IEC 60286-3-2013 Packaging of components for automatic handling - Part 3 Packaging of surface mount components on continuous tapes《自动处理用元件的包装.第3部分 连续传送带上表面装配元件的包装》.pdf
《IEC 60286-3-2013 Packaging of components for automatic handling - Part 3 Packaging of surface mount components on continuous tapes《自动处理用元件的包装.第3部分 连续传送带上表面装配元件的包装》.pdf》由会员分享,可在线阅读,更多相关《IEC 60286-3-2013 Packaging of components for automatic handling - Part 3 Packaging of surface mount components on continuous tapes《自动处理用元件的包装.第3部分 连续传送带上表面装配元件的包装》.pdf(82页珍藏版)》请在麦多课文档分享上搜索。
1、 IEC 60286-3 Edition 5.0 2013-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes Emballage de composants pour oprations automatises Partie 3: Emballage des composants pour montage en surface
2、en bandes continues IEC 60286-3:2013 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2013 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopyin
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6、idence. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for al
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11、e Centre: csciec.ch. A propos de la CEI La Commission Electrotechnique Internationale (CEI) est la premire organisation mondiale qui labore et publie des Normes internationales pour tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des publications CEI Le contenu
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14、 nouvelles publications parues. Disponible en ligne et aussi une fois par mois par email. Electropedia - www.electropedia.org Le premier dictionnaire en ligne au monde de termes lectroniques et lectriques. Il contient plus de 30 000 termes et dfinitions en anglais et en franais, ainsi que les termes
15、 quivalents dans les langues additionnelles. Egalement appel Vocabulaire Electrotechnique International (VEI) en ligne. Service Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 60286-3 Edition
16、 5.0 2013-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes Emballage de composants pour oprations automatises Partie 3: Emballage des composants pour montage en surface en bandes continues
17、INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE W ICS 31.020; 31.240 PRICE CODE CODE PRIX ISBN 978-2-83220-819-9 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure
18、 that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 60286-3 IEC:2013 CONTENTS FOREWORD . 5 INTRODUCTION . 7 1 General 8 1.1 Scope 8 1.2 Normative references 8 2 Terms and definitions .
19、8 3 Structure of the specification 10 4 Dimensional requirements for taping. 10 4.1 Component cavity positioning requirements . 10 4.1.1 Requirements for types 1a, 1b, 2a, 2b and 3 10 4.1.2 Requirements for types 4 . 10 4.2 Component cavity dimension requirements (tape types 1a, 1b, 2a, 2b and 3) 11
20、 4.3 Type 1a Punched carrier tape, with top and bottom cover tape (tape widths: 8 mm and 12 mm) . 12 4.4 Type 1b Pressed carrier tape, with top cover tape (tape width: 8 mm) 14 4.5 Type2a Blister carrier tape, with single round sprocket holes and tape pitches down to 2 mm (tape widths: 8 mm, 12 mm,
21、16 mm and 24 mm) . 16 4.6 Type 2b Blister carrier tape, with single round sprocket holes and with 1mm tape pitch (tape widths: 4 mm) 18 4.7 Type 3 Blister carrier tape, with double sprocket holes (32 mm to 200 mm) 20 4.8 Type 4 Adhesive-backed punched plastic carrier tape for singulated bare die and
22、 other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) . 22 5 Polarity and orientation requirements of components in the tape 25 5.1 Requirements for all tape types . 25 5.2 Specific requirements for type 1a 25 5.3 Specific requirements for type 4 25 6 Carrier tape requirements . 25 6.1 Tapi
23、ng materials 25 6.2 Minimum bending radius (for all types) 26 6.3 Camber . 26 7 Cover tape requirements (for type 1a, 1b, 2a, 2b and 3) . 27 8 Component taping and additional tape requirements 28 8.1 All types 28 8.2 Specific requirements for type 1b 28 8.3 Specific tape requirements for type 2b. 28
24、 8.4 Specific requirement for type 4 28 8.4.1 General . 28 8.4.2 Coordinate system . 29 8.4.3 Component positioning and lateral displacement (see Figures 19 and 23) . 30 8.5 Specific requirements for tapes containing die products 31 8.5.1 General . 31 8.5.2 Tape design for tapes containing die produ
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