DLA SMD-5962-87612 REV F-2008 MICROCIRCUIT DIGITAL ADVANCED CMOS QUAD 2-INPUT NOR GATE MONOLITHIC SILICON.pdf

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1、REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device type 02. Add vendor CAGE 01295 for device type 02, cases E, F, and 2. Technical changes in section 1.4 and table I. Change drawing CAGE code to 67268. Editorial changes throughout. 89-08-11 M. A. Frye B Changes in accordance with NOR 59

2、62-R102-93. 93-03-23 Monica L. Poelking C Add vendor CAGE F8859. Add device class V criteria. Add table III, delta limits. Add case outline X. Update boilerplate. Editorial changes throughout. - LGT 00-10-23 Raymond Monnin D Add section 1.5, radiation features. Add appendix A, microcircuit die. Upda

3、te the boilerplate to MIL-PRF-38535 requirements and to include radiation hardness assured requirements. Editorial changes throughout. TVN 05-07-15 Thomas M. Hess E Correct wafer thickness in appendix A. - LTG 07-03-07 Thomas M. Hess F Add new device type 03 with V class criteria. For device type 01

4、 add footnote 8/ in section 1.5 and add Table IB for SEP test limits. Add paragraph 4.4.4.2 single event phenomena for device type 01. Update boilerplate to current requirements of MIL-PRF-38535. - MAA 08-12-19 Thomas M. Hess CURRENT CAGE CODE 67268 REV SHET REV F F F F F F F F F F F SHEET 15 16 17

5、18 19 20 21 22 23 24 25 REV F F F F F F F F F F F F F F REV STATUS OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Marcia B. Kellher CHECKED BY Monica Poelking DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY M. A. Frye DRAWING APPROVA

6、L DATE 87-05-26 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, QUAD 2-INPUT NOR GATE, MONOLITHIC SILICON SIZE A CAGE CODE 14933 5962-87612 STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A REVISION LEVEL F SHEET 1 OF 25 DSCC

7、FORM 2233 APR 97 5962-E006-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-87612 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope.

8、This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of R

9、adiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: For device classes M and Q: 5962 - 87612 01 C A Federal RHA Device Case Lead stock class designator type outline finish designator (see 1.2.1) (see 1.2.2) (see 1.2.4) (see 1.2.5)

10、/ / Drawing number For device class V: 5962 F 87612 01 V X A Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA mark

11、ed devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device

12、 type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54AC02 Quad 2-input NOR gate 02 54AC11002 Quad 2-input NOR gate 03 54AC02-SP Quad 2-input NOR gate 1.2.3 Device class designator. The device class designator is a single letter ident

13、ifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M

14、Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

15、IHS-,-,-SIZE A 5962-87612 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals

16、 Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack X CDFP3-F14 14 Flat pack 2 CQCC1-N20 20 Leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-385

17、35 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ 2/ 3/ 6/ Supply voltage range (VCC): Device type 01 and 02. -0.5 V dc to +7.0 V dc Device type 03. -0.5 V dc to +6.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC + 0.5 V dc DC output

18、 voltage range (VOUT). -0.5 V dc to VCC+ 0.5 V dc Clamp diode current (IIK, IOK for device 01 and 02) . 20 mA Input clamp current (IIK for device 03) at V VCC. 20 mA Output clamp current (IOK for device 03) at V 0 . 50 mA DC output current (IOUT). 50 mA DC VCCor GND current (per pin for device 01 an

19、d 02 ) 50 mA Continuous current through VCCor GND (for device 03 ) 100 mA Maximum power dissipation (PD). 500 mW Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds): Case outline X . +260C Other case outlines (except case outline X) +245C Thermal resistance, jun

20、ction-to-case (JC). See MIL-STD-1835 Junction temperature (TJ) +175C 4/ 1.4 Recommended operating conditions. 2/ 3/ 5/ 7/ Supply voltage range (VCC): Device type 01and 02 . +2.0 V dc to +6.0 V dc Device type 03. +1.5 V dc to +5.5 V dc Input voltage range (VIN) 0.0 V dc to VCCOutput voltage range (VO

21、UT) 0.0 V dc to VCCCase operating temperature range (TC) -55C to +125C Input rise or fall time rate (t/V): Device type 01and 02 at VCC= 3.6 V to 5.5 V . 0 to 8 ns/V Device type 03 at VCC= 3.6 V to 5.5 V 20 ns/V Maximum high level output current (IOH): Device type 03 at VCC= 4.5 V to 5.5 V -24 mA Max

22、imum low level output current (IOL): Device type 03 at VCC= 4.5 V to 5.5 V +24 mA Minimum high level input voltage (VIH) for device type 03: at VCC= 1.5 V 1.2 V at VCC= 3.0 V 2.1 V at VCC= 5.5 V 3.85 V Maximum low level input voltage (VIH) for device type 03: at VCC= 1.5 V 0.3 V at VCC= 3.0 V 0.9 V

23、at VCC= 5.5 V 1.65 V Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-87612 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 1.5 Radiation features. Devic

24、e type 01: Total dose (dose rate = 50 300 rads (Si)/s)300 krads (Si) Single Event Latchup (SEL) 93 MeV-cm2/mg 8/ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless

25、otherwise specified, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in scree

26、ning conditions in accordance with method 5004 of MIL-STD-883. 5/ Operation from 2.0 V dc to 3.0 V dc is provided for compatibility with data retention and battery back-up systems. Data retention implies no input transition and no stored data loss with the following conditions: VIH 70% VCC, VIL 30%

27、VCC, VOH 70% VCC -20 A, VOL 30% VCC 20 A. 6/ For device type 03 the input and output voltage rating may be exceeded provided the input and output current ratings are observed. 7/ All unused input for the device type 03 must be held at VCCor GND to ensure proper device operation. 8/ Limits are guaran

28、teed by design or process but not production tested unless specified by the customer through the purchase order or contract. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-87612 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBU

29、S COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the

30、 issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Sta

31、ndard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Docume

32、nt Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contr

33、act. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard No. 20 - Standard for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington

34、, VA 22201-3834.) AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM) ASTM F1192 - Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of semiconductor Devices. (Copies of these documents are available online at http:/www.astm.org or from ASTM Internatio

35、nal, 100 Barr Harbor Drive, P.O. Box C700, West Conshohocken, PA, 19428-2959). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable law

36、s and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) pla

37、n. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.1.1 Microcircuit die. For the req

38、uirements of microcircuit die, see appendix A to this document. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-87612 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FOR

39、M 2234 APR 97 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be

40、in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test

41、circuit. The switching waveforms and test circuit shall be as specified on figure 4. 3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon

42、request. 3.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post irradiation parameter limits are as specified in table IA and shall apply over the full case operating temperature range.

43、3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table IA. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be mar

44、ked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in

45、 accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall

46、be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificat

47、e of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers pro

48、duct meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA