JEDEC JESD625-B-2012 Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices.pdf

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1、 JEDEC STANDARD Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices JESD625B (Revision of JESD625A, December 1999) JANUARY 2012 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved thro

2、ugh the JEDEC Board of Directors level and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improve

3、ment of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether

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5、publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standar

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10、mation. JEDEC Standard No. 625B -i- REQUIREMENTS FOR HANDLING ELECTROSTATIC-DISCHARGE-SENSITIVE (ESDS) DEVICES CONTENTS PageForeword iii1 Scope 11.1 Applicable users 11.2 Applicable part types 11.3 Personnel Safety 12 Technical references 23 Terms and definitions 34 Inspection, measuring and test eq

11、uipment 54.1 Recommended inspection, measuring and test equipment types 55 Facilities for ESD protected areas and workstations 55.1 Minimum requirements 55.2 Recommended compliance verification baseline 85.3 ESD item check records 95.4 Personnel grounding 95.5 Wrist strap and ESD protective footwear

12、 resistance path checks 105.5.1 Wrist strap resistance measurement path 105.5.2 Heel/toe strap and conductive shoe resistance measurement paths 105.5.3 Continuous wrist strap and workstation monitors 105.5.4 ESD protective smocks 105.6 Air ionization deployment 105.7 ESD signs and labels 115.7.1 Sig

13、n content and posting 115.7.2 ESD caution labels for packing and shipping 115.7.3 Package ESD caution label content 115.7.4 Commercial device package ESD caution label 125.7.5 Military device package ESD caution label 126 Grounding for protection of ESDS devices 126.1 ESD ground 126.1.1 Equipment an

14、d auxiliary ESD grounds 126.1.2 Equipment grounding receptacle and conductor 126.2 ESD protected workstation ESD ground 126.3 ESD protected worksurfaces 136.4 ESD protective flooring/mats 136.5 ESD ground connections 136.6 Ground wire mechanical considerations 136.7 Storage areas 136.8 Mobile ESD pr

15、otected workstation 13JEDEC Standard No. 625B -ii- REQUIREMENTS FOR HANDLING ELECTROSTATIC-DISCHARGE-SENSITIVE (ESDS) DEVICES CONTENTS (continued) Page7 ESD-safe packaging requirements 147.1 ESD device protective packaging requirement 147.2 Packing and filler materials 147.3 Tubes, trays, magazines

16、and carriers 147.4 Individual Finished device carrier materials 147.5 ESDS device shipping and receiving operations 148 Compliance verification 148.1 ESD coordinator 148.2 Frequency 148.3 Noncompliance 158.3.1 Noncompliant ESD protected areas and workstations 158.3.2 Mishandled ESDS device 158.3.3 R

17、eturning rejected ESDS devices to suppliers 158.4 Records 159 ESD handling training 159.1 Training program 159.2 Training records 1510 Methods for minimizing static charging 1610.1 Antistatic solution 1610.2 Relative humidity control 1610.3 Gloves/finger cots 1611 Recommended ESD audit checklist 17A

18、nnex A Informational/Reference Documents 19Annex B Differences between JESD625B and JESD625-A 20Figure 1 - ESD protected workstation 7Figure 2 - Example of ESD protected package caution label 11Table 1 - Minimum requirements for ESD protected areas , workstations, and tools 6Table 2 - ESD protective

19、 item checks 8JEDEC Standard No. 625B -iii- Foreword This standard was prepared to standardize the requirements for a comprehensive Electrostatic Discharge (ESD) control program for handling ESD-Sensitive (ESDS) devices. The requirements within this standard were derived from existing industry stand

20、ards, specifications, test methods, and input from various industry reviews. The intent of this document is for users to incorporate these minimal requirements into their ESD control program to provide a consistent ESD protection level for their products. This standard replaces JESD625-A and JEDEC S

21、tandard No. 42 (formerly JEDEC Publication 108-B, Distributor Requirements for Handling Electrostatic-Discharge Sensitive (ESDS) Devices). -iv- JEDEC Standard No. 625B Page 1 REQUIREMENTS FOR HANDLING ELECTROSTATIC-DISCHARGE-SENSITIVE (ESDS) DEVICES (From JEDEC Board ballot JCB-11-66, formulated und

22、er the cognizance of JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged Devices and JEDEC JC-13.) 1 Scope This standard establishes the minimum requirements for Electrostatic Discharge (ESD) control methods and materials used to protect electronic devices that are susceptible to damage

23、 or degradation from electrostatic discharge (ESD). The passage of a static charge through an electrostatic-discharge-sensitive (ESDS) device can result in catastrophic failure or performance degradation of the part. Device sensitivity to ESD is determined by test methods for Human-Body Model (ANSI/

24、ESDA-JEDEC JS-001) and Charged-Device Model (JESD22-C101). ESDS devices with HBM or CDM sensitivities of less than 200 volts may need additional protective measures beyond those specified in this standard. 1.1 Applicable users a) Semiconductor Manufacturers - from wafer electrical probe through ship

25、ment of finished devices. NOTE The requirements of this standard are not imposed prior to probe. Prior to probe, the manufacturer should take appropriate ESD precautions to minimize damage to devices. b) Semiconductor Processing/Testing Facilities - from receipt through shipment of finished devices

26、NOTE 1 ESDS Device Distributors and Users may use this standard or ANSI/ESD S20.20 NOTE 2 All ESDS devices shall be handled in accordance with this document until they are considered scrap. 1.2 Applicable device types The device types for which these requirements are applicable include, but are not

27、limited to, ESD-sensitive discrete and integrated circuit semiconductors, multi-chip modules, optoelectronic devices, and thin film passive devices. 1.3 Personnel safety The procedures and equipment described in this document may expose personnel to hazardous electrical conditions. Users of this doc

28、ument are responsible for selecting equipment that complies with applicable laws, regulatory codes and both external and internal policy. Users are cautioned that this document cannot replace or supersede any requirements for personnel safety. Ground fault circuit interrupters (GFCI) and other safet

29、y protection should be considered wherever personnel might come into contact with electrical sources. Electrical hazard reduction practices should be exercised and proper grounding instructions for equipment shall be followed. JEDEC Standard No. 625B Page 2 2 Technical References Unless otherwise sp

30、ecified, the following documents of the latest issue, revision or amendment, form a part of this standard to the extent specified herein. EIA-471 Symbol and Label for Electrostatic Sensitive Devices (JEDEC, JC-10) ANSI/ESD-S541 Packaging Materials Standards for ESD sensitive Items ANSI/ESD-STM3.1 St

31、andard for Protection of Electrostatic Discharge Susceptible Items - Ionization ANSI/ESD-S4.1 Standard for Protection of Electrostatic Discharge Susceptible Items - Worksurfaces - Resistive Characterization ANSI/ESD-S6.1 Standard for Protection of Electrostatic Discharge Susceptible Items - Groundin

32、g - Recommended Practice ANSI/ESD-S7.1 Standard for Protection of Electrostatic Discharge Susceptible Items - Floor Materials - Resistive Characterization of Materials ANSI/ESD-S8.1 Standard for Protection of Electrostatic Discharge Susceptible Items Symbols ESD Awareness ANSI/ESDA/JEDEC JS-001Human

33、 Body Model (HBM) Electrostatic Discharge (ESD) Sensitivity Testing Standard JESD22-C101 Field Induced Charged Device Model Test Method for Electrostatic Discharge Withstand Threshold for Microelectronic Devices MIL-STD-129 Marking for Shipment and Storage ANSI/ESD S20.20 Development of an Electrost

34、atic Discharge Control Program for Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices IEC 61340-5-1 Specification for the Protection of Electronic Devices from Electrostatic Phenomena - Section 1: General Requirements. ESD TR53

35、-01-06 Compliance Verification of ESD Protective Equipment and Materials ESD Handbooks and User Guides ESD TR 20.20 Technical Report - Development of an Electrostatic Discharge Control Program for Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiat

36、ed Explosive Devices - Handbook IEC 61340-5-2 Specification for the Protection of Electronic Devices from Electrostatic Phenomena - Section 2: User Guide. JEDEC Standard No. 625B Page 3 3 Terms and definitions For the purpose of this standard the following definitions apply. air ionizer: A source of

37、 charged air molecules (ions). 3.1 antistatic material: Refers to the property of material that inhibits triboelectric charging. 3.2 NOTE A materials antistatic property does not necessarily correlate with its resistivity or resistance. Unlike the dissipative and conductive properties, antistatic is

38、 not defined by a measurable resistance range. auxiliary ground: A separate supplemental ground conductor for use other than general equipment grounding. 3.3 conductive material: A material that has a surface resistance less than 1x104ohms or a volume resistance less than 1x104ohms. 3.4 NOTE A condu

39、ctive material is not necessarily antistatic. electrostatic charge: Electric charge at rest. 3.5 electrostatic discharge (ESD): The transfer of electrostatic charge between bodies or surfaces that are at different electrostatic potentials. 3.6 ESDS device: electrostatic-discharge-sensitive device. 3

40、.7 electrostatic field: Lines of force surrounding an electrically charged object. 3.8 electrostatic discharge shielding: A barrier or enclosure that limits the passage of an ESD current to the stored or contained devices. 3.9 equipment ground: The entire low-impedance path (electrically equivalent

41、to the equipment grounding conductor) from a piece of electrical equipment to a hard-ground electrode (e.g., the third wire (typically green) terminal of a receptacle). 3.10 ESD ground: The point, electrodes, bus bar, metal strips, or other system of conductors that form a path from a statically cha

42、rged person or object to ground. This ground is one of the following: a) AC Ground, b) Auxiliary Ground, or c) Equipotential bonding system. 3.11 ESD- work area: A defined location with the necessary materials, tools, and equipment capable of reducing static electricity to a level that minimizes dam

43、age to ESD susceptible items. 3.12 ESD-protected workstation: A work position with the necessary materials, tools and equipment capable of controlling static electricity to a level that minimizes damage to ESD susceptible items. 3.13 JEDEC Standard No. 625B Page 4 3 Terms and definitions (contd) ESD

44、-protective packaging: A packaging system that provides electrostatic discharge protection and limits triboelectric charging to levels that do not result in device damage. 3.14 ESD-protective worksurface: A table top or other surface that minimizes damage to ESD-susceptible items. 3.15 ground: (1) A

45、 conducting connection, whether intentional or accidental, between an electrical circuit or equipment and the earth or some conducting body that serves in place of earth. (2) The portion of an electrical circuit at zero potential with respect to the earth. (3) A conducting body, such as the earth or

46、 the hull of a steel ship, used as a return path for electric currents and as an arbitrary zero reference point. 3.16 groundable point: A designated connection, location, or assembly used on an ESD-protective material or device that is intended to accommodate electrical connection from the device to

47、 ESD ground. 3.17 insulative material: A material having a surface or volume resistance equal to or greater than 1 x 1011 ohms. 3.18 static: A short form of electrostatic. 3.19 static dissipative material: A material having a surface resistance between 1 x 104ohms and 1 x 1011ohms or a volume resist

48、ance between 1 x 104ohms and 1 x 1011ohm centimeters. 3.20 NOTE A static-dissipative material is not necessarily antistatic. static electricity: Electrical charge at rest. 3.21 NOTE The electrical charge is due to the transfer of electrons from one body to another. surface resistance: The dc voltage

49、 divided by the current passing between two electrodes of specified configuration that contact the same side of an insulative material or item. 3.22 NOTE Surface resistance is expressed in ohms. triboelectric charging: The generation of electrostatic charges when two pieces of material in intimate contact are separated (where at least one is an insulator). 3.23 NOTE Substantial generation of static electricity can be caused by contact and separation of two materials or by rubbing two substances together. unprotected ESDS device: