EN 62137-1-4-2009 en Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4 Cyclic bending test《表面安装技术 表面安装焊接接缝的环境和耐久性试验方法.pdf

《EN 62137-1-4-2009 en Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4 Cyclic bending test《表面安装技术 表面安装焊接接缝的环境和耐久性试验方法.pdf》由会员分享，可在线阅读，更多相关《EN 62137-1-4-2009 en Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4 Cyclic bending test《表面安装技术 表面安装焊接接缝的环境和耐久性试验方法.pdf（18页珍藏版）》请在麦多课文档分享上搜索。

1、Surface mounting technology Environmental and endurancetest methods for surface mountsolder joint Part 1-4: Cyclic bending testBS EN 62137-1-4:2009raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI British StandardsNational forewordThis British Stand

2、ard is the UK implementation of EN 62137-1-4:2009. It isidentical to IEC 62137-1-4:2009.The UK participation in its preparation was entrusted to Technical CommitteeEPL/501, Electronic assembly technology.A list of organizations represented on this committee can be obtained onrequest to its secretary

3、.This publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2009ISBN 978 0 580 59252 2ICS 31.190BRITISH STANDARDBS EN 62137-1-4:2009Compliance with a British Standard cannot confer immunity fromlegal obligations.This

4、 British Standard was published under the authority of the StandardsPolicy and Strategy Committee on 31 March 2009. Amendments issued since publicationAmd. No. Date Text affectedEUROPEAN STANDARD EN 62137-1-4 NORME EUROPENNE EUROPISCHE NORM February 2009 CENELEC European Committee for Electrotechnic

5、al Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: avenue Marnix 17, B - 1000 Brussels 2009 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 6213

6、7-1-4:2009 E ICS 31.190 English version Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test (IEC 62137-1-4:2009) Technologie de montage en surface - Mthodes dessais denvironnement et dendurance des joints brass monts e

7、n surface - Partie 1-4: Essai de flexion cyclique (CEI 62137-1-4:2009) Oberflchenmontage-Technik - Verfahren zur Prfung auf Umgebungseinflsse und zur Prfung der Haltbarkeit von Oberflchen-Ltverbindungen - Teil 1-4: Zyklische Biegeprfung (IEC 62137-1-4:2009) This European Standard was approved by CEN

8、ELEC on 2009-02-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standa

9、rds may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notif

10、ied to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania

11、, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 62137-1-4:2009EN 62137-1-4:2009 - 2 - Foreword The text of document 91/815/FDIS, future edition 1 of IEC 62137-1-4, prepared by IEC TC 91, Electronics

12、 assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62137-1-4 on 2009-02-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop)

13、 2009-11-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2012-02-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 62137-1-4:2009 was approved by CENELEC as a European Standard without any modifica

14、tion. _ BS EN 62137-1-4:2009- 3 - EN 62137-1-4:2009 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following referenced documents are indispensable for the application of this document. For dated references, only the edition

15、 cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60068-1 -1

16、)Environmental testing - Part 1: General and guidance EN 60068-1 19942)IEC 60194 -1)Printed board design, manufacture and assembly - Terms and definitions EN 60194 20062)IEC 61188-5 Series Printed boards and printed board assemblies - Design and use - Part 5: Attachment (land/joint) considerations E

17、N 61188-5 Series IEC 61190-1-2 -1)Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly EN 61190-1-2 20072)IEC 61190-1-3 -1)Attachment materials for electronic assembly - Part 1-3: Requirements for electronic

18、grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications EN 61190-1-3 20072)IEC 61249-2-7 -1)Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminated sheet of de

19、fined flammability (vertical burning test), copper-clad EN 61249-2-7 + corr. September 20022)2005 IEC 61760-1 -1)Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) EN 61760-1 20062)1)Undated reference. 2)Valid edition at date of issue. B

20、S EN 62137-1-4:2009 2 62137-1-4 IEC:2009 CONTENTS 1 Scope.5 2 Normative references .6 3 Terms and definitions .6 4 Test equipment and material 6 4.1 Test equipment for cyclic bending .6 4.2 Test substrate .7 4.3 Solder alloy .7 4.4 Solder paste7 4.5 Reflow soldering equipment 7 4.6 Surface mount com

21、ponent for testing 7 5 Mounting method7 6 Test conditions .8 6.1 Pre-treatment 8 6.2 Test procedures 8 6.3 Judging criteria9 7 Items to be included in the test report.9 8 Items to be prescribed in the product specifications9 Annex A (normative) Cyclic bending test equipment.11 Figure 1 Image drawing

22、 on evaluation area of joint strength.5 Figure 2 Typical reflow soldering profile.8 Figure A.1 Sample structure of substrate bending jig .12 Figure A.2 Sample structure of cyclic bending strength test .13 BS EN 62137-1-4:200962137-1-4 IEC:2009 5 SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANC

23、E TEST METHODS FOR SURFACE MOUNT SOLDER JOINT Part 1-4: Cyclic bending test 1 Scope The test method described in this part of IEC 62137 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between com

24、ponent leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate. In this test method, the evaluation req

25、uires first to mount the surface mount component on the substrate by reflow soldering, then cyclically bend the substrate to a certain degree of depth until fracture of the solder joints occurs. The properties of the solder joints (e.g, solder alloy, substrate, mounted device or design, etc.) are ev

26、aluated to assist in improving the strength of the solder joints. Component lead Substrate Enlarge Evaluation area Plated layers Substrate land Intermetallic compound layers Solder Substrate Component lead IEC 1174/07 Figure 1 Image drawing on evaluation area of joint strength BS EN 62137-1-4:2009 6

27、 62137-1-4 IEC:2009 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60

28、068-1, Environmental testing Part 1: General and guidance IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61188-5 (all parts 5), Printed boards and printed board assemblies Design and use Part 5: Attachment (land-joint) considerations IEC 61190-1-2, Attachment mat

29、erials for electronic assembly Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly IEC 61190-1-3, Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electron

30、ic soldering applications IEC 61249-2-7, Materials for printed boards and other interconnecting structures Part 2-7: Reinforced base materials clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad IEC 61760-1, Surface mounting technology P

31、art 1: Standard method for the specification of surface mounting components (SMDs) 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60194, IEC 60068-1 and IEC 61249-2-7 as well as the following apply. 3.1 cyclic bending strength intensity of the stren

32、gth, which is expressed in the number of cycles to attain the joint fracture between surface mount component terminals mounted on the printed board and the copper land of the substrate after bending the substrate cyclically to a certain degree to allow the surface of the component side of the board

33、to become a convex shape 3.2 displacement rate moving velocities of the indenter when cyclically bending the substrate 3.3 displacement range distance from the initial test position at the centre of the substrate to the maximum indentation caused by pushing the indenter down and by pulling it back 4

34、 Test equipment and materials 4.1 Test equipment for cyclic bending The equipment for cyclic bending tests consists of a tension compression testing machine, substrate bending jigs, a resistance measuring instrument and a recorder. The specifications shall comply with those of the cyclic bending tes

35、t equipment described in Annex A. BS EN 62137-1-4:200962137-1-4 IEC:2009 7 4.2 Test substrate Unless otherwise prescribed by the relevant product specifications, the test substrate shall meet the following conditions: a) Material: Epoxide woven, glass fabric, copper-clad laminated sheet, general pur

36、pose grade (see IEC 612492-7), with foil bonded to one side and a nominal thickness of the sheet, including the metal foil, of 1,6 mm with a tolerance of 0,20 mm. The copper foil should have a thickness of 0,035 mm 0,010 mm. b) Size: The size of the substrate depends on the size and shape of a surfa

37、ce mount device soldered on the substrate. The substrate shall be able to be fastened to the pull test equipment. c) Land geometry: The shape and size of a land shall comply with the IEC 61188-5 series or the pad geometry recommended by the respective component supplier. d) Surface protection: The s

38、olderable areas of the substrate (lands) shall be protected against oxidization by suitable means, for example by an organic surface protection layer (OSP). This protective layer shall not adversely effect the solderability of the lands under the soldering conditions of the reflow soldering equipmen

39、t. 4.3 Solder alloy Unless otherwise specified, the solder alloy shall consist of a ternary composition of Sn, Ag and Cu with the Ag content ranking from 3,0 % to 4,0 % by weight and the Cu content ranking from 0,5 % to 1,0 % by weight with Sn for balance, for example SnAg3,0Cu0,5. The solder alloy

40、shall be in accordance with IEC 61190-1-3. 4.4 Solder paste Unless otherwise stated in the relevant product specifications, solder paste should be chosen from IEC 61190-1-2. However, the solder to be used shall be the one specified in 4.3 above. 4.5 Reflow soldering equipment Unless otherwise prescr

41、ibed by the relevant product specifications, reflow-soldering equipment should be the one that can realize the temperature profile as shown in Figure 2. 4.6 Surface mount component for testing Unless otherwise prescribed by the relevant product specifications, the surface mount component shall have

42、the structure that enables the measurement of electrical resistance (for example, daisy chain). NOTE In connecting a daisy chain, care should be given to prevent breaking the wiring pattern, such as by drawing the wiring pattern forth from a shorter rather than a longer direction of the board. 5 Mou

43、nting method Unless otherwise prescribed by the relevant product specifications, the surface mount component shall be mounted on the substrate in the following sequence: a) Apply the solder paste specified in 4.4 to the lands of a test substrate as specified in 4.2, using a stainless steel mask that

44、 has openings of the same size, shape and configuration as the lands as specified in 4.2 c) with a thickness of 100 m to 150 m. b) Mount the test specimen on the test substrate with the printed solder paste. c) Perform soldering using the reflow soldering equipment specified in 4.5 and the solder pa

45、ste specified in 4.4 under the following conditions: typical temperature profile of reflow soldering is given in Figure 2 and as proposed in IEC 61760-1; the temperature shall be measured at the land. BS EN 62137-1-4:2009 8 62137-1-4 IEC:2009 300 250 200 150 100 50 0 0 30 60 90 120 150 180 210 240 2

46、70 300 330 360 220 C235 C245 C250 C180 C150 C TypicalRamp up rate 220 C SnAgCu Reflow Preheating Continous line: typical process (terminal temperaure) Dotted line: process limits. Bottom process limit (terminal temperature). Upper process limit (top surface temperature) Temperature CIEC 1176/07 Time

47、 s Figure 2 Typical reflow soldering profile 6 Test conditions 6.1 Pre-treatment Unless otherwise stated in the relevant product specifications, the specimen shall be left under standard atmospheric conditions, as specified in IEC 60068-1, for 4 h or more. 6.2 Test procedures Unless otherwise stated

48、 in the relevant product specifications, the following procedures should be followed: a) Fix the test substrate to the substrate bending jig in the following order: 1) First, solder the lead-wires to the terminals (daisy chain) used for monitoring electrical resistance on the substrate, and then con

49、nect the wires to a momentary interruption detector. 2) Make sure that the centre of the support jigs is evenly spaced (45 mm 0,5 mm) apart from the centre of the indenter. 3) Mount the substrate on the support jigs with the face down of the surface mount component side. Adjust the position to allow the indenter to push into the central part of the substrate. 4) Install anti-displacement jigs at both sides of the substrate, leaving no space between i