GOST IEC 61188-5-4-2013 Printed boards and printed board assemblies Design and use Part 5-4 Attachment (land joint) considerations Components with J leads on two sides《印制板和印制板组件 设计.pdf
《GOST IEC 61188-5-4-2013 Printed boards and printed board assemblies Design and use Part 5-4 Attachment (land joint) considerations Components with J leads on two sides《印制板和印制板组件 设计.pdf》由会员分享,可在线阅读,更多相关《GOST IEC 61188-5-4-2013 Printed boards and printed board assemblies Design and use Part 5-4 Attachment (land joint) considerations Components with J leads on two sides《印制板和印制板组件 设计.pdf(16页珍藏版)》请在麦多课文档分享上搜索。
1、 , () INTERSTATE CONCIL FOR STANDARDIZATION, METROLOGY AND CERTIFICATION (ISC) IEC 61188-5-4 2013 5-4 ( ) J- (IEC 61188-5-4:2007, IDT) IEC 61188-5-42013 II , 1.092 . 1.22009 . , . , , , 1 ( ) , 5 , / 91 2 420 , , 3 , ( 14 2013 . 44-2013) : ( 3166) 00497 ( 3166) 00497 BY KG RU 4 16 2014 1108- IEC 611
2、88-5-82013 1 2015 . 5 IEC 61188-5-4:2007 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides( . . 5-4. ( /). J - ). (en). 1.5 ( 3.5). , (IDT). 6 IEC 61188-5-42013 III , . () . , , 2014 , IEC 61188-5-42
3、013 IV IEC 61188-5 . . 5. ( ) : 5-1. . 5-2. . 5-3. . 5-4. J- . 5-5. . 5-6. J- . 5-8. (BGA, FBGA, CGA, LGA). J- . (.IEC 61188-5-1, ). , . , , , , . ( SOJ) . , , . ( 1, 2 3) : (max), (mdn) (min). , , IEC 61188-5-1, , C, F, P, , , . , IEC 61188-5-1, , . (SMD), , . IEC 61188-5-42013 1 5-4 ( ) J- Printed
4、 boards and printed board assemblies. Design and use. Part 5-4. Attachment (land/joint) considerations. Components with J leads on two sides 20150301 1 J- ( SOJ). . SOJ. 4 , . 2 . ( ). IEC 60068-2-58 Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissol
5、ution of metallization and to soldering heat of surface mounting devices (SMD) . 2-58. . Td. , (SMD) IEC 60286-4 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms ( . 4. , E G) IEC 60286-3 Packaging of compo
6、nents for automatic handling Part 3: Packaging of leadless components on continuous tapes . 3. IEC 60286-5 Packaging of components for automatic handling Part 5: Matrix trays . 5. IEC 61760-1, Surface mounting technology Part 1: Standard method for the specification of surface mounting components (S
7、MDs) . 1. 3 3.1 J- , . , SOJ/300 0,300 7,63 , SOJ/350 0,350 8,88 , SOJ/400 0,400 10,12 , SOJ/450 0,450 11,38 . 14 28. 1,27 . SOJ DIP-. J- , , J. J- . IEC 61188-5-42013 2 J- () , . 0,1 . , , 0,1 . SOJ , . , , . SOJ J- . , . 3.2 SOJ , IEC. 3.3 : - IEC 60286-3, - IEC 60286-4, - IEC 60286-5. - . 3.4 , ,
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