DLA SMD-5962-88637 REV D-2010 MICROCIRCUIT MEMORY DIGITAL CMOS FIELD PROGRAMMABLE GATE ARRAY MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R005-91. 91-09-24 M. A. Frye B Changed the minimum clock period for device 02 from 45 to 40 ns. Boilerplate update. ksr 99-07-28 Raymond Monnin C Boilerplate update, part of 5 year review. ksr 05-09-29 Raymond
2、Monnin D Boilerplate update, part of 5 year review. ksr 10-11-10 Charles F. Saffle REV SHET REV SHET REV STATUS REV D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Rick Officer DLA LAND AND MARITIME STANDARD MICROCIRCUIT DRAWING CHECKED BY Raymond Monnin COLUM
3、BUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL APPROVED BY D. A. DiCenzo MICROCIRCUIT, MEMORY, DIGITAL, CMOS, FIELD PROGRAMMABLE GATE ARRAY, MONOLITHIC SILICON DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-07-28 AMSC N/A REVISION
4、 LEVEL D SIZE A CAGE CODE 67268 5962-88637 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E051-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88637 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL
5、 D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following examp
6、le: 5962- 88637 01 L A | | | | | | | | | | | | Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit function tPD01 20G10 24 Pin Generic CMOS
7、PLD 40 ns 02 20G10 24 Pin Generic CMOS PLD 30 ns 1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835, and as follows: Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 flat package L GDIP3-T24 or CDIP4-T24 24 dual-in-line package
8、3 CQCC1-N28 28 square leadless chip carrier package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range - -0.5 V dc to +7.0 V dc DC voltage applied to Outputs in High Z state range - -0.5 V dc to +7.0 V dc DC Input volta
9、ge - -3.0 V dc to +7.0 V dc DC program voltage - +14.0 V dc Maximum power dissipation 1/ - 1.0 W Lead temperature (soldering, 10 seconds) - +260C Thermal resistance, junction-to-case (JC): - See MIL-STD-1835 Junction temperature (TJ) 2/ - +150C Storage temperature range - -65C to +150C Temperature u
10、nder bias range - -55C to +125C 1.4 Recommended operating conditions. Supply voltage range (VCC) - +4.5 V dc to +5.5 V dc Ground voltage (GND) - 0 V dc High level input voltage range (VIH) - 2.0 V dc to VCCLow level input voltage range (VIL) - -0.5 V dc to +0.8 V dc Case operating temperature range
11、(TC) - -55C to +125C 1/ Must withstand the added PDdue to short circuit test (e.g., IOS). 2/ Maximum junction temperature may be increased to 175C during burn-in and steady state life. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIR
12、CUIT DRAWING SIZE A 5962-88637 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the exten
13、t specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method
14、Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dl
15、a.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing
16、in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.
17、 Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan
18、 and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance wit
19、h MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance
20、with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table (unprogrammed devices). The truth table for unprogrammed devices shall be as specified on figure 2. 3.2.4 Programmed devices. The truth table for programmed devices shall be s
21、pecified by an altered item drawing. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical
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