DLA SMD-5962-87570 REV E-2007 MICROCIRCUIT DIGITAL PROGRAMMABLE PERIPHERAL INTERFACE MONOLITHIC SILICON《硅单块 可编程序外围接口数字微型电路》.pdf
《DLA SMD-5962-87570 REV E-2007 MICROCIRCUIT DIGITAL PROGRAMMABLE PERIPHERAL INTERFACE MONOLITHIC SILICON《硅单块 可编程序外围接口数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-87570 REV E-2007 MICROCIRCUIT DIGITAL PROGRAMMABLE PERIPHERAL INTERFACE MONOLITHIC SILICON《硅单块 可编程序外围接口数字微型电路》.pdf(16页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Technical changes to table I. Editorial changes throughout. 92-10-27 Monica L. Poelking B Changes in accordance with NOR 5962-R019-99. 99-01-28 Monica L. Poelking C Incorporated revision B and updated boilerplate and editorial changes throughout.
2、 Added Rochester Electronics as source of supply CAGE code 3V146. - LTG 00-10-19 Thomas M. Hess D Update boilerplate to MIL-PRF-38535 requirements. - LTG 01-04-02 Thomas M. Hess E Update boilerplate to current MIL-PRF-38535 requirements. - CFS 07-06-25 Thomas M. Hess REV SHET REV E SHET 15 REV STATU
3、S REV E E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Ray Monnin DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMEN
4、TS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, PROGRAMMABLE AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 87-07-02 PERIPHERAL INTERFACE, MONOLITHIC SILICON AMSC N/A REVISION LEVEL SIZE A CAGE CODE 67268 5962-87570 E SHEET 1 OF 15 DSCC FORM 2233 APR 97 5962-E508-07 Provided by IH
5、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87570 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements f
6、or MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87570 01 Q X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.
7、2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 8255A Programmable peripheral interface 02 8255A-5 Programmable peripheral interface 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as f
8、ollows: Outline letter Descriptive designator Terminals Package style Q GCIP1-T40 or CDIP2-T40 40 Dual-in-line X CQCC1-N44 44 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range . -0.5 V dc t
9、o +7.0 V dc Input voltage range . -0.5 V dc to +7.0 V dc Storage temperature range . -65C to +150C Maximum power dissipation (PD) . 1.0 W 1/ Thermal resistance, junction-to-case (JC): Case Q . See MIL-STD-1835 Case X . See MIL-STD-1835 Junction temperature (TJ) +126.9C Lead temperature (soldering, 1
10、0 seconds) +300C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +5.0 V dc 10 percent Minimum high level input voltage (VIH) +2.2 V dc Maximum low level input voltage (VIL) . +0.8 V dc Minimum low level input voltage (VIL) -0.5 V dc Maximum high level input voltage (VIH) . +5.5 V
11、dc Case operating temperature range (TC) -55C to +125C _ 1/ Must withstand the added PDdue to short circuit test (e.g., IOS). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87570 DEFENSE SUPPLY CENTER COLUMB
12、US COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, th
13、e issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface S
14、tandard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or
15、from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, howe
16、ver, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to thi
17、s drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activ
18、ity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herei
19、n. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. This drawing has been modified to allow the manufacturer to use the alternate die/fabrication requirements of paragraph A.3.2.2 of MIL-PRF-38535 or other alternative approv
20、ed by the qualifying activity. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connectio
21、ns. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Block diagram. The block diagram shall be as specified on figure 3. 3.2.5 Timing waveforms. The timing waveforms shall be as specified on figure 4. 3.3 Electric
22、al performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specifie
23、d in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87570 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E
24、SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to
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