DLA DSCC-VID-V62 11607 REV B-2011 MICROCIRCUIT DIGITAL PHASE DETECTOR FREQUENCY SYNTHESIZER MONOLITHIC SILICON.pdf
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1、 REVISIONSLTR DESCRIPTION DATE APPROVEDPrepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Phu H. Nguyen DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Original date of drawing YY MM DD CHECKED BY Phu H
2、. Nguyen TITLE MICROCIRCUIT, DIGITAL, PHASE DETECTOR/ FREQUENCY SYNTHESIZER, MONOLITHIC SILICON 11-01-19 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/11607 REV PAGE 1 OF 10 AMSC N/A 5962-V028-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without licen
3、se from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/11607 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance Phase detector/ Frequency synthesizer microcircuit, with an operating temperature range of -55C to +
4、125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturer,s PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/11607 - 01 X B Drawing Device type Case outline Lead
5、finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 ADF4002-EP Phase detector/ Frequency synthesizer 1.2.2 Case outline(s). The case outlines are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 16 JEDEC MO-15
6、3 Lead Thin Shrink Small Outline Package 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead plateC Gold plateD PalladiumE Gold flash palladium Z Other Provided by IHSNot f
7、or ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/11607 REV PAGE 3 1.3 Absolute maximum ratings. 1/ Voltage referenced : AVDDto GND 2/ . -0.3 V to +3.6 V AVDDto DVDD. -0.3 V to +0.3 V VPto GND 2/
8、 . -0.3 V to +5.8 V VPto AVDD-0.3 V to +5.8 V Digital I/O voltage to GND 2/ . -0.3 V to DVDD+ 0.3 V Analog I/O voltage to GND 2/ -0.3 V to VP+ 0.3 V REFIN, RFINA, REFINB to GND 2/ . -0.3 V to AVDD+ 0.3 V Ambient operating temperature range . -55C to +125C Storage temperature range . -65C to +150C Ma
9、ximum junction temperature (TJ) 150C Lead temperature, soldering: Vapor phase (60 sec) 215C Infrared (15 sec) . 220C Transistor count: CMOS 6425 Bipolar 303 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to
10、 the Electronic Industries Alliance, North 10thSt., Suite 240-S, Arlington, VA 22201-2107 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE
11、 code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical
12、 performance characteristics are as specified in 1.3, 1.4, and table I herein. 1/ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond thos
13、e indicated under “recommended operating conditions” is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 2/ GND = AGND = DGND = 0 V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAN
14、D AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/11607 REV PAGE 4 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure
15、 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Functional block diagram. The functional block diagram shall be as shown in figure 3. 3.5.4 Timing diagrams. The timing diagrams shall be as shown in figure 4. Provided by IHSNot for ResaleNo reproduction o
16、r networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/11607 REV PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Symbol Test conditions 2/ unless otherwise specified Limits Unit Min Max RF characteristics RF in
17、put sensitivity -10 0 dBm RF Input frequency RFINFor RFIN4V/s 5 400 MHz REFINcharacteristics REFINinput frequency For REFIN50 V/s 20 300 MHz REFINinput sensitivity 3/ Biased at AVDD/2 (ac coupling ensures AVDD/2 bias) 0.8 AVDDVp-p REFINinput capacitance 10 pF REFINinput current 100 A Phase Frequency
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