JEDEC JESD671B-2012 Component Quality Problem Analysis and Corrective Action Requirements (Including Administrative Quality Problems).pdf
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1、JEDEC STANDARD Component Quality Problem Analysis and Corrective Action Requirements (Including Administrative Quality Problems) JESD671B (Revision of JESD671A, December 1991) JUNE 2012 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been pr
2、epared, reviewed, and approved through the JEDEC Board of Directors level and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilita
3、ting interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are
4、 adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The informati
5、on included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed an
6、d ultimately become an ANSI standard. No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address b
7、elow, or refer to www.jedec.org under Standards and Documents for alternative contact information. Published by JEDEC Solid State Technology Association 2012 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copy
8、right on this material. By downloading this file the individual agrees not to charge for or resell the resulting material. PRICE: Contact JEDEC Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission.
9、For information, contact: JEDEC Solid State Technology Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. JEDEC Standard No. 671B -i- COMPONENT QUALITY PROBLEM ANALYSIS AND CORRECTIVE ACTION REQUIREME
10、NTS (INCLUDING ADMINISTRATIVE QUALITY PROBLEMS) Introduction Suppliers of electronic components strive to ship products with zero defects. Despite their best efforts, problems may occur from time to time. When that happens, timely and accurate root cause failure analysis and the establishment and ma
11、intenance of an effective corrective action system are of critical importance to an electronic component suppliers ability to successfully resolve such customer-reported failures. The initial response, failure analysis, and corrective action turnaround time requirements for customer-initiated proble
12、m analysis or corrective action requests, vary widely. This document is a compilation of the most common requirements involving problem analysis and corrective action associated with customer-reported problems and provides guidelines for the establishment of common expectations for both the Supplier
13、 and the Customer. JEDEC Standard No. 671B -ii- JEDEC Standard No. 671B Page 1 COMPONENT QUALITY PROBLEM ANALYSIS AND CORRECTIVE ACTION REQUIREMENTS (INCLUDING ADMINISTRATIVE QUALITY PROBLEMS) (From JEDEC Board Ballot JCB-12-01, formulated under the cognizance of the JC-14.1 Subcommittee on Reliabil
14、ity Test Methods for Package Devices.) 1 Scope The scope of this standard includes any customer-initiated component problem analysis/corrective action request and supplier-identified component nonconformance to specification which may impact the customer. This standard establishes a common set of cu
15、stomer and supplier expectations and requirements that will help to facilitate successful problem analysis and corrective action of component problems, including administrative quality problems, which may affect the customer. 2 Applicable documents ANS ISO9001:2000, Quality Management System (Qualit
16、y systems for organization which design, develop, manufacture, install and/or service any product or provide any service.) EIA-599, National Electronic Process Certification Standard JESD625, Requirements for Handling Electrostatic-Discharge Sensitive (ESDS) Devices 3 Terms and definitions component
17、 problem: Any problem related to the suppliers component that causes failure during, or interruption to, the customers production flow or failures of their products in the final application. a) administrative problems (wrong product, wrong quantity, packing/materials, orientation, date code, paperwo
18、rk, shipping damage, shipping error, labeling, etc.), b) electrical problems (functional, parametric, timing, continuity, programming, etc.), and c) visual/mechanical problems (marking, leads, package body, solderability, contamination, etc.). containment: Interim action(s) taken to minimize the eff
19、ects of component problems on customers until corrective actions are implemented. corrective action: Actions taken to eliminate the root cause(s) of an existing nonconformity, or other undesirable situation. JEDEC Standard No. 671B Page 2 3 Terms and definitions (contd) disposition: The act of deter
20、mining the future course of action for nonconforming material, e.g., scrap, use-as-is, retest, rework, and other. failure analysis: Investigation to determine the failure mechanism associated with a nonconforming component. failure mechanism: The physical, chemical, electrical, or other process defe
21、ct that has led to a nonconformance. failure mode: The way in which a failure mechanism manifests itself in a failing component (electrical signature or workmanship standard). preventive action: Action taken to modify the management systems, practices, or procedures to prevent recurrence of the curr
22、ent problem and similar problems where applicable. problem analysis: Investigation to determine the root cause of a reported component problem. root cause: The source of the failure mechanism or cause of an administrative problem. 4 Requirements In conjunction with this requirements section, annex A
23、 provides a typical flowchart and annex B provides a typical tracking and report form. 4.1 General requirements - Supplier The Supplier is expected to perform failure analysis upon request, and is therefore required to maintain failure analysis expertise and equipment within the company, or have suc
24、h expertise and equipment available through subcontracted services in order to provide effective and timely analysis and conclusions. If the risk of a verified component problem is determined to be significant and may affect other customers, the supplier shall attempt to notify all potentially affec
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