DLA SMD-5962-09240 REV A-2012 MICROCIRCUIT DIGITAL-LINEAR 12 BIT 1 GSPS ANALOG TO DIGITAL CONVERTER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Figure 1, case outline X, corrected the “e” dimension. Updated drawing to remove class M requirements. - drw 12-07-25 Charles F. Saffle REV SHEET REV A A A A A A A A A A SHEET 15 16 17 18 19 20 21 22 23 24 REV STATUS REV A A A A A A A A A A A A A
2、 A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Dan Wonnell DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Raj Pith
3、adia APPROVED BY Charles F. Saffle MICROCIRCUIT, DIGITAL-LINEAR, 12 BIT, 1 GSPS, ANALOG TO DIGITAL CONVERTER, MONOLITHIC SILICON DRAWING APPROVAL DATE 11-07-01 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-09240 SHEET 1 OF 24 DSCC FORM 2233 APR 97 5962-E416-12 Provided by IHSNot for ResaleNo
4、 reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-09240 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting o
5、f high reliability (device classes Q) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. T
6、he PIN is as shown in the following example: 5962 - 09240 01 V X C Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RH
7、A marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type. The device type identifies the circuit function as follows: Device type Generic number Circuit function 01 ADS5400-SP 12 bit, 1 G
8、SPS, analog to digital converter 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline. The case outli
9、ne is as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 100 Ceramic nonconductive tie-bar package 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535. Provided by IHSN
10、ot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-09240 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/, 2/ Supply voltage: 5 V analog supply volt
11、age (AVDD5) to ground (GND) 6 V 3 V analog supply voltage (AVDD3) to GND 5 V 3 V digital supply voltage (DVDD3) to GND . 5 V AINP, AINN to GND (voltage difference between pin and ground) 0.5 V to 4.5 V 3/ AINP to AINN (voltage difference between pins, common mode at AVDD5/2 ): 3/ Short duration . -0
12、.3 V to (AVDD5 + 0.3 V) Continuous AC signal . 1.25 V to 3.75 V Continuous DC signal . 1.75 V to 3.25 V CLKINP, CLKINN to GND (voltage difference between pin and ground) . 0.5 V to 4.5 V 3/ CLKINP to CLKINN (voltage difference between pins, common mode at AVDD5/2 ): 3/ Continuous AC signal . 1.1 V t
13、o 3.9 V Continuous DC signal . 2 V to 3 V RESETP, RESETN to GND (voltage difference between pin to ground) . -0.3 V to (AVDD5 + 0.3 V) 3/ RESETP to RESETN (voltage difference between pins): 3/ Continuous AC signal . 1.1 V to 3.9 V Continuous DC signal . 2 V to 3 V Data/OVR outputs to GND (voltage di
14、fference between pin and ground) -0.3 V to (DVDD3 + 0.3 V) 3/ SDENB, SDIO, SCLK to GND (voltage difference between pin and ground) . -0.3 V to (AVDD3 + 0.3 V) 3/ ENA1BUS, ENPWD, ENEXTREF to GND (voltage difference between pin and ground) -0.3 V to (AVDD5 + 0.3 V) 3/ Maximum junction temperature (TJ)
15、 . 150C Storage temperature range -65C to +150C Electrostatic discharge (ESD) rating: Human body model (HDM) . 2 kV Thermal resistance, junction-to-case (JC) 0.849C/W Thermal resistance, junction-to-ambient (JA) . 21.81C/W 1.4 Recommended operating conditions. Supply voltage: AVDD5 to GND . 4.75 V t
16、o 5.25 V AVDD3 to GND . 3.135 V to 3.465 V DVDD3 to GND 3.135 V to 3.465 V Analog input: Full scale differential input range 1.52 VPPto 2 VPPDigital output: Differential output load 5 pF Clock (CLK) input: CLK input sample rate (sine wave) . 100 MSPS to 1000 MSPS Clock amplitude, differential 0.6 VP
17、Pto 1.5 VPPClock duty cycle 45% to 55% Case operating temperature range (TC) -55C to +125C _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ This package has built in v
18、ias that electrically and thermally connect the bottom of the die to a pad on the bottom of the package. To efficiently remove heat and provide a low impedance ground path, a thermal land is required on the surface of the printed circuit board (PCB) directly underneath the body of the package. Durin
19、g normal surface mount flow solder operations, the heat pad on the underside of the package is soldered to this thermal land creating an efficient thermal path. Normally, PCB thermal land has a number of thermal vias within it that provide a thermal path to internal copper areas (or to the opposite
20、side of the PCB) that provide for more efficient heat removal. The manufacturer recommends an 11.9 mm2board mount thermal pad. This allows maximum area for thermal dissipation, while keeping leads away from the pad area to prevent solder bridging. A sufficient quantity of thermal/electrical vias mus
21、t be included to keep the device within recommended operating conditions. This pad must be electrically at ground potential. 3/ Valid when supplies are within recommended operating range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICRO
22、CIRCUIT DRAWING SIZE A 5962-09240 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the ex
23、tent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Meth
24、od Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dla.
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