DLA SMD-5962-84070 REV E-2011 MICROCIRCUIT DIGITAL HIGH-SPEED CMOS DUAL 2-BIT TRANSPARENT LATCH MONOLITHIC SILICON.pdf
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1、 - REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED B Convert to military drawing format. Add vendor CAGE no. 27014 to case 2. Add terminal connections for case 2 to figure 1 88-02-05 M. A. Frye C Update boilerplate to MIL-PRF-38535 requirements. - CFS 01-11-07 Thomas M. Hess D Made change to para
2、graph 3.5. Update boilerplate to MIL-PRF-38535 requirements. - LTG 05-03-18 Thomas M. Hess E Correct the expression of IOfor VOHand VOLin table I. Update boilerplate - jak 11-07-21 Thomas M. Hess Current CAGE Code is 67268 REV SHET REV SHET REV STATUS REV E E E E E E E E E E E E E OF SHEETS SHEET 1
3、2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Greg A. Pitz DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael. A. Frye MICROCIRCUIT, DIGIT
4、AL, HIGH-SPEED CMOS, DUAL 2-BIT TRANSPARENT LATCH, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 84-10-05 AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 14933 84070 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E378-11 .Provided by IHSNot for ResaleNo reproduction or netw
5、orking permitted without license from IHSSTANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 84070 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcirc
6、uits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 84070 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circ
7、uit function as follows: Device type Generic number Circuit function 01 54HC75 Dual 2-bit transparent latch 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-l
8、ineF GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC
9、+ 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc Clamp diode current. 20 mA DC output current (per pin) 25 mA DC VCCor GND current (per pin) . 50 mA Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 500 mW 4/ Lead temperature (soldering, 10 secon
10、ds) +260C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 5/ _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless other
11、wise specified, all voltages are referenced to ground. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ For TC= +100C to +125C, derate linearly at 12 mW/C. 5/ Maximum junction temperature shall not be excee
12、ded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. Provided by IHSNot for Resale-,-,-STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 84070 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommen
13、ded operating conditions. 1/ 2/ Supply voltage range (VCC) +2.0 V dc to +6.0 V dc Case operating temperature range (TC) . -55C to +125C Input rise or fall time: VCC= 2.0 V . 0 to 1000 ns VCC= 4.5 V . 0 to 500 ns VCC= 6.0 V . 0 to 400 ns Minimum setup time, data to enable (tS): 3/ At +25C: VCC= 2.0 V
14、 . 100 ns VCC= 4.5 V . 20 ns VCC= 6.0 V . 17 ns At -55C to +125C: VCC= 2.0 V . 150 ns VCC= 4.5 V . 30 ns VCC= 6.0 V . 26 ns Minimum enable pulse width (tW): 3/ At +25C: VCC= 2.0 V . 80 ns VCC= 4.5 V . 16 ns VCC= 6.0 V . 14 ns At -55C to +125C: VCC= 2.0 V . 120 ns VCC= 4.5 V . 24 ns VCC= 6.0 V . 21 n
15、s Minimum hold time, enable to data (tH): 3/ At +25C: VCC= 2.0 V . 25 ns VCC= 4.5 V . 5 ns VCC= 6.0 V . 5 ns At -55C to +125C: VCC= 2.0 V . 40 ns VCC= 4.5 V . 8 ns VCC= 6.0 V . 7 ns _ 1/ Unless otherwise specified, all voltages are referenced to ground. 2/ The limits for the parameters specified her
16、ein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 3/ See figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHSSTANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 SIZE A 84070 REVIS
17、ION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are th
18、ose cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case
19、Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Aven
20、ue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLO
21、GY ASSOCIATION (JEDEC) JESD 7-A - Standard for Description of 54/74HCXXXX and 54/74HCTXXXX High-Speed CMOS Devices (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201.) 2.3 Or
22、der of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1
23、Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manu
24、facturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may
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