table of those restrictions shown in their XML path description in Table 5. Table 6 General
- 1.请仔细阅读文档,确保文档完整性,对于不预览、不比对内容而直接下载带来的问题本站不予受理。
- 2.下载的文档,不会出现我们的网址水印。
- 3、该文档所得收入(下载+内容+预览)归上传者、原创作者;如果您是本文档原作者,请点此认领!既往收益都归您。
下载文档到电脑,查找使用更方便
10000 积分 0人已下载
下载 | 加入VIP,交流精品资源 |
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- BSEN61182222012PRINTEDBOARDASSEMBLYPRODUCTSMANUFACTURINGDESCRIPTIONDATAANDTRANSFERMETHODOLOGYSECTIONALREQUIREMENTSFORIMPLEMENTATIONOFPRINTEDBOARDFABRICATIONPDF

链接地址:http://www.mydoc123.com/p-577043.html