BS 4584-103 2-1990 Metal-clad base materials for printed wiring boards Special materials used in connection with printed circuits Specification for copper foil for use in the manuf.pdf

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1、BRITISH STANDARD BS4584-103.2: 1990 IEC249-3A: 1976 Metal-clad base materials for printed wiring boards Part 103: Special materials used in connection with printed circuits Section 103.2 Specification for copper foil for use in the manufacture of copper-clad base materialsBS4584-103.2:1990 This Brit

2、ish Standard, having been prepared under the directionof the Electronic Components Standards Policy Committee, was published underthe authority of the BoardofBSI and comes and comesintoeffect on 28February1990 BSI 04-1999 The following BSI references relate to this standard: Committee reference ECL/

3、19 Draft for comment89/23232 DC ISBN 0 580 18190 1 Committees responsible for this British Standard The preparation of this British Standard was entrusted by the Electronic Components Standards Policy Committee (ECL/-) to Technical Committee ECL/19 upon which the following bodies were represented: B

4、ritish Telecommunications plc ERA Technology Ltd. Electrical and Electronic Insulation Association (BEAMA Ltd.) Electronic Components Industry Federation Electronic Engineering Association GAMBICA (BEAMA Ltd.) Institute of Circuit Technology Institute of Metal Finishing Ministry of Defence National

5、Supervising Inspectorate Printed Circuit Association Telecommunication Engineering and Manufacturing Association Amendments issued since publication Amd. No. Date of issue CommentsBS4584-103.2:1990 BSI 04-1999 i Contents Page Committees responsible Inside front cover National foreword ii 1 Scope 1 2

6、 Designation 1 3 Mass per unit area, and thickness 1 4 Chemical analysis 1 5 Electrical properties 1 6 Tensile properties (requirements for either lengthwise or crosswire direction) 2 7 Surface finish 3 8 Solderability 3 9 Surface treatment 4 10 Roll dimensions and tolerances 4 11 Packaging 5 Append

7、ix Sampling and methods of test 6 Table I 1 Table II 2 Table III 4 Table IV 6 Publication referred to Inside back coverBS4584-103.2:1990 ii BSI 04-1999 National foreword This Section of BS4584 has been prepared under the direction of the Electronic Components Standards Policy Committee. It is identi

8、cal with IEC 249-3A:1976 “Base materials for printed circuits” Part3 “Special materials used in connection with printed circuits” Specification No. 2. “Specification for copper foil for use in the manufacture of copper clad base materials”, including the corrigendum issued in June1980, published by

9、the International Electrotechnical Commission (IEC). A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal o

10、bligations. Cross-reference International standard Corresponding British Standard IEC 249-1:1982 BS4584 Metal-clad base materials for printed wiring boards Part 1:1983 Methods of test (Identical) Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, pages1to

11、8, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on theinside front cover.BS4584-103.2:1990 BSI 04-1999 1 1 Scope This specification gives requirements for properties

12、of copper foil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used for printed wiring. This specification applies to copper foil supplied in rolls, but by agreement between purchaser and vendor, may be applied to foil produced in sheets. 2

13、Designation Copper foil for the uses considered in this specification may be either of two types, as specified by the purchaser: Type A, electro-deposited copper foil (standardorhigh ductility); Type B, rolled copper foil (as rolled, lightly cold-rolled, or rolled and annealed). 3 Mass per unit area

14、, and thickness The primary measure of quantity of copper foil shall be the mass per unit area, together with applicable tolerances. Thicknesses of copper foil corresponding to specified values of unit mass, together with corresponding tolerances for thickness, shall be regarded as given for informa

15、tion only. The requirements apply to both Type A and Type B, with the exception that the first line of the table is held under consideration for Type B and applies only to Type A. Table I Mass per unit area shall be determined by test method1 of this specification. 4 Chemical analysis Type A copper

16、foil shall have a minimum purity of 99.8% copper (with silver content regarded as copper), excluding any “as shipped” surface treatment. Type B copper foil shall have a minimum purity of99.9% copper (with silver content regarded as copper), excluding any “as shipped” surface treatment. The copper co

17、ntent shall be calculated as prescribed in test method2 of this specification. The chemical analysis shall be carried out after removal of any surface treatment or contamination(e.g.grease) from the surface of the specimen. 5 Electrical properties For both Type A and Type B copper foil having a nomi

18、nal mass per unit area of152 g/m 2 (0.5 oz/ft 2 ), the minimum conductivity shall be93.70% of the International Annealed Copper Standard (IACS) at20C(68F), equivalent to0.163 59 7g/m 2 (=1.840 10 87m in S.I. units). For both Type A and Type B copper foil having a nominal mass per unit area equal to

19、or greater than305 g/m 2 (1 oz/ft 2 ), the minimum conductivity shall be96.16% of the International Annealed Copper Standard (IACS) at20C (68F), equivalent to0.15940 7g/m 2 (=1.793 10 87m in S.I. units). Requirements For information only Nominal mass per unit area Deviation in per cent of nominal ma

20、ss Nominal thickness Thickness deviation Class I Class II g/m 2 oz/ft 2 Class I Class II 4m in 4m in 4m in 152 0.5 10% 5% 18 0.0007 5 0.0002 2.5 0.0001 230 0.75 10% 5% 25 0.0010 5 0.0002 2.5 0.0001 305 1 10% 5% 35 0.0014 5 0.0002 2.5 0.0001 610 2 10% 5% 70 0.0028 8 0.0003 4.0 0.00015 915 3 10% 5% 10

21、5 0.0042 10 0.0004 5.0 0.0002BS4584-103.2:1990 2 BSI 04-1999 The maximum resistance of copper foil, corrected to20C (68F), when measured in accordance with the test method described in Sub-clause2.1 of IEC Publication249-1, Metal-clad Base Materials for Printed Circuits, Part1, Test Methods, shall b

22、e as follows: 6 Tensile properties (requirementsforeither lengthwise orcrosswise direction) Table II Tensile strength and elongation shall be determined in accordance with test method3. Mass per unit area Maximum resistance 152 g/m 2 (0.5oz/ft 2 ) 7.0 m7 230 g/m 2 (0.75oz/ft 2 ) 5.5 m7 305 g/m 2 (1o

23、z/ft 2 ) 3.5 m7 610 g/m 2 (2oz/ft 2 ) 1.75 m7 915 g/m 2 (3oz/ft 2 ) 1.17 m7 Mass per unit area Minimum tensile strength Minimum elongation percentage g/m 2 oz/ft 2 N/cm 2 1bf/in 2 Standard High ductility Type A copper foil 152 0.5 10500 15000 2 5 230 0.75 16000 23000 2.5 7.5 305 1.0 21000 30000 3 10

24、 610 2.0 21000 30000 3 15 915 3.0 21000 30000 3 15 Type B copper foil, as rolled 152 0.5 35000 50000 0.5 230 0.75 35000 50000 0.5 305 1.0 35000 50000 0.5 610 2.0 35000 50000 1 915 3.0 35000 50000 1 Type B copper foil, lightly cold-rolled 152 0.5 Not manufactured in this condition 230 0.75 Not manufa

25、ctured in this condition 305 1.0 Not manufactured in this condition 610 2.0 22500 32000 5 915 3.0 22500 32000 5 Type B copper foil, rolled and annealed 152 0.5 10500 15000 5 230 0.75 12000 17000 5 305 1.0 17500 25000 5 610 2.0 17500 25000 10 915 3.0 17500 25000 10BS4584-103.2:1990 BSI 04-1999 3 7 Su

26、rface finish One surface of both Type A or Type B copper foil shall have a maximum roughness of0.44m (164in), arithmetic average, as determined with a surface finish measuring instrument having a tracing probe with a tip radius of12.54m, using a tracing force of0.005N and a cut-off of0.75mm (0.030in

27、). Measurements shall be made on each of three specimens from a given lot in the lengthwise direction, and on each of three specimens in the crosswise direction, and the six measurements averaged to determine compliance with the requirement. Nodules on the rough side of Type A copper foil shall not

28、exceed the following limits for elevation above the general plane of the copper foil surface: Both sides of Type A and Type B copper foil shall be substantially free from wrinkles, dirt, oil, corrosion or corrosion products, salts, grease, finger-prints, or other blemishes which would adversely affe

29、ct the quality of the copper-clad material to be made from the foil. There shall be no scratches present on the smooth side of greater depth than0.0035mm (0.00014 in). Copper foil surfaces shall be free from regularly spaced and repeating patterns of pits and dents. There shall be no inclusions grea

30、ter than0.0025mm (0.0001 in) in the longest dimension. Maximum size and frequency of pinholes and porosity of copper foil having a mass of less than305 g/m 2shall be established by agreement between purchaser and vendor. For foil of152 g/m 2mass, in the absence of an agreement between purchaser and

31、vendor, the maximum limit of porosity shall be30points of penetration in an area of300mm 300mm (12 in 12 in), when the specimen is tested according to test method4 of this specification. The longest dimension of any pinhole shall be max.0.05mm (0.002 in). For copper foil of230 g/m 2 , the following

32、values are given for guidance: maximum limit of porosity:15points of penetration in an area of300mm 300mm (12 in 12 in). Longest dimension of pinholes:0.05mm (0.002 in). For copper foil equal to or greater than305 g/m 2(1oz/ft 2 ), the maximum limit of porosity shall be8points of penetration in an a

33、rea of300mm 300mm (12 in 12 in), when the specimen is tested according to test method4 of this specification. The area of any one or number of pinholes in an area of0.5 m 2(5.4ft 2 ) shall not exceed the area of a circle of diameter0.125mm (0.005 in). 8 Solderability The solderability of the copper

34、foil shall be tested in accordance with IEC Publication68-2-20C, Third supplement, Test Ta: Second part, Method for Testing the Solderability of Printed Wiring Boards and Metal-clad Base Laminates, with the following supplementary specifications: 8.1 Solder temperature The temperature of the solder

35、shall be C. 8.2 Cleaning of the specimen 8.2.1 Copper foil without additional surface treatment (in accordance with Sub-clause3.10.3.1 of IECPublication249-1C, Third supplement to Publication249-1) The specimen shall be degreased by immersion in a neutral organic solvent at room temperature, dried,

36、immersed for15 s in a solution of HCl (one part of HCl of density1180 kg/m 3and four parts water by volume), then rinsed in de-ionized water and dried in hot air. Mass per unit area Maximum elevation 152 g/m 2 (0.5oz/ft 2 ) 5 4m (0.0002in) 230 g/m 2 (0.75oz/ft 2 ) 5 4m (0.0002in) 305 g/m 2 (1pz/ft 2

37、 ) 5 4m (0.0002in) 610 g/m 2 (2oz/ft 2 ) 8 4m (0.0003in) 915 g/m 2 (3oz/ft 2 ) 104m (0.0004in) 235 +5 0 BS4584-103.2:1990 4 BSI 04-1999 8.2.2 Copper foil with additional surface treatment The supplier of the foil shall specify the cleaning method. 8.3 Specimen holder The specimen holder shall comply

38、 with Sub-clause 3.3 of IEC Publication68-2-20C. The copper foil specimen shall be mounted in a suitable way, e.g.wrapped around a piece of polytetrafluorethylene or other high-temperature resistant plastic material. 8.4 Requirements Wetting time: max. 2 s. Dewetting time: . Visual examination: the

39、soldered surface shall comply with the illustrations given in IECPublication249-1C, Figure 11. 9 Surface treatment The rough side of the copper foil should be free from dark strips in the longitudinal and transverse directions of the foil surface. The colour of the copper foil should be uniform in a

40、ll directions. If agreed upon between purchaser and vendor, the rough side of Type A copper foil, or one side of Type B copper foil may be given a chemical or electrochemical treatment to enhance adhesion of the copper foil to the required substrate. If such a treatment has been applied, it shall be

41、 substantially uniform in colour and intensity over the entire area of the surface so treated, and shall be sufficiently adherent to withstand normal handling of the foil, including laminating. No more than traces of the treatment should be left on the etched surface of the substrate. No measurable

42、difference in properties of the laminate caused by these traces should occur. A certain disuniformity in colour of special treatments may be allowed provided that there is no difference in properties of the copper-clad laminate between the areas showing the different colours due to the treatment. Be

43、cause the purpose of surface treatment of copper foil is to enhance the adhesion of the foil to the substrate, the peel strength of the copper foil from the substrate shall meet the minimum requirements for the specified grade of copper-clad laminate according to IEC Publication249-2, Part2, Specifi

44、cations, or currently in process of adoption as IEC standards. 10 Roll dimensions and tolerances The width of the copper foil shall be as ordered. The following table gives the width tolerances for standard copper foil. Table III The length of the roll of foil shall be as ordered, with a tolerance o

45、f10%. In any length of roll, there shall be no more than three splices and each of these shall be plainly indicated by a durable marker which extends approximately5mm (0.25 in) beyond the end of the roll. Any holes larger than allowable pinholes shall be indicated either by a flag or by the removal

46、of the section containing the hole, with the two parts properly spliced and flagged. Rolls shall be evenly wound on cores of the size and material agreed upon between purchaser and vendor. Telescoping may not exceed12mm (0.5 in) from the core to the outer layer of a roll. Width Tolerance From 50 mm

47、to 300 mm (2into 11.8 in) inclusive 0.4 mm (0.016 in) Over 300 mm to 600 mm (11.8into23.6 in) inclusive 0.8 mm (0.032 in) Over 600 mm to 1200 mm (23.6 in to 47.2 in) inclusive 1.6 mm (0.063 in) 5 +1 0 sBS4584-103.2:1990 BSI 04-1999 5 11 Packaging Rolls shall be individually wrapped and sealed in a w

48、aterproof material, so that the properties remain within the given requirements for a period of90days after shipment. Depending on the size and mass of rolls being supplied on an order, rolls may be enclosed individually, or several rolls together, in durable cases. Unless otherwise agreed upon by p

49、urchaser and vendor, the maximum gross mass of any case or package shall be250kg (550lb). All rolls of copper foil in a single package or case shall be of the same type, mass per unit area, class of mass tolerance, class of ductility or degree of annealing and type of surface treatment. Each package or case shall be marked with the following information: type of copper foil; mass per unit area; class of mass tolerance; ductility class (or degree of annealing if TypeB);