DLA SMD-5962-89726 REV D-2006 MICROCIRCUIT DIGITAL CMOS I O EXPANDED MICROCONTROLLER MONOLITHIC SILICON《硅单片 I O扩大的微型处理器 氧化物半导体数字微型电路》.pdf

《DLA SMD-5962-89726 REV D-2006 MICROCIRCUIT DIGITAL CMOS I O EXPANDED MICROCONTROLLER MONOLITHIC SILICON《硅单片 I O扩大的微型处理器 氧化物半导体数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-89726 REV D-2006 MICROCIRCUIT DIGITAL CMOS I O EXPANDED MICROCONTROLLER MONOLITHIC SILICON《硅单片 I O扩大的微型处理器 氧化物半导体数字微型电路》.pdf（24页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Technical changes to 1.4 and table I. Convert to one-part one-part number format. Editorial changes throughout. 91-07-01 W. K. Heckman B Add case outline “M”. Technical changes to 1.3, 1.4, 1.6, and table I. Delete fault coverage requirement for

2、classes B and S. Editorial changes throughout. 92-03-04 Monica L. Poelking C Changes in accordance with NOR 5962-R174-93. 93-06-07 Monica L. Poelking D Update boilerplate to MIL-PRF-38535 requirements. - CFS 06-03-22 Thomas M. Hess THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET

3、REV D D D D D D D D D SHEET 15 16 17 18 19 20 21 22 23 REV STATUS REV D D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Tim H. Noh DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Tim H. Noh COLUMBUS, OHIO 43218-3990 http:/www.ds

4、cc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY William K. Heckman MICROCIRCUIT, DIGITAL, CMOS, I/O EXPANDED AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90-02-01 MICROCONTROLLER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-

5、89726 SHEET 1 OF 23 DSCC FORM 2233 APR 97 5962-E132-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89726 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 AP

6、R 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When

7、 available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 89726 01 M X X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lea

8、d finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA level

9、s and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 80C451 CMOS I/O expanded microcontroller 02 83C451 CMOS I/O expanded microcon

10、troller with a one time programmable EPROM 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-J

11、AN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X CDIP1-T64 6

12、4 Dual-in-line U CQCC1-N68 68 Square leadless chip carrier M GQCC1-J68 68 “J” lead chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking p

13、ermitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89726 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) to ground (VSS) -0.5 V dc to +6.5 V dc Voltage ran

14、ge from any pin to VSS-0.5 V dc to VCC+ 0.5 V dc Storage temperature range. -65C to +150C Maximum power dissipation (PD) 200 mW Lead temperature (soldering, 5 seconds) . +300C Maximum junction temperature (TJ) +200C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Data retention for device

15、 type 02 10 years minimum 1.4 Recommended operating conditions. Supply voltage range (VCC). +4.5 V dc to +5.5 V dc Case operating temperature range (TC) -55C to +125C Maximum low level input voltage (VIL) (except EA). 0.2 VCC 0.25 V dc Maximum low level input voltage (VIL) (EA) 0.2 VCC 0.45 V dc Min

16、imum high-level input voltage (VIH) (except XTAL1, RST) 0.2 VCC+ 1.1 V dc Minimum high-level input voltage (VIH) (XTAL1, RST) 0.7 VCC+ 0.2 V dc 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this dr

17、awing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-

18、883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at htt

19、p:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the t

20、ext of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may de

21、grade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89726 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3. REQUI

22、REMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or fun

23、ction as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall b

24、e as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3

25、.2.3 Block diagram. The block diagram shall be as specified on figure 2. 3.2.4 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified

26、 herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The el

27、ectrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer

28、has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1

29、Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certific

30、ate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-

31、103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirem

32、ents of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notifi

33、cation of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agen

34、t, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by t

35、his drawing shall be in microcircuit group number 105 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89726 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION L

36、EVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits Test Symbol Conditions -55C TC+125C 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups Device type Min Max Unit Output low voltage, port 1 6, AFLAG, BFLAG 1/ VOLIOL= 1.6 mA 0.45 V Output low voltag

37、e, port 0, ALE, PSEN 1/ VOL1IOL= 3.2 mA 0.45 V IOH= -60 A 2.4 IOH= -25 A 0.75 VCCOutput high voltage, port 1 6, AFLAG, BFLAG VOHIOH= -10 A 0.90 VCCV IOH= -400 A 2.4 IOH= -150 A 0.75 VCCOutput high voltage, port 0 in external bus mode, ALE, PSEN 2/ VOHIOH= -40 A VCC= 4.5 V, 5.5 V, VIN= VILmax, VIHmin

38、 0.90 VCCV Logic 0 input current, ports 1 6, AFLAG, BFLAG IILVCC= 5.5 V, VIN= 0.45 V 0.0 -75 A Logic 0 to 1 transition current ports 1 6, AFLAG, BFLAG ITLVCC= 5.5 V, VIN= 2.0 V 0.0 -750 A VIN= VCC0 10 Input leakage current, port 0, EA, IDS, ODS ILIVIN= 0.45 V VCC= 4.5 V, VCC= 5.0 V, VCC= 5.5 V 0 -10

39、 A Reset pull down resistor RRST1, 2, 3 All 25 300 k Pin capacitance CIOTest freq. = 1 MHz, See 4.4.1c 4 All 10 pF Power down current 3/ IPDVCC= 2 V to 6 V 1, 2, 3 All 75 A See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-

40、,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89726 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits Test Symbol Conditions -55C TC+125C 4.5 V VCC 5.5 V unless otherwise specified

41、 Group A subgroupsDevice type Min Max Unit Supply current, operating 4/ ICC1Freq. = 3.5 MHz VCC= 4.5 V 5/ CC= 5 V 5/ VCC= 5.5 V 5/ Freq. = 8 MHz VCC= 4.5 V 5/ CC= 5 V 5/ VCC= 5.5 V 5/ Freq. = 12 MHz VCC= 4.5 V CC= 5 V VCC= 5.5 V 8 10 12 13 19 21 20 25 30 mA Supply current, idle 6/ ICC2Freq. = 3.5 MH

42、z VCC= 4.5 V 5/ CC= 5 V 5/ VCC= 5.5 V 5/ Freq. = 8 MHz VCC= 4.5 V 5/ CC= 5 V 5/ VCC= 5.5 V 5/ Freq. = 12 MHz VCC= 4.5 V CC= 5 V VCC= 5.5 V 1, 2, 3 All 2.5 2.5 3.5 3.0 3.5 4.5 3.5 4.0 5.0 mA Functional test VCC = 4.5 V, See 4.4.1d 7, 8 All See footnotes at end of table. Provided by IHSNot for ResaleN

43、o reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89726 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits Test Symbol

44、Conditions -55C TC+125C 4.5 V VCC 5.5 V unless otherwise specified Group A subgroupsDevice type Min Max Unit AC Electrical Characteristics Oscillator frequency tCLCL1/ 3.5 12 MHz ALE pulse width tLHLL2tCLCL- 40 ns Address valid to ALE low tAVLLtCLCL- 55 ns Address hold after ALE low tLLAX CLCL- 35 n

45、s ALE low to valid instr. in tLLIV4tCLCL- 100 ns ALE low to PSEN low tLLPLtCLCL- 40 ns PSEN pulse width tPLPH3tCLCL- 45 ns PSEN low to valid instr. in tPLIV3tCLCL- 105 ns Input instr. hold after PSEN tPXIX0 Input instr. float after PSEN tPXIZtCLCL- 25 ns Address to valid instr. in tAVIV5tCLCL- 105 n

46、s PSEN low to address float tPLAZ25 RD pulse width tRLRH6tCLCL- 100 ns WR pulse width tWLWH CLCL- 100 ns RD low to valid data in tRLDV5tCLCL- 165 ns Data hold after RD tRHDX0 Data float after RD tRHDZSee figure 3. CL= 100 pF for port 0, ALE, PSEN. CL= 80 pF for all other outputs. VCC= 4.5 V 9, 10, 1

47、1 All 2tCLCL 70 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89726 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97

48、TABLE I. Electrical performance characteristics - Continued. Limits Test Symbol Conditions -55C TC+125C 4.5 V VCC 5.5 V unless otherwise specified Group A subgroupsDevice type Min Max Unit ALE low to valid data in tLLDV8tCLCL- 150 ns Address to valid data in tAVDV9tCLCL- 165 ns ALE low to RD or WR low tLLWL3tCLCL- 50 3tCLCL+ 50 ns Data valid to WR transition tQVWXtCLCL- 60 ns Data hold after WR tWHQX CLCL- 50 ns RD low to address float tRLAZ0 ns RD or WR high to ALE high tWHLHSee figure 3. CL= 100 pF for port 0, ALE, PSEN