IEEE 1505 1-2015 en The Common Test Interface Pin Map Configuration for High-Density Single-Tier Electronics Test Requirements Utilizing IEEE Std 1505《利用IEEE St.pdf
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1、 IEC 63003 Edition 1.0 2015-12 INTERNATIONAL STANDARD Standard for the common test interface pin map configuration for high-density, single-tier electronics test requirements utilizing IEEE Std 1505 IEC 63003:2015-12(en)IEEE Std1505.1-2008IEEE Std 1505.1 colourinsideTHIS PUBLICATION IS COPYRIGHT PRO
2、TECTED Copyright 2008 IEEE All rights reserved. IEEE is a registered trademark in the U.S. Patent any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also partic
3、ipate in this preparation. IEEE Standards documents are developed within IEEE Societies and Standards Coordinating Committees of the IEEE Standards Association (IEEE-SA) Standards Board. IEEE develops its standards through a consensus development process, which brings together volunteers representin
4、g varied viewpoints and interests to achieve the final product. Volunteers are not necessarily members of IEEE and serve without compensation. While IEEE administers the process and establishes rules to promote fairness in the consensus development process, IEEE does not independently evaluate, test
5、, or verify the accuracy of any of the information contained in its standards. Use of IEEE Standards documents is wholly voluntary. IEEE documents are made available for use subject to important notices and legal disclaimers (see http:/standards.ieee.org/IPR/disclaimers.html for more information). I
6、EC collaborates closely with IEEE in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has
7、 representation from all interested IEC National Committees. The formal decisions of IEEE on technical matters, once consensus within IEEE Societies and Standards Coordinating Committees has been reached, is determined by a balanced ballot of materially interested parties who indicate interest in re
8、viewing the proposed standard. Final approval of the IEEE standards document is given by the IEEE Standards Association (IEEE-SA) Standards Board. 3) IEC/IEEE Publications have the form of recommendations for international use and are accepted by IEC National Committees/IEEE Societies in that sense.
9、 While all reasonable efforts are made to ensure that the technical content of IEC/IEEE Publications is accurate, IEC or IEEE cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Comm
10、ittees undertake to apply IEC Publications (including IEC/IEEE Publications) transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC/IEEE Publication and the corresponding national or regional publication shall be clearly indicated in
11、the latter. 5) IEC and IEEE do not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC and IEEE are not responsible for any services carried out by independent certification bodies.
12、6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or IEEE or their directors, employees, servants or agents including individual experts and members of technical committees and IEC National Committees, or volunteers of IEEE Societie
13、s and the Standards Coordinating Committees of the IEEE Standards Association (IEEE-SA) Standards Board, for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use
14、 of, or reliance upon, this IEC/IEEE Publication or any other IEC or IEEE Publications. 8) Attention is drawn to the normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possi
15、bility that implementation of this IEC/IEEE Publication may require use of material covered by patent rights. By publication of this standard, no position is taken with respect to the existence or validity of any patent rights in connection therewith. IEC or IEEE shall not be held responsible for id
16、entifying Essential Patent Claims for which a license may be required, for conducting inquiries into the legal validity or scope of Patent Claims or determining whether any licensing terms or conditions provided in connection with submission of a Letter of Assurance, if any, or in any licensing agre
17、ements are reasonable or non-discriminatory. Users of this standard are expressly advised that determination of the validity of any patent rights, and the risk of infringement of such rights, is entirely their own responsibility. IEC 63003:2015 IEEE Std 1505.1-2008Published by IEC under license from
18、 IEEE. 2008 IEEE. All rights reserved. International Standard IEC 63003/ IEEE Std 1505.1-2008 has been processed through IEC technical committee 91: Electronics assembly technology, under the IEC/IEEE Dual Logo Agreement. The text of this standard is based on the following documents: IEEE Std FDIS R
19、eport on voting IEEE Std 1505.1-2008 91/1274/FDIS 91/1298/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The IEC Technical Committee and IEEE Technical Committee have decided that the contents of this publicatio
20、n will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IEC 63003:2015 IEEE Std 1505.1-2008IE
21、EE Standard for the Common Test Interface Pin Map Configuration for High-Density, Single-Tier Electronics Test Requirements Utilizing IEEE Std 1505Sponsor IEEE Instrumentation and Measurement Society and IEEE Standards Coordinating Committee 20 on Test and Diagnosis for Electronic Systems Approved 2
22、6 September 2008 IEEE-SA Standards Board Approved as a Full-Use Standard on 14 June 2013 IEEE-SA Standards Board IEC 63003:2015 IEEE Std 1505.1-2008Abstract: This standard represents an extension to the IEEE 1505 receiver fixture interface (RFI) standard specification. Particular emphasis is placed
23、on defining within the IEEE 1505 RFI standard a more specific set of performance requirements that employ a common scalable: (a) pin map configuration; (b) specific connector modules; (c) respective contacts; (d) recommended switching implementation; and (e) legacy automatic test equipment (ATE) tra
24、nsitional devices. This is intentionally done to standardize the footprint and assure mechanical and electrical interoperability between past and future automatic test systems (ATS). Keywords: ATE, ATS, fixture, ICD, IEEE 1505.1TM, interface, ITA, mass termination, receiver, scalable, TPS, UUT IEC 6
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