BS CECC 90114-1990 Specification for harmonized system of quality assessment for electronic components - Blank detail specification programmable logic arrays (PLA)《电子元器件用质量评估协调体系规范.pdf

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1、BRITISH STANDARD BS CECC 90114:1990 Incorporating Amendment No.1 Specification for Harmonized system ofquality assessment forelectronic components Blankdetail specification Programmable logic arrays (PLA)BSCECC90114:1990 BSI03-2000 ISBN 0 580 35845 3 Amendments issued since publication Amd. No. Date

2、 of issue Comments 8166 March1994 Indicated by a sideline in the marginBSCECC90114:1990 BSI 03-2000 i Contents Page National foreword ii Foreword ii General 1 Scope 1 Related documents 1 Structure of Detail Specifications 1 Units, symbols and terminology 1 Application of Quality Assessment Procedure

3、s 1 2 Operating characteristics 3 3 Identification of the device types 7 4 Test and measurement procedures 7 5 Structural similarity of PLA 9 6 Qualification approval procedures 9 7 Capability approval procedures 9 8 Screening procedures 9 9 Inspection requirements 9 Annex for programming Inside bac

4、k coverBSCECC90114:1990 ii BSI 03-2000 National foreword This BritishStandard has been prepared under the direction of the Electronic Components Standards Policy Committee. It is identical with CENELEC Electronic Components Committee CECC90114:1990 “Harmonized system ofquality assessment for electro

5、nic components. Blank detail specification: Programmable logic arrays (PLA)”. This standard is a harmonized specification within the CECC System. Cross-references. The BritishStandard which implements CECC00100 isBS9000 General requirements for a system for electronic components of assessed quality

6、Part2:1983 Specification for national implementation of CECC basic rules and rules of procedure. The Technical Committee has reviewed the provisions of IEC747, andIEC748 to which reference is made in the text, and has decided that they are acceptable for use in conjunction with this standard. Scope.

7、 This standard lists the ratings, characteristics and inspection requirements which shall be included as mandatory requirements in accordance with BS CECC90100 in any detail specification for these devices. Detail specification layout. The front page of detail specifications released to BS CECC fami

8、ly or blank detail specification will be in accordance with BS9000 Circular Letter No.15. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not o

9、f itself confer immunity from legal obligations. International Standards a Corresponding British Standards IEC617-12:1983 BS3939 Guide for graphical symbols for electrical power, telecommunications and electronics diagrams Part12:1985 Binary logic elements (Identical) IEC68-2-30:1980 BS2011 Environm

10、ental testing Part2.1 Db:1981 Test Db and guidance: Damp heat, cyclic(12+12hour cycle) (Identical) CECC90000:1985 BS CECC90000:1985 Harmonized system of quality assessment for electronic components. Generic specification: Monolithic integrated circuits (Identical) CECC90100:1986 BS CECC90100:1986 Ha

11、rmonized system of quality assessment for electronic components: Sectional specification: Digital monolithic integrated circuits (Identical) a Undated in text. Summary of pages This document comprises a front cover, an inside front cover, pagesi andii, theCECC title page, pageii , pages1 to12, an in

12、side back cover and a backcover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover.CECC90114:1990 ii BSI 03-2000 Foreword The CENELEC Electronic Components Committee (CECC) is composed

13、 of thosemember countries of the European Committee for Electrotechnical Standardization (CENELEC) who wish to take part in a harmonized System forelectronic components of assessed quality. The object of the System is to facilitate international trade by the harmonization of the specifications and q

14、uality assessment procedures for electronic components, and by the grant of an internationally recognized Mark, or Certificate, of Conformity. The components produced under the System are thereby acceptable in all member countries without further testing. This specification has been formally approve

15、d by the CECC, and has been prepared for those countries taking part in the System who wish to issue national harmonized specifications for PROGRAMMABLE LOGIC ARRAYS (PLA). It should be read in conjunction with the current regulations for the CECC System. At the date of printing of this specificatio

16、n the member countries of the CECC are Austria, Belgium, Denmark, Finland, France, Germany, Ireland, Italy, theNetherlands, Norway, Portugal, Spain, Sweden, Switzerland, and theUnitedKingdom, and copies of it can be obtained from the addresses shown on the blue fly-sheet. Preface This blank detail s

17、pecification (BDS) was prepared by CECC WG9 “Integrated circuits”. It is based, wherever possible, on the Publications of the International Electrotechnical Commission and in particular on IEC747: Semiconductor devices Discrete devices and integrated circuits. The text of this BDS was circulated to

18、the CECC for voting in the documents indicated below and was ratified by the President of the CECC for printing as a CECC specification. It is recognized that the layout proposed cannot be applied to all detail specifications based on this document. For instance, it may be preferable to indicate the

19、 limiting values in the form of a table when several similar devices appear in the same detail specification. In accordance with the decision of the CECC Management Committee this specification is published initially in English and French. The German text will follow as soon as it has been prepared.

20、 Documents Date of Voting Report on the Voting CECC(Secretariat)2343 February1989 CECC(Secretariat)2446CECC90114:1990 BSI 03-2000 1 General The following information is given for guidance. Scope This BDS relates to Programmable Logic Arrays (PLA) with irreversible programming in accordance with IEC7

21、48: Semiconductor devices: Integrated Circuits. A PLA is: an integrated circuit with two arrays of programmable combinatorial elements or an integrated circuit with one programmable array and one fixed array of predefined logic. However the Programmable Read Only memories are excluded from the scope

22、. Related documents See2.1 of CECC90100 and2.2 of CECC90000 Structure of Detail Specifications Clause numbering of DS shall be in accordance with that of this document. Units, symbols and terminology See2.3 of CECC90100 and2.3 of CECC90000 Application of Quality Assessment Procedures See3 of CECC901

23、00 and CECC90000.CECC90114:1990 2 BSI 03-2000 Layout of front page of detail specification CECC90114:1990 BSI 03-2000 3 The front page of the DS shall be laid out as shown on the page before. The numbers between square brackets correspond to the following indications which shall be given: Identifica

24、tion of the DS and of the component: Identification of the component and supplementary information: Description of the materials for the package (for example, glass, ceramic, metal, plastic) and information relating to the mounting (welding, soldering), lead material and finish. The package type, th

25、e terminal connections to the inputs, outputs or other important points of the circuit shall be identified. This can be shown by a functional block diagram. Numbering and identification of the terminals. Marking on the device in accordance with the GS (see2.5 of CECC90000). 2 Operating characteristi

26、cs The following characteristics shall apply over the full operating temperature range and the supply voltage range unless otherwise specified. 2.1 General description The following characteristics shall be given if they are not adequately defined in clause1: “Type description” in front page. Techno

27、logy of programmable matrix(ces). Possible particular operating modes. 1 The name of the National Standards Organization under whose authority the DS is published and, if applicable, the organization from whom the DS is available. 2 The CECC Symbol and the CECC number allotted to the DS by the CECC

28、General Secretariat. 3 The number and issue number of the CECC generic or sectional specification as relevant; also national reference if different. 4 If different from the CECC number, the national number of the DS, date of issue and any further information required by the national system, together

29、 with any amendment numbers. 5 Type number, a short description of the type by: function performance, for example variants based on speed, temperature, poweretc. 6 Information on typical construction material and type of construction (silicon, monolithic, bipolar, MOS) For5 and6 the text to be given

30、 in the DS should be suitable for an entry in CECC00200 (QPL) and CECC00300 (Library List). 7 An outline drawing with main dimensions which are of importance for interchangeability, and/or reference to the appropriate national or international document for outlines. Alternatively, this drawing may b

31、e given in an annex to the DS. 8 Quality assessment level(s) 9 Reference data giving information on the most important properties of the component, which allow comparison between the various component types intended for the same, or for similar, applications. The DS shall give a brief description in

32、cluding the following: Structure (number of inputs and outputs) The type of output circuit (for example three state) Essential functions Type of logic Size of array The PLA which are described in this BDS are not re-programmable.CECC90114:1990 4 BSI 03-2000 Electrical compatibility (if appropriate):

33、 it shall be stated whether the integrated circuit is electrically compatible with other particular integrated circuits or families of integrated circuits, or whether special interfaces are required. Block diagram: the block diagram shall be sufficiently detailed to enable the individual functional

34、units within the device to be identified with their main input and output paths and the identification of their external connections (chip enable, address decode.). The function(s) performed by each terminal. A graphical symbol in accordance with IEC617-12 shall be given. Basic programming methods s

35、hall be given. 2.2 Detailed Specification of the function 2.2.1 Function description The logic diagram shall be given. This clause defines the following characteristics matrix size; inputs and outputs; internal logic; combinatorial elements (if applicable); sequential elements (if applicable); feed-

36、back (if applicable); chip select (if applicable); output enable (if applicable); 2.2.2 Programming Detailed programming methods and conditions shall be described in an Annex of the DS. The parameters may be shown as organigrams or equations or programming sequences. The different signal configurati

37、ons and logic levels needed for programming shall be described. Programming may be performed by the manufacturer at customers request. For this purpose the manufacturer shall supply all the necessary information. 2.2.3 Functional Interchangeability Products which differ only in the conditions of pro

38、gramming may be covered by the same DS. These conditions shall be described in the Annex of the DS. After programming to the same function, these products may be considered interchangeable. 2.3 Limiting conditions of use (ratings) Limiting conditions (ratings) are not for inspection purposes. Values

39、 of limiting conditions of use shall be given as follows: Any cautionary statement unique to an individual integrated circuit shall be included, for example: any difference between the limiting conditions applicable to the programming and read operations shall be given. Any interdependence of limiti

40、ng conditions shall be specified. If externally connected elements have an influence on the values of the ratings, the ratings shall be given for the integrated circuit with the specified elements connected, for example heatsinks. If transient overloads are permitted, their magnitude and durations s

41、hall be specified. Where minimum and maximum values differ during programming this shall be stated. The values for the limiting conditions of use, given in the following Table are not related to programming conditions (for informations on programming see Annex to this BDS).CECC90114:1990 BSI 03-2000

42、 5 All voltages are referenced to a reference terminal (GND, etc.), which shall be stated. 2.4 Recommended conditions of use and associated characteristics (In accordance with5.3.8 of CECC90100) Not for inspection purpose. The values shall apply over the full operating temperature range, unless othe

43、rwise specified. Where the stated performance of the circuit varies over the operating temperature range, the values of the input and output voltages and their associated currents shall be stated at25 C and at the extremes of the operating temperature range. Values of current and voltage shall be gi

44、ven for each functionally different type of input and/or output. Special characteristics and timing requirements shall be specified. 2.4.1 Recommended conditions of use All voltages are referenced to a reference terminal (GND, etc.), which shall be stated. 2.4.2 Associated characteristics (if applic

45、able) Characteristics Symbol min. max. Unit Supply voltage range V CC V Input voltages V I V Output voltages V O V Off-state voltage (Note1) V OZ V Output currents (Note1) I O mA Input currents (Note1) I I mA Max. power dissipation (Note1) P Dmax. n.a. W Operating temperature T amband/or T case C St

46、orage temperature T stg C NOTE 1Where appropriate. Characteristics Conditions Symbols min. max. Unit Supply voltage V CC(Note1) V Low level input voltage V IL V High level input voltage V IH V Operating temperature T amband/or T case C Set up and hold times (Note2) t su , t h ns Pulse width (Note2)

47、t W ns Clock frequency (Note2) f max. MHz NOTE 1Where appropriate these values should also be quoted under standby conditions. NOTE 2Where appropriate.CECC90114:1990 6 BSI 03-2000 2.5 Static characteristics (In accordance with5.3.8 of CECC90100) All voltages are referenced to a reference terminal (G

48、ND etc.), which shall be stated. The following shall also be stated where applicable: where certain terminals may function as inputs or as outputs, then information shall be given for bothconditions. Characteristics Conditions (Note4) Symbols min. a max. a Unit Maximum supply current(s) V CCmax. I C

49、C mA High level input voltage (Note5) V IH V Low level input voltage (Note5) V IL V High level output voltage V CCI OHA V OH V Low level output voltage V CCI OLA V OL V High level input or leakage current V CCV IH =V OHB I IH 4A Low level input or leakage current V CCV IL =V OLA I IL 4A High level output current (Note1) V CCV OHB I OH 4A Low level output current (Note1) V CCV OLA I OL mA High level output current (leakage) (Note2) V CCV OHA I OHX 4A Low level output current (leakage)