BS 4584-103 2-1990 Metal-clad base materials for printed wiring boards Special materials used in connection with printed circuits Specification for copper foil for use in the manuf.pdf
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1、BRITISH STANDARD BS4584-103.2: 1990 IEC249-3A: 1976 Metal-clad base materials for printed wiring boards Part 103: Special materials used in connection with printed circuits Section 103.2 Specification for copper foil for use in the manufacture of copper-clad base materialsBS4584-103.2:1990 This Brit
2、ish Standard, having been prepared under the directionof the Electronic Components Standards Policy Committee, was published underthe authority of the BoardofBSI and comes and comesintoeffect on 28February1990 BSI 04-1999 The following BSI references relate to this standard: Committee reference ECL/
3、19 Draft for comment89/23232 DC ISBN 0 580 18190 1 Committees responsible for this British Standard The preparation of this British Standard was entrusted by the Electronic Components Standards Policy Committee (ECL/-) to Technical Committee ECL/19 upon which the following bodies were represented: B
4、ritish Telecommunications plc ERA Technology Ltd. Electrical and Electronic Insulation Association (BEAMA Ltd.) Electronic Components Industry Federation Electronic Engineering Association GAMBICA (BEAMA Ltd.) Institute of Circuit Technology Institute of Metal Finishing Ministry of Defence National
5、Supervising Inspectorate Printed Circuit Association Telecommunication Engineering and Manufacturing Association Amendments issued since publication Amd. No. Date of issue CommentsBS4584-103.2:1990 BSI 04-1999 i Contents Page Committees responsible Inside front cover National foreword ii 1 Scope 1 2
6、 Designation 1 3 Mass per unit area, and thickness 1 4 Chemical analysis 1 5 Electrical properties 1 6 Tensile properties (requirements for either lengthwise or crosswire direction) 2 7 Surface finish 3 8 Solderability 3 9 Surface treatment 4 10 Roll dimensions and tolerances 4 11 Packaging 5 Append
7、ix Sampling and methods of test 6 Table I 1 Table II 2 Table III 4 Table IV 6 Publication referred to Inside back coverBS4584-103.2:1990 ii BSI 04-1999 National foreword This Section of BS4584 has been prepared under the direction of the Electronic Components Standards Policy Committee. It is identi
8、cal with IEC 249-3A:1976 “Base materials for printed circuits” Part3 “Special materials used in connection with printed circuits” Specification No. 2. “Specification for copper foil for use in the manufacture of copper clad base materials”, including the corrigendum issued in June1980, published by
9、the International Electrotechnical Commission (IEC). A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal o
10、bligations. Cross-reference International standard Corresponding British Standard IEC 249-1:1982 BS4584 Metal-clad base materials for printed wiring boards Part 1:1983 Methods of test (Identical) Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, pages1to
11、8, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on theinside front cover.BS4584-103.2:1990 BSI 04-1999 1 1 Scope This specification gives requirements for properties
12、of copper foil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used for printed wiring. This specification applies to copper foil supplied in rolls, but by agreement between purchaser and vendor, may be applied to foil produced in sheets. 2
13、Designation Copper foil for the uses considered in this specification may be either of two types, as specified by the purchaser: Type A, electro-deposited copper foil (standardorhigh ductility); Type B, rolled copper foil (as rolled, lightly cold-rolled, or rolled and annealed). 3 Mass per unit area
14、, and thickness The primary measure of quantity of copper foil shall be the mass per unit area, together with applicable tolerances. Thicknesses of copper foil corresponding to specified values of unit mass, together with corresponding tolerances for thickness, shall be regarded as given for informa
15、tion only. The requirements apply to both Type A and Type B, with the exception that the first line of the table is held under consideration for Type B and applies only to Type A. Table I Mass per unit area shall be determined by test method1 of this specification. 4 Chemical analysis Type A copper
16、foil shall have a minimum purity of 99.8% copper (with silver content regarded as copper), excluding any “as shipped” surface treatment. Type B copper foil shall have a minimum purity of99.9% copper (with silver content regarded as copper), excluding any “as shipped” surface treatment. The copper co
17、ntent shall be calculated as prescribed in test method2 of this specification. The chemical analysis shall be carried out after removal of any surface treatment or contamination(e.g.grease) from the surface of the specimen. 5 Electrical properties For both Type A and Type B copper foil having a nomi
18、nal mass per unit area of152 g/m 2 (0.5 oz/ft 2 ), the minimum conductivity shall be93.70% of the International Annealed Copper Standard (IACS) at20C(68F), equivalent to0.163 59 7g/m 2 (=1.840 10 87m in S.I. units). For both Type A and Type B copper foil having a nominal mass per unit area equal to
19、or greater than305 g/m 2 (1 oz/ft 2 ), the minimum conductivity shall be96.16% of the International Annealed Copper Standard (IACS) at20C (68F), equivalent to0.15940 7g/m 2 (=1.793 10 87m in S.I. units). Requirements For information only Nominal mass per unit area Deviation in per cent of nominal ma
20、ss Nominal thickness Thickness deviation Class I Class II g/m 2 oz/ft 2 Class I Class II 4m in 4m in 4m in 152 0.5 10% 5% 18 0.0007 5 0.0002 2.5 0.0001 230 0.75 10% 5% 25 0.0010 5 0.0002 2.5 0.0001 305 1 10% 5% 35 0.0014 5 0.0002 2.5 0.0001 610 2 10% 5% 70 0.0028 8 0.0003 4.0 0.00015 915 3 10% 5% 10
21、5 0.0042 10 0.0004 5.0 0.0002BS4584-103.2:1990 2 BSI 04-1999 The maximum resistance of copper foil, corrected to20C (68F), when measured in accordance with the test method described in Sub-clause2.1 of IEC Publication249-1, Metal-clad Base Materials for Printed Circuits, Part1, Test Methods, shall b
22、e as follows: 6 Tensile properties (requirementsforeither lengthwise orcrosswise direction) Table II Tensile strength and elongation shall be determined in accordance with test method3. Mass per unit area Maximum resistance 152 g/m 2 (0.5oz/ft 2 ) 7.0 m7 230 g/m 2 (0.75oz/ft 2 ) 5.5 m7 305 g/m 2 (1o
23、z/ft 2 ) 3.5 m7 610 g/m 2 (2oz/ft 2 ) 1.75 m7 915 g/m 2 (3oz/ft 2 ) 1.17 m7 Mass per unit area Minimum tensile strength Minimum elongation percentage g/m 2 oz/ft 2 N/cm 2 1bf/in 2 Standard High ductility Type A copper foil 152 0.5 10500 15000 2 5 230 0.75 16000 23000 2.5 7.5 305 1.0 21000 30000 3 10
24、 610 2.0 21000 30000 3 15 915 3.0 21000 30000 3 15 Type B copper foil, as rolled 152 0.5 35000 50000 0.5 230 0.75 35000 50000 0.5 305 1.0 35000 50000 0.5 610 2.0 35000 50000 1 915 3.0 35000 50000 1 Type B copper foil, lightly cold-rolled 152 0.5 Not manufactured in this condition 230 0.75 Not manufa
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