DLA SMD-5962-92162 REV D-2012 MICROCIRCUIT HYBRID LINEAR DUAL REDUNDANT REMOTE TERMINAL BUS INTERFACE UNIT.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R057-95. 95-01-19 K. Cottongim B Made technical changes to table I for the IEE, VTH, VOUT, tf1, tr1, tf2, and tr2tests. Redrew entire document. -sld 97-08-07 K. Cottongim C Rewrite paragraphs 4.2.a.2. and 4.3.3
2、.b.2 to add TC. Table I, Output high voltage test condition, correct IOHfrom -3.4 mA to +3.4 mA. 04-07-16 Raymond Monnin D Updated drawing paragraphs. -sld 12-02-21 Charles F. Saffle REV SHEET REV SHEET REV STATUS REV D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPAR
3、ED BY Gary Zahn DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil/ STANDARD MICROCIRCUIT DRAWING CHECKED BY Michael C. Jones THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE APPROVED BY Kendall A. Cottongim MICROCIRCUIT, H
4、YBRID, LINEAR, DUAL REDUNDANT, REMOTE TERMINAL, BUS INTERFACE UNIT DRAWING APPROVAL DATE 93-03-08 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-92162 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E162-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS
5、-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92162 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and
6、 lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 - 92162 01 H X X Federal RHA Device Device Case Le
7、ad stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with
8、the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 BUS-63153 Small Terminal Interface Circuit (STIC), -15 V 02 BUS-63154 Small Terminal Interface Circ
9、uit (STIC), -12 V 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class
10、 G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space h
11、igh reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test)
12、 periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition
13、document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. Provided by IHSNot fo
14、r ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92162 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and
15、 as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 70 Plug-in package (ceramic) Y See figure 1 70 Flat pack (ceramic) 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ VDDsupply voltage range . -0.5 V dc
16、 to +7.0 V dc VEEsupply voltage range: Device type 01 -18 V dc to +0.3 V dc Device type 02 -15 V dc to +0.3 V dc Input voltage range -0.5 V dc to VDD+ 0.5 V dc Differential input voltage 2/ 50 Vp-p Storage temperature range -65 C to +150 C Power dissipation (PD) . 3/ Lead temperature (soldering, 10
17、seconds) +300 C Junction temperature (TJ) +160 C Thermal resistance, junction-to-case (qJC) . +5.54 C/W 1.4 Recommended operating conditions. VDDsupply voltage range . +4.5 V dc to +5.5 V dc VEEsupply voltage range: Device type 01 -15.75 V dc to -14.25 V dc Device type 02 -12.75 V dc to -11.25 V dc
18、Case operating temperature range (TC) -55 C to +125 C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these docu
19、ments are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1553 - Digital Time Division Command/Response Multiple
20、x Data Bus. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Applies between pins TX/RX A and
21、TX/RX A, and TX/RX B and TX/RX B. 3/ Power dissipation shall be as follows: Condition Device type 01 Device type 02 Hottest die (idle) 0.680 W 0.590 W Total hybrid idle 1.325 W 1.295 W Hottest die (50% duty cycle) 1.450 W 1.360 W Total hybrid (50% duty cycle) 2.575 W 2.220 W Provided by IHSNot for R
22、esaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92162 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawin
23、gs. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a con
24、flict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item p
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