DLA SMD-5962-87598 REV A-2006 MICROCIRCUIT LINEAR HIGH CURRENT NPN TRANSISTOR ARRAY MONOLITHIC SILICON《硅单块 晶体管阵列高电流NPN 直线型微型电路》.pdf

《DLA SMD-5962-87598 REV A-2006 MICROCIRCUIT LINEAR HIGH CURRENT NPN TRANSISTOR ARRAY MONOLITHIC SILICON《硅单块 晶体管阵列高电流NPN 直线型微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-87598 REV A-2006 MICROCIRCUIT LINEAR HIGH CURRENT NPN TRANSISTOR ARRAY MONOLITHIC SILICON《硅单块 晶体管阵列高电流NPN 直线型微型电路》.pdf（8页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update drawing to current requirements. Editorial changes throughout. - drw 06-09-22 Raymond Monnin THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED REV SHET REV SHET REV STATUS REV A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 PMIC N/A P

2、REPARED BY Joseph A. Kerby DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles Reusing COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, HIGH CURRENT NPN, AND AGENCIES OF

3、 THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-01-05 TRANSISTOR ARRAY, MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-87598 SHEET 1 OF 7 DSCC FORM 2233 APR 97 5962-E665-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,

4、-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87598 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MI

5、L-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87598 01 E A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type. The device type identifies the circuit function as follows:

6、Device type Generic number Circuit function 01 3183A High current NPN transistor array 1.2.2 Case outline. The case outline is as designated in MIL-STD-1835 as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 and CDIP2-T16 16 Dual-in-line 1.2.3 Lead finish. The lead

7、 finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Collector current 100 mA Base current 20mA Power dissipation (PD): Any one transistor 500 mW Total package. 750 mW 1/ Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal res

8、istance, junction-to-case (JC). See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Ambient operating temperature range (TA) -55C to +125C _ 1/ Derate linearly above TA= +25C at 6.67 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without

9、 license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87598 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and ha

10、ndbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT

11、 OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documen

12、ts are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the

13、references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF

14、-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be proces

15、sed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect for

16、m, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, constructio

17、n, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics.

18、 Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrica

19、l tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number i

20、s not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” sha

21、ll be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87598 DEFENSE SUPPLY CENTER

22、 COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxCollector-substrate breakdown voltage BVCSOIC= 100 A 1,

23、 2, 3 01 50 V Collector-base breakdown voltage BVCBOIC= 100 A 1, 2, 3 01 50 V Collector-emitter breakdown voltage BVCEOIC= 1.0 mA 1, 2, 3 01 40 V Collector cutoff current ICEOVCE= 10 V 1, 2, 3 01 10 A Collector cutoff current ICBOVCB= 10 V 1, 2, 3 01 1 A Input offset voltage VIOVCE= 3 V, IC= 1 mA 1,

24、 2, 3 01 5 mV Input offset current IIOVCE= 3 V, IC= 1 mA 1, 2, 3 01 2.5 A Emitter-base breakdown voltage BVEBOIE= 100 A 1, 2, 3 01 5.0 V DC forward current transfer ratio hFEVCE= 3.0 V, IC= 10 mA 1 01 50 2, 3 40 VCE= 5.0 V, IC= 50 mA 1 40 2, 3 35 Collector-emitter saturation voltage VCE(SAT) IC= 50

25、mA, IB= 5.0 mA, TA= +25C 1 01 3.0 V Base to emitter voltage VBEVCE= 3.0 V, IC= 10 mA 1 01 0.65 0.86 V 2, 3 0.5 0.9 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87598 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS

26、, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 Device type 01 Case outline E Terminal number Terminal symbol 1 C1 2 C2 3 B2 4 E2 5 SUBSTRATE 6 B3 7 C3 8 E3 9 C4 10 B4 11 E4 12 E5 13 B5 14 C5 15 E1 16 B1 NOTE: The collector of each transistor is isolated from the substrate by an int

27、egral diode which must be reverse biased by connecting the substrate to a voltage more negative than any collector. To prevent undesired coupling between transistors, the substrate connection should be connected to an ac or dc ground. FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo r

28、eproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87598 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 3.6 Certificate of compliance. A certificate of compliance shall be required from a

29、 manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A an

30、d the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change

31、that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer 4. VERIFICATION 4.1

32、 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional

33、 criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall

34、 specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tes

35、ts prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) 1 Final electrical test parameters (method 5004)

36、1*, 2, 3 Group A test requirements (method 5005) 1, 2, 3 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87598

37、 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional cri

38、teria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II he

39、rein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit s

40、hall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. T

41、he requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability

42、. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordinatio

43、n will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this

44、 list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or teleph

45、one (614) 692-0547. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. Provided by IHSNot for ResaleNo re

46、production or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 06-09-22 Approved sources of supply for SMD 5962-87598 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. M

47、IL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK

48、-103 and QML-38535. DSCC maintains an online database of all current sources of supply at http:/www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8759801EA 3/ SG3183AJ/883B 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not s