DLA SMD-5962-94554-1994 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY TTL 1-OF-16 DECODER DEMULTIPLEXER MONOLITHIC SILICON《硅单片 十六分之一解码器 信号分离器 改进型肖脱基TTL 双极数字微型电路》.pdf
《DLA SMD-5962-94554-1994 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY TTL 1-OF-16 DECODER DEMULTIPLEXER MONOLITHIC SILICON《硅单片 十六分之一解码器 信号分离器 改进型肖脱基TTL 双极数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-94554-1994 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY TTL 1-OF-16 DECODER DEMULTIPLEXER MONOLITHIC SILICON《硅单片 十六分之一解码器 信号分离器 改进型肖脱基TTL 双极数字微型电路》.pdf(16页珍藏版)》请在麦多课文档分享上搜索。
1、SMD-5962-94554 9999996 O059803 545 REV SHEET REV sHEE!r 15 RFN STAluS OF PMIC N/A STANDARDIZED MILITARY DRAWING THIS DRAUING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A PREPARED BY Larry T. Gauder _ CHECKED BY Thomas M. Hess APPROVED BY Monica L. Poetki
2、ng DRAUING APPROVAL DATE 94-03-14 REVISION LEVEL D-SE EXEEONICS SUPPLY CB?IER DAYTON, OHIO 45444 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, 1-OF-16 DECODER/DEMULTIPLEXER, MONOLITHIC SI LI CON SIZE I CAGE 0IX)E I A 67268 5962-94554 SHEET 1 OF 15 )ESC FORM 193 JUL 91 DISTRIIUTION STATEMENT
3、 A. Approved for public release; distribution is unlimited. 5962-E172-94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-1. SWPE 1.1 Scope. This drawing form a part of a one part - one part nunber docunentation system (see 6.6 herein). Two product as
4、surance classes consisting of military high reliability (device classes 9, and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Nunber (PIN). Device class M microcircuits represent non-JAN class B mi
5、crocircuits in accordance with 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883 in conjurction with conpliant non-JAM devices“. Uhm available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 pIw. The PIN shall be as shown in the following example: 9455
6、4 i i Federa 1 RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (se 1.2.5) li1 L / (see 1.2.3) / Drawing nunber STANDARD1 ZED MILITARY DRAWING 1.2.1 RHA desimator. Device classes M RHA marked devices shall meet the
7、 MIL-1-38535 appendix A specified RHA levels and shall be marked uith the appropriate RHA designator. Device classes Q and Y RHA marked devices shall meet the MIL-1-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-1 indicates a non-RHA device. 1.2.2 Device
8、 tw(s). The device type(s) shall identify the circuit function as follows: Device tme Generic nunber Circuit function o1 54F154 1 -of -16 decoder/demul t iplexer 1.2.3 Device class designator. The device class designator shall be a single letter identifying the product assurance level as folkom: SIZ
9、E A 5962-94554 . Oevice class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance uith 1.2.1 of MIL-STO-883 1.2. Q or V Certificat ion and qual if i cat i on to MIL- 1-38535 Case wtline(sl. Outline letter Descr iDt i ve de
10、si gnator Termi na 1 s Package style The case outLineCs) shall be as designated in MIL-STD-1835 and as folows: K L 3 GDFPZ-F24 or CFP3-F24 24 GDIP3-TZ4 or CDlP4-124 24 CPCCl-NZ8 28 flat package dual-in-line package square chip carrier package 1.2.5 Lead finish. The lead finish shall be as specified
11、in MIL-STD-883 (see 3.1 herein) for class M or MIL-1-38535 for classes Q and V. designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable uithout preference. Finish letter alX1a shall not be marked on the microcircuit or its packaging. The
12、“X“ I DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 I REVISION LEVEL 1 SHEETs DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-94554 9999996 0059803 318 1.3 Absolute maximun ratings. I/ Supply voltage range (Vc 1-
13、 - - - - - - - - - - - - - - - inpit voltage range (v,! - - - - - - - - - - - - - - - - Input current range (IIN) - - - - - - - - - - - - - - - - Voltage applied to output (VOUTI - - - - - - - - - - - - Current applied to output (I ) - - - - - - - - - - - - Storage tenperature range - w! - - - - - -
14、 - - - - - - - Lead temperature (soldering, 10 seconds) - - - - - - - - Junction temperature (TJ) - - - - - - - - - - - - - - - - Maxim power dissipation (P,): 2/- - - - - - - - - - - - Thermal resistance, junction-to-case (eJc) - - - - - - - 1.4 Recmended operating conditions. Supply voltage range
15、(Vcc)- - - - - - - - - - - - - - - - Maximum input clamp current, (iI )- - - - - - - - - - - - Maxim high Level output curren!, (I, 1- - - - - - - - - Maxim low level output current, (i 9 - - - - - - - - - High level input voltage, (VI 1 - - - - - - - - - - - - - LOW Level input voltage. CV, - - - -
16、 - - - - - - - - - Case operating tenperature range (TC) - - - - - - - - - Input rise and fall times, (tr, tf) 9LI - - - - - - - 1.5 Digitat losic testing for device classes P and V. Fault coverage measurement of manufacturing -0.5 V dc to +7.0 V dc -0.5 V dc to +7.0 V dc -30 mA to 5.0 niA -0.5 V to
17、 +Ycc 40 mA -65C to +15DaC +300C +17s0c 220 mw See MIL-STD-1835 4.5 V dc to 5.5 V dc -ia nd -1 fl 20 na 2.5 ns 2.0 v +0.8 V -55Oc to +125“C logic test; (MIL-STD-883, test method 5072) - - - - - - - - - - - - 3J percent 2. APPLICABLE DOCUMENTS 2.1 Government specification. standards, bulletin. and ha
18、ndbook. Unless otherwise specified, the following specification, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICA
19、TION Mi LITARY MIL-1-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS HILI TARY MIL-STO-883 - Test Methods and Procedures for Microelectronics. MIL-STD-973 - Configuration Management. MIL-STO-I835 - Microcircuit Case Outlines. I/ 2J z/ Stresses above the absolute maxi
20、mun rating may cause permanent damage to the device. maximun levels may degrade performance and affect reliability. Maxim power dissipation is defined as Vcc x Icc and must uithstand the added PD due to the short circuit output test (e.g., Values will be added when they become available. Extended op
21、eration at the 10s). STANDARD1 ZED MILITARY DRAWING I SIZE I A 5962-94554 I I DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 I REVISION LEVEL I SHEET3 DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-94554 9999996
22、0059804 254 STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 . HiLITARY MIL-BUL-103 - List of Standardized Military Drawings WIDS). SIZE A 5962-94554 REVISION LEVEL SHEET 4 HANDBOOK MLLITARY MIL-HDBK-780 - Standardized Military Drawings. (Copies of the specification
23、, standards, bulletin, and handbook required by manufacturers in connection with specif it acquisition functions should be obtained from the contracting activity or as directed by the contracting activity-) In the event of a conflict between the text of this drawing and the references cited herein,
24、the text of this drawing shall take precedence. 2.2 Order of precedence. 3. REWIREMENTS 3.1 Item requirements. The individual item requirements for device class N shall be in accordance with 1.2.1 of NIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“ a
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