DLA SMD-5962-84161 REV B-2009 MICROCIRCUIT DIGITAL LOW POWER SCHOTTKY TTL BUS TRANSCEIVER MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. Replaced reference to MIL-STD-973 with reference to MIL-PRF-38535. Added class V requirements. Updated table II. - gt 03-12-15 R. Monnin B Update drawing to current requirements. Editorial changes

2、throughout. - gap 09-09-10 Charles F. Saffle CURRENT CAGE CODE 67268 The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY David W. Queenan DEFENSE SUPPLY CENTER COLUMBUS COLUMBU

3、S, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY D. A. DiCenzo APPROVED BY N.A. Hauck MICROCIRCUIT, DIGITAL, LOW POWER SCHOTTKY TTL, BUS TRANSCEIVER, MONOLITHIC SILICON DR

4、AWING APPROVAL DATE 85-07-05 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 14933 84161 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E247-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84161 DEFENSE SUPPLY CENTER COLU

5、MBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are

6、available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 84161 01 R X Drawing number Device type (see 1.2.2)

7、Case outline (see 1.2.4)Lead finish (see 1.2.5)For device class V: 5962 - 84161 01 V R X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Devic

8、e classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a no

9、n-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS640 Octal bus transceiver with three-state outputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product

10、 assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certif

11、ication to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD M

12、ICROCIRCUIT DRAWING SIZE A 84161 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-

13、T20 or CDIP2-T20 20 Dual-in-line package S GDFP2-F20 or CDFP3-F20 20 Flat package 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings.

14、Supply voltage range -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at -18 mA to +7.0 V dc Storage temperature . -65C to +150C Maximum power dissipation (PD) 1/ 522.5 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction tempera

15、ture (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.5 V dc Case operating temperature range (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Gov

16、ernment specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFIC

17、ATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard

18、 Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In

19、 the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Must withstand the added PDdue to sh

20、ort circuit test (e.g., IOS). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84161 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item

21、requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as describe

22、d herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

23、 MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table.

24、 The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradia

25、tion parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Markin

26、g. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA pr

27、oduct using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device cl

28、asses Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufac

29、turer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to

30、DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of co

31、nformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notificati

32、on to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manuf

33、acturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 9 (see MIL-PRF-38

34、535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84161 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance chara

35、cteristics. Test Symbol Conditions -55C TC +125C Group A subgroups Limits Unit unless otherwise specified Min Max High level output voltage VOH1VCC= 4.5 V, IOH= -3 mA 1, 2, 3 2.4 V VOH2VCC= 4.5 V, IOH= -12 mA 1, 2, 3 2.0 Low -level output voltage VOLVCC= 4.5 V, IOL= 12 mA 1, 2, 3 0.4 V Input clamp v

36、oltage VICVCC= 4.5 V, IIN= -18 mA 1 -1.5 V High level input current IIH1VCC= 5.5 V, VIN= 2.7 V A, B, DIR or G 1, 2, 3 20 A IIH2VCC= 5.5 V, VIN= 7 V DIR or G 100 IIH3VCC= 5.5 V, VIN= 5.5 V A or B 100 Low-level input current IILVCC= 4.5 V, VIN= 0.4 V 1, 2, 3 -4 mA Short-circuit output current 1/ IOSVC

37、C= 5.5 V, VOUT= 0.0 V 1, 2, 3 -40 -225 mA Supply current ICCHVCC= 5.5 V, outputs open 1, 2, 3 70 mA ICCL90 ICCZ95 High level output current IOH1, 2, 3 -12 mA Low level output current IOL1, 2, 3 12 mA Off-state output current, high-level voltage applied IOZHVCC= 5.5 V, VOUT= 2.7 V 1, 2, 3 20 A Off-st

38、ate output current, low-level voltage applied IOZLVCC= 5.5 V, VOUT= 0.4 V 1, 2, 3 -400 A Functional tests See 4.4.1c 7, 8 Propagation delay time, A to B tPLH1VCC= 5.0 V, CL= 50 pF 10%, 9 10 ns 10, 11 14 tPHL1RL= 667 5% 9 15 10, 11 21 Propagation delay time, B to A tPLH29 10 10, 11 14 tPHL215 10, 11

39、21 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84161 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical p

40、erformance characteristics Continued. Test Symbol Conditions -55C TC +125C Group A subgroups Limits Unit unless otherwise specified Min Max Output disable time G , DIR to A tPZL1VCC= 5.0 V, CL= 50 pF 10%, 9 40 ns 10, 11 56 tPZH1RL= 667 5% 9 40 10, 11 56 Output enable time G , DIR to B tPZL29 40 10,

41、11 56 tPZH240 10, 11 56 Output enable time G , DIR to A tPLZ19 32 10, 11 41.6 tPHZ132 10, 11 41.6 Output disable time G , DIR to B tPLZ29 32 10, 11 41.6 tPHZ232 10, 11 41.6 1/ Not more than one output should be shorted at a time, and the duration of the short circuit condition should not exceed one

42、second. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84161 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outlines R, S, and 2 Termin

43、al number Terminal symbol 1 DIR 2 A1 3 A2 4 A3 5 A4 6 A5 7 A6 8 A7 9 A8 10 GND 11 B8 12 B7 13 B6 14 B5 15 B4 16 B3 17 B2 18 B1 19 ENABLE G 20 VCCFIGURE 1. Terminal connections. CONTROL INPUTS OPERATION G DIR L L B data to A bus L H A data to B bus H X ISOLATION H = High level L = Low level X = Irrel

44、evant FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84161 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. P

45、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84161 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device

46、classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and ins

47、pection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening

48、shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power diss