DLA MIL-DTL-3933 29 A-2011 ATTENUATORS FIXED SPACE LEVEL NON SPACE LEVEL CHIP (SURFACE MOUNT) 0-20 DB FREQUENCY RANGE DC TO 18 GHZ CLASS IV.pdf
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1、AMSC N/A FSC 5985 MIL-DTL-3933/29A 27 September 2011 SUPERSEDING MIL-DTL-3933/29 1 August 2006 DETAIL SPECIFICATION SHEET ATTENUATORS, FIXED, SPACE LEVEL, NON SPACE LEVEL, CHIP, (SURFACE MOUNT), 0-20 DB, FREQUENCY RANGE: DC TO 18 GHZ. CLASS IV This specification is approved for use by all Department
2、s and Agencies of the Department of Defense. The requirements for acquiring the product described herein shall consist of this specification sheet and MIL-DTL-3933. Symbol Inches mm Min Max Min Max A B C D E F G H .145 .120 .059 .0285 .019 .013 .013 .013 .149 .124 .063 .0385 .023 .017 .017 .017 3.68
3、 3.05 1.50 0.724 0.48 0.33 0.33 0.33 3.78 3.15 1.60 0.978 0.58 0.43 0.43 0.43 NOTES: 1. Dimensions are in inches; metric equivalents are in parentheses. 2. Laser mark the dB value using height of .010. 3. Tolerances: Decimals: .010 (0.25 mm) for one decimal point, .005 (0.13 mm) for two decimal poin
4、ts and .002 (0.05 mm) for three decimal points. 4. Topology of resistor is determined by independent manufacturers design. FIGURE 1. Dimensions and configurations for PIN M3933/29-01 through M3933/29-40. INCH-POUND Provided by IHSNot for ResaleNo reproduction or networking permitted without license
5、from IHS-,-,-MIL-DTL-3933/29A 2 ENGINEERING DATA: Drop-in surface mountable chip attenuators. Part or Identifying Number (PIN): PINs to be used for surface mount chip fixed attenuators acquired to this specification sheet are created as follows: M 3933 /29- 01 X Y1Y2Z M prefix Specification Specific
6、ation Dash number Suffix letter Critical interface Quality level number sheet number identifier T or S Suffix letter (as assigned in QPL-3933): The suffix letter in the above PIN shall be incorporated to denote the chip manufacturer. Critical interface identifier: Assigned consistent with MIL-DTL-39
7、33. Y1 should identify what metal is used: aluminum (A), copper (C), gold (G), nickel (N); Y2should identify body style used: open bond pads (P), welded leads already attached (L), wrap around leads (W). Quality level: (T) space level or (S) military level is assigned and consistent with MIL-DTL-393
8、3 Appendix C. Materials: Substrate: 99.5 percent alumina. Resistive film: Tantalum nitride stabilized for 30 minutes minimum at 300C minimum. Terminal pads: Copper, nickel and gold. Finishes: Terminal: Final coating is Sn62 and may be fused or solder dipped (as restricted, see 1/ below). To preclude
9、 gold embrittlement (see footnote 2/) and for other finishes (see footnote 3/, 4/ and 5/). Marking: Substrate: Laser mark attenuator slash value as shown in figure 1 on top and bottom of substrate. 2eight of marking shall be .010 inch (0.25 mm). Also, laser mark “suffix letter” (from PIN above). Ope
10、rating frequency range: DC to 18 gigahertz (GHz). Operating temperature range: -55C to +125C. Note: Power input is derated linearly to 0.5 watt at +125C. _ 1/ The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin content of surface mount chip fixed
11、attenuator components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a
12、 day to years after manufacture and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have been shown to inhibit the gr
13、owth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 2/ A suitable amount of Sn62 solder shall be used over gold terminals to insure all Gold (Au) is dissolved from the pad or Gold (Au) pads shall not be us
14、ed. 3/ Gold/Tin (Au/Sn) solders utilization shall be specified by the acquiring activity. 4/ Lead content may be exempted when using high temperature Gold/Tin (Au/Sn) or Silver/Tin (Ag/Sn) solders. 5/ Termination pads shall not be solder coated if weld wire bonded. Provided by IHSNot for ResaleNo re
15、production or networking permitted without license from IHS-,-,-MIL-DTL-3933/29A 3 REQUIREMENTS: Dimensions and configuration: See figure 1. Nominal impedance: 50 ohms. Attenuation: See table I. Stability and sensitivity: Maximum change in attenuation after: Attenuation change maximum (dB) Temperatu
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