ARMY MIL-E-63511 (9)-1990 ELECTRONICS-MCD ASSEMBLY FOR MINE ANTI-TANK BLU 91 B《91 B基本链路反坦克地雷电子MCD组件》.pdf

《ARMY MIL-E-63511 (9)-1990 ELECTRONICS-MCD ASSEMBLY FOR MINE ANTI-TANK BLU 91 B《91 B基本链路反坦克地雷电子MCD组件》.pdf》由会员分享，可在线阅读，更多相关《ARMY MIL-E-63511 (9)-1990 ELECTRONICS-MCD ASSEMBLY FOR MINE ANTI-TANK BLU 91 B《91 B基本链路反坦克地雷电子MCD组件》.pdf（19页珍藏版）》请在麦多课文档分享上搜索。

1、MIL-E-63511 (AR) AMENDMENT 9 25 MAY 1990 SUPERSEDING AMENDMENT- 8 13 June 1989 MILITARY SPECIFICATION ELECTRONICS-MCD ASSEMBLY FOR MINE, ANTI-TANK: BLU 91/B This Amendment forms a part of Military Specification MIL-E-63511 (AR), dated 15 June 1982, and is approved for use within the U.S. Army Armame

2、nt, Munitions and Chemical Command, and is available for use by all Departments and Agencies of the Department of Defense. PAGE 1 Preamble: Delete “Armament Research and Development Command“ and substitute “Armament, Munitions and Chemical Command.“ PAGE 2 SPECIFICATIONS, MILITARY: MIL-S-19500/127:

3、Delete in its entirety and add the MIL-S-19500/444 - Semiconductor Device, Diode, Silicon, following: Switching Types 2N5711 and TX 2N5711“ PAGE 3 2.1.2, Other Government documents, drawings, and publications: Command (ARRADCOM): Delete “and Development Command (ARRADCOM)“ and substitute “, Developm

4、ent and Engineering Center (ARDEC).“ US Army Armament Research and Development BtlSC N/A 1 of 19 FSC 134s DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited O Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-E-63511 (

5、9) 13 M 9999906 O438730 7 i . MIL-E-63511 (AR) AMENDMENT 9 PAGE 4 3.4.1 Transportation vibration. Delete in its entirety and substitute the following: “3.4.1 Transportation vibration. The Electronics-MCD Assembly shall be safe to handle and transport. Test mines shall show no evidence of damage that

6、 will affect the Ifunction following transportation vibration test No. 119, Procedure 2 of MIL-STD-331.“ PAGE 5 3.6.1 Quiescent current. Delete “. 6.05 + 0.15 volts at ambient temperature .“ and substitute “.T. 6.50 + 0.15 - volts. “ PAGE 9 * Add new paragraph 3.17 “3.17 Surveillance Samples. This s

7、pecification contains provisions for surveillance samples. Requirements for the submission of surveillance samples by the contractor shall be as specified in the contract and paragraph 4.4.8 herein.“ O PAGE 10 * 4.3.2.4 Function tests. Delete “.shall have borerider clips installed and shall be.“ and

8、 substitute “.shall have borerider clips, insulator discs, and borerider pins installed and shall be .“. PAGE 14 TABLE I: Delete “Band Printed Wiring (Dwg. 9292230)“ and substitute “Wiring, Printed Flexible (Dwg. 9292230)“. PAGE 17 4.4.2.1, Resistor, Fixed Composition, 5%, 1/8W: TITLE: Delete “1/8W“

9、. 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-E-63511 (AR) AMENDMENT 9 DRAWING NUMBER: Delete “MIL-R-39008/4“ and substitute Part Number, Part Value: Delete in its entirety and “MIL-R-39008/1/“, - substitute: “Part Number i/ Part Value - RC

10、R05G 30 5 JR RCR05G 10 4 JR RCR05G 47 2 JR RCR05G 10 2 JR RCR07G 13 1 JR 3 M OHM 100 K OHM 4,7 K OHM 1 K OHM 130 OHM“ Major 101: Delete “MIL-R-39008/4“ and substitute “MIL-R-39008/1/“, - Add the following note: “i/ Use MIL-R-39008/1 or /4 as applicable, See Dwg. Note-13“. 4.4.2.2, Resistor, Fixed DR

11、AWING NUMBER: De “P/N 9287099-1621“. PAGE 18 Film: ete “P/N 9287099-16 1“ and substitu PAGE 20 :e 4.4.2.4, Delete in its entirety and substitute with new page 20 included PAGE 21 4.4.2.5 Semi-conductor Device, Diode, Type JANTX IN 645-1: Drawing Number: Delete “9287168-2“ and substitute Critical i:

12、Delete in its entirety. Critical 2: Delete in its entirety. “MIL-S-1950O/24On 3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-2 I3 u w pi m H H w O B 2 O u * E-i GI A H 8 8 “ E h 4 (u (u (u Cu z (u x E-c z 5 C m 4 I- O ul (u !z N x I3 z A b u O .lJ

13、 vi .I+ vi c v 1: ik MIL-E-63511 (7) 13 H 7777906 O438732 O W “ I “ m *VI a 5.u I rl . W UNQ r mmm m *e. a “r II O0 II ml“ dp ln (u10 (u0 mrl a .d c vi c m E Y 3 8 8 O pi rl a u .d c, .d u u “I U 0) L O Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,

14、-1 MIL-E-635LL (7) 13 7797906 0438733 2 MIL-E-63511 (AR) AMENDMENT 9 Add the following Major Categories: “104, Missing or incorrect color band on cathode end of “105, Reverse current - 100% 3.2 MIL-STD-750, Method diode - 100% 3.2 Electrical - i/“ 4016, dc“ 5 Provided by IHSNot for ResaleNo reproduc

15、tion or networking permitted without license from IHS-,-,-MIL-E-63511 (AR) AMENDMENT 9 PAGE 22 4.4.2.6, Diode, Zener, JANTX IN 4463 and JANTX IN 4471: Critical 1: Delete in its entirety Critical 2: Delete in its entirety Critical 3: Delete in its entirety Add the following Major Categories: “104, Mi

16、ssing or incorrect color band on cathode end of 105, Reverse current - 100% 3.2 MIL-STD-750, Method diode - 100% 3.2 Electrical, - i/“ 4016, dc“ 106, Zener breakdown voltage Vz - 100% 3.2 MIL-STD-750, Method 4022“ I PAGE 23 4.4.2.7, Diode, Hot Carrier (Jan iN 5711, MIL-19500/127): Change title to re

17、ad “4.4.2.7, Diode, Hot Carrier (JAN 1N 5711, MIL-5-19500/444)“ PAGE 25 4.4.2.9, Capacitor, Fixed, Electrolytic Tantalum, Solid (82 uF): Major 104: Delete “10-1-2“ and substitute “10-2-3“ Major 106: Delete “8-0-1“ and substitute “8-1-2“ PAGE 26 4.4.2.10, Capacitor, Fixed, Electrolytic Tantalum, Soli

18、d: Major 104: Delete “10-1-2“ and substitute “10-2-3“, Major 106: Delete “8-0-1“ and substitute “8-1-2“ 6 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-E-63511 (AR) AMENDMENT 9 PAGE 32 4.4.2.16, Baard, Printed Wiring: Major 102: Delete “A“ and

19、substitute “B“. Major 105: Delete “Large circular cutout, 2 places“ and substitute “Diameter of circular cutout, 2 places“. Major 106: Delete “0.40%“ and substitute “i/“ - Add the following Note: “1/ Printed Wiring Board sample plan per MIL-STD-105, AQL .40%, Inspection Level 54. From each board, ra

20、ndomly select and inspect 32 hole diameters. A board shall be classed defective if any hole is defective“. PAGE 34 4.4.2.1.8, Microcircuit, Digital, CMOS: Major 101: Delete “i/“ - and substitute “5-1-2“ Note - i/: Delete in * 4.4.2.19, Core, Toriod. its entirety. PAGE 35 Delete in it entirety. PAGE

21、36 * 4.4.2.20, Magnetometer Assembly. Delete Major 104, 105, 106, 107 and 108 in their entirety. PAGE 40 4.4.2.24, Receiver Coil Assembly: Major 104: Delete “Spacing of coil. 0.40% 3.2 Gage“ and substitute “Bonding of coil to flexable circuit: board incorrect 0.40% 3.2 Visual“. 7 Provided by IHSNot

22、for ResaleNo reproduction or networking permitted without license from IHS-,-,- VIL-E-635LL (7) 13 7997706 0938736 8 W MIL-E-63511 (AR) AMENDMENT 9 PAGE 42 4.4.2.26, Board, Printed Wiring: “Wiring, Printed Flexible“. TITLE: Delete “Board, Printed Wiring and substitute Major 103: Delete “Diameter“ an

23、d substitute “Length and Width“. PAGE 45 4.4.2.29, Lid Electronics Assembly: DRAWING NUMBER: Delete “9292243“ and substitute Minor 203: Delete in its entirety. “9292243/9378308“. PAGE 46 4.4.2.30, Housing, Electronics Assembly: DRAWING NUMBER: Delete “9332372“ and substitute “9332372/9378309“. PAGE

24、50 4.4.2.33, Electronic (Performance characteristics) (Ambient): Add the following Major category: “112, TTB Osillator period, under min. 100% - 3.6.3 - 4.5.5.3“ PAGE 52 4.4.2.33, Electronic Assembly (Performance characteristics) (-40 - 5OF): Add the following Major category: “112, TTB Oscillator pe

25、riod, under min. 0.40% - 3.6.3 - 4.5.5.3“ PAGE 54 4.4.2.33, Electronic Assembly (Performance characteristics) (140 + 5OF): Add the following: 8 , Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-E-63511 (AR) AMENDMENT 9 “Major 109: Delete “100%“ a

26、nd substitute “0.40%“. “112, TTB Oscillator period, under min. 0.40% - 3.6.3 - 4.5.5.3“ PAGE 56 4.4.2.35, Electronics-MCD ASSY. (Prior to ASSY of Test Mines): Title: Delete “(Prior to Assy of Test Mines)“ Add the following Major Category: “103 Improper soldering MCD flex cable - 0.40% 3.16 Visual“ P

27、AGE 57 Add the following Major defect: “103 Impact failure 0-1 3.5 4.5.4“ PAGE 58 4.4.2.36, Electronics MCD Assembly: Add the following Lot Sample Plan: O After paragraph 4.4.2.36, add paragraph 4.4.2.37, page 58a and 58b included consisting of Classification of Defects and Tests for Power Supply Mo

28、lding, drawing number 9292221. After paragraph 4.4.2.37, add paragraph 4.4.2.38, page 58c included consisting of Classification of Defects and Test for Power Supply Assembly, drawing number 9292241. 9 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-N

29、IL-E-635LL kl % I O n VIrl *I I CU ao cnm AMENDMENT 9 rlrl rlri I1 II O0 O0 21 2 4 w B H p: u QI Iz m O m m QI . rlrl dri II II O0 O0 CT 3 cl w W O ri c /Ed a .A O mL9IzI-l O mlnIzri ai da QIN E cn mm O mmr-ri O mmPd W m r4 -3 -F * . O mmc2rl O0 O000 O000 “Om rlmrim c a( a u .dl om 1111 drldri O000

30、vICIcIO rimo Li bi m Paragraph 4.4.2.33, Majors 101, 102, and 104 through 110 inclusive (Hot, Cold, and Ambient). The variables data shall be identified by serial number and lot number to provide traceability. This data shall be the actual data and not averages, means, standard deviations or other c

31、ompilations of the data. Any data which may be of a classified nature shall be handled in accordance with the security provisions of the contract. * 4.4.8.2 Potting material (deg. 9287148). The contractor shall submit fifty(50) tensile test samples and two(2) plaques molded per the drawing for each

32、unique mix of potting material to the Government for surveillance 14 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- c . MIL-E-63511 (9) 13 = 994990b 0438743 5 MIL-E-63511. (AR) AMENDMENT 9 testing. For the purposes of this specification, a unique m

33、ix of potting materi.al shall be defined as a mix of one batch of part A from the original manufacturer with one batch of part B from the original manufacturer. The samples shall be packaged in accordance with paragraph 5.5 and delivered to the Government as specified in paragraph 6.12. * 4.4.8.2.1

34、Potting material surveillance data. For each submittal of potting material, the tensile strength and hardness data corresponding to the day that the surveillance samples were prepared (see paragraph 4.4.3.1) shall be delivered to the Government in accordance with paragraph 6.13. PAGE 61 * 4.5.4 Func

35、tional tests of electronic -MCD assemblies. Delete . the test samples shall be launched. and substitute . “. . . the test samples with borerider clips, insulator discs, and borerider pins installed shall be launched.“. PAGE 63 4.5.4.3, Disposition of Duds. Delete “ARRADCOM“ and substitute “to the Go

36、vernment“ PAGE 64 4.5.5 Electronic assembly performance tests: Delete ,. of 700 t 5F. and ,“ and substitute . of 70 t 10F, and- . . . . PAGE 66 * 4.5.5.10, Target sensor functioning test: Delete . for the ambient all-fire and . substitute (I. for the all-fire and 11 PAGE 67 In Table II Delete: “1. S

37、horting Bar Across Firing Capacitor 6 to 9 ,2 to .7 OHMS“ and substitute “1. Shorting Bar Across Firing Capacitor 6 to 9 .2 to .85 OHMS. “ 15 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-E-63511 (AR) AMENDMENT 9 Delete: “3. Fuse and ID . . 4.

38、. to 9 20K - + 5% ohms“ in their entirety. and substitute: “3. Fuze and ZD check 12 to 9 20K - + 10% OHMS. 4. Fuze and ID check 11 to 9 20K - + 10% OHMS.“ PAGE 68 * 5.5 Add the following paragraph: “5.5 Packaging of potting material surveillance samples. The potting material surveillance samples sha

39、ll be packaged in a Level C pack in accordance with MIL-STD-1169“. PAGE 69 Add the following new paragraphs: “4.5.9 Power supply assembly. 4.5.9.1 Pull test of the power supply assembly leads. Each welded lead shall withstand a non-destructive pull - force 5 + 2 pounds along the longitudinal axis of

40、 the lead without degradation or failure. Additionally one power supply at the start of each shift and one Power Supply every 100 manufactured shall be subjected to a destructive pull force on each of the 4 leads of 9 pounds minimum along the longitudinal axis of the lead. Evidence of residual lead

41、material shall be present at each weld after the pull test to assure weld integrity. “4.5.9.2 Leak test of the power supply assembly. One assembly at the start of each shift and one assembly of every 100 manufactured shall be tested for compliance with the reoss and fine leak requirements of MIL-B-4

42、8761. Any unit failing to meet the requirement shall reject the lot. (non-destructive test) NOTE: At the contractors option 4.5.9.1 SI 4.5.9.2 may be conducted on battery and lead assemblies prior to assembly of the Power Supply Assembly dependent on the contractor process. II (alternate lead materi

43、al only). a 16 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-E-63511 (AR) AMENDMENT 9 5.1: Delete in its entirety and substitute the following: “5.1 Packaging. The Electronics-MCD assembly shall be preserved and packaged in accordance with MIL-

44、E-17555 with the following mandatory requirements: Each individual Electronic-MCD Assembly shall be completely wrapped in metal foil (aluminum foil) to shield the units from electromagnetic and radio frequency energies. The wrapped units shall be packaged in a corrugated fiberboard tray or box fitte

45、d with partitions and separators as required to keep the foil-wrapped units separated. Cushioning as needed shall be used; the fiberboard trays or box shall be sealed in a barrier bag conforming to Type I, or Class F, Style 1, Specification MIL-B-117. (Material used to fabricate the barrier bag must

46、 include metal foil). The packaging materials shall - not contain silicones, sulphur compounds or polysulphides.“ 6.3 Submission of inspection equipment designs for approval. Delete: “to: Commander, U.S. Army.New Jersey 07801“ and substitute “to the Technical Agency specified in the O - contract.“ P

47、AGE 69 6.4 Submission of plans for approval. Delete “Commander: ARRADCOM, . DRDAR-QAT-Mn and substitute “the Technical Agency specified in the contract“. 6.5 Submission of process control documents. Delete “to: Commander, ARRADCOM, . DRDAR-QAT-M“ and substitute “to the Technical Agency specified in

48、the contract“ 6.6 Distribution of ammunition data cards, inspection and test results, process controls. Delete “Commander: ARRADCOM, . DRDAR-QAT-M“ and substitute “the Technical Agency specified in the contract“ PAGE 70 6.9 Definitions: h. Transportation Vibration faiiure: Delete in its entirety and substitute the following. 17 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-E-63511 (7) 13 W 999990b 0438746 O 2 MIL-E-63511 (AR) AMENDMENT 9 “h. Transportation Vibration failure is defined as a test mine assembly that does not meet