DLA SMD-5962-90845 REV B-2003 MICROCIRCUIT LINEAR 8-BIT A D PERIPHERAL WITH SERIAL CONTROL MONOLITHIC SILICON《硅单块 带串控制的8比特模拟数字边缘的直线式微型电路》.pdf
《DLA SMD-5962-90845 REV B-2003 MICROCIRCUIT LINEAR 8-BIT A D PERIPHERAL WITH SERIAL CONTROL MONOLITHIC SILICON《硅单块 带串控制的8比特模拟数字边缘的直线式微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-90845 REV B-2003 MICROCIRCUIT LINEAR 8-BIT A D PERIPHERAL WITH SERIAL CONTROL MONOLITHIC SILICON《硅单块 带串控制的8比特模拟数字边缘的直线式微型电路》.pdf(14页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R222-92. 92-06-19 M. A. FRYE B Correction made to the title block on sheet 1. Drawing updated to reflect current requirements. -rrp 03-03-03 R. MONNIN THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
2、 REV SHET REV SHET REV STATUS REV B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Rick C. Officer DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E. Besore COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILAB
3、LE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, 8-BIT A/D PERIPHERAL WITH SERIAL CONTROL, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 91-04-29 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-90845 SHEET 1 OF 13 DSCC FORM 22
4、33 APR 97 5962-E260-03 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90845 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4321
5、6-5000 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflec
6、ted in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 90845 01 Q P X Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2) D
7、evice class designator Caseoutline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet
8、 the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Input/output clock frequency 0
9、1 TLC548M 8-bit analog-to-digital 2.048 MHz peripheral with serial control 02 TLC549M 8-bit analog-to-digital 1.1 MHz peripheral with serial control 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device r
10、equirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated i
11、n MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A f
12、or device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90845 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1
13、/ Supply voltage (VCC) . +6.5 V 2/ Input voltage range at any input -0.3 V to VCC+ 0.3 V Output voltage range . -0.3 V to VCC+ 0.3 V Peak input current range (any input) . 10 mA Peak total input current range (all inputs) . 30 mA Storage temperature range . -65C to +150C Case temperature for 60 seco
14、nds, case 2 +260C Lead temperature soldering, 1.6 mm (0.0625) from case for 60 seconds: Case P . +300C Power dissipation (PD), (TA +25C): 3/ Case P . 1050 mW Case 2 . 1375 mW Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case P . 110C/W Case
15、 2 . 1375C/W Junction temperature (TJ) . +150C 1.4 Recommended operating conditions. Supply voltage (VCC) . 4 V minimum, 6 V maximum Positive reference voltage (VREF+) 2.5 V minimum, VCC+ 0.1 V maximum 4/ Negative reference voltage (VREF-) . -0.1 V minimum, 2.5 V maximum 4/ Differential reference vo
16、ltage (VREF+), (VREF-) 1 V minimum, VCC+ 0.2 V maximum 4/ Analog input voltage 0 V minimum, VCCmaximum 4/ High level control input voltage (VIH) . 2 V minimum 5/ Low level control input voltage (VIL) 0.8 V maximum 5/ Input/output clock frequency fCLK(I/O): 5/ Device type 01 . 0 MHz minimum, 2.048 MH
17、z maximum Device type 02 . 0 MHz minimum, 1.1 MHz maximum Input/output clock high tWH(I/O): 5/ Device type 01 . 200 ns minimum Device type 02 . 404 ns minimum Input/output clock low tWL(I/O): 5/ Device type 01 . 200 ns minimum Device type 02 . 404 ns minimum Duration of CS input high state during co
18、nversion tWH(CS)17 s minimum 4/ 5/ Setup time, CS low before first I/O clock tSU(CS)1.4 s minimum 5/ 6/ Ambient operating free-air temperature (TA) . -55C to +125C 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may deg
19、rade performance and affect reliability. 2/ All voltage values are with respect to network ground terminal with the REF- and GND terminal connected together. 3/ Derate 8.4 mW/C above TA= +25C for case P and derate 11.0 mW/C above TA= +25C for case 2. 4/ Analog input voltages greater than that applie
20、d to REF+ convert to all ones (11111111), while input voltages less than that applied to REF- convert to all zeros (00000000). For proper operation, the positive reference voltage VREF+must be at least 1 V greater than the negative voltage VREF-. In addition, unadjusted errors may increase as the di
21、fferential reference voltage VREF+- VREF-falls below 4.75 V. 5/ VCC= 4.75 V to 5.5 V 6/ To minimize errors caused by noise at the CS input, the internal circuitry waits for two rising edges and one falling edge of internal system clock after CS falling edge before responding to control input signals
22、. This CS setup time is given by the tENand tSU(CS)specifications. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90845 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 4 DSCC
23、FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue o
24、f the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method S
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