DLA DSCC-VID-V62 10603 REV A-2009 MICROCIRCUIT DIGITAL CMOS 3 0 V TO 5 5 V 12 BIT 200 KSPS 4- 8 CHANNEL LOW POWER SERIAL ANALOG TO DIGITAL CONVERTER WITH AUTOPOWER DOWN MONOLITHIC .pdf
《DLA DSCC-VID-V62 10603 REV A-2009 MICROCIRCUIT DIGITAL CMOS 3 0 V TO 5 5 V 12 BIT 200 KSPS 4- 8 CHANNEL LOW POWER SERIAL ANALOG TO DIGITAL CONVERTER WITH AUTOPOWER DOWN MONOLITHIC .pdf》由会员分享,可在线阅读,更多相关《DLA DSCC-VID-V62 10603 REV A-2009 MICROCIRCUIT DIGITAL CMOS 3 0 V TO 5 5 V 12 BIT 200 KSPS 4- 8 CHANNEL LOW POWER SERIAL ANALOG TO DIGITAL CONVERTER WITH AUTOPOWER DOWN MONOLITHIC .pdf(12页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Phu H. Nguyen DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing YY MM D
2、D CHECKED BY Phu H. Nguyen TITLE MICROCIRCUIT, DIGITAL, CMOS, 3.0 V TO 5.5 V, 12 BIT, 200 KSPS, 4-/8 CHANNEL, LOW POWER SERIAL ANALOG TO DIGITAL CONVERTER WITH AUTOPOWER DOWN, MONOLITHIC SILICON 09-11-09 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/10603 REV PAGE 1 OF 12 AMSC
3、N/A 5962-V011-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/10603 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high per
4、formance 3.0 V to 5.5 V, 12 bit, 200 KSPS, 4-/8 channel, low power serial analog to digital converter with auto power down microcircuit, with an operating temperature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. T
5、he vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/10603 - 01 X A Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 TLV2
6、548-EP 3.0 V to 5.5 V, 12 bit, 200 KSPS, 4-/8 channel, low power serial analog to digital converter with auto power down 1.2.2 Case outline(s). The case outlines are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 20 JEDEC MO-153 Plastic Small outline 1.2.3 Lead finis
7、hes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other Provided by IHSNot for ResaleNo reproduction or networking permitted witho
8、ut license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/10603 REV PAGE 3 1.3 Absolute maximum ratings. 1/ Supply voltage range (GND to VCC) . -0.3 V to 6.5 V Analog input voltage range, . -0.3 V to VCC+ 0.3 V Reference input voltage . VCC+ 0.3 V
9、 Digital input voltage range -0.3 V to VCC+ 0.3 V Operating virtual junction temperature range, TJ-55C to 150C Operating free air temperature range, TA. -55C to 125C Storage temperature range (TSTG) . -65C to 150C Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds . 260C Dissipation rating
10、s: Package TA 25C Power rating Derating factor Above TA= 25C 2/ TA= 125C power rating Case outline X 977 mW 7.8 mW/C 195 mW 1.4 Recommended operating conditions. 3/ Parameter Symbol Min Max Unit Supply voltage VCC3.0 5.5 V Analog input voltage 4/ 0 VCCV High level control input voltage VIH2.1 V Low
11、level control input voltage VIL0.6 V Delay time, delay from falling edge to FS rising edge (See figure 4) td(CSL-FSH)0.5 SCLKs Delay time, delay from 16thSCLK falling edge to rising edge (FS = 1), or 17thrising edge (FS is active) (See figure 4 and 7) td(SCLK-CSH)0.5 SCLKs Setup time, FS rising edge
12、 before SCLK falling edge (See figure 4) tsu(FSH-SCLKL)20 ns Hold time, FS hold high after SCLK falling edge (See figure 4) th(FSH-SCLKL)30 ns Pulse width, high time (See figure 4 and 7) twH(CS) 100 ns Pulse width, FS high time (See figure 4) twH(FS)0.75 SCLKs SCLK cycle time (See figure 4 and 7) VC
13、C= 3.0 V to 3.6 V tc(SCLK)67 10000 ns VCC= 4.5 V to 5.5 V 50 10000 ns 1/ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicat
14、ed under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ This is the inverse of the traditional junction to ambient thermal resistance (RJA). Thermal resistance is not production tested and the va
15、lue given are for informational purposes only. 3/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. 4/ When binary output for
16、mat is used, analog input voltages greater than that applied to REFP convert as all ones (111111111111), while input voltages less than that applied to REFM convert as all zeros (000000000000). The device is functional with reference down to 1 V. (VREFP VREFM 1); however, the electrical specificatio
17、ns are no longer applicable. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/10603 REV PAGE 4 1.4 Recommended operating conditions - Continued. 3/ Parameter Symbol
18、 Min Max Unit Pulse width, SCLK low time (See figure 4 and 7) VCC= 4.5 V twL(SCLK)22 ns VCC= 3.0 V 27 Pulse width, SCLK high time (See figure 4 and 7) VCC= 4.5 V twH(SCLK)22 VCC= 3.0 V 27 Setup time, SDI valid before failing edge of SCLK (FS is active) or the rising edge of SCLK (FS = 1) (See figure
19、 7) tsu(DI-SCLK)25 Hold time, SDI hold valid after failing edge of SCLK (FS is active) or the rising edge of SCLK (FS = 1) (See figure 7) th(DI-SCLK)5 Delay time, delay from falling edge to SDO valid (See figure 4 and 7) td(CSL-DOV)25 Delay time, delay from FS falling edge to SDO valid (See figure 4
20、) td(FSL-DOV)25 Delay time, delay from SCLK falling edge (FS is active) or SCLK rising edge (FS = 1) to SDO valid (See figure 4 and 7) For a date code later than xxx, see the data code from manufacturer data. VCC= 5.5 V SDO = 0 pF td(SCLK-DOV)0.5 SCLK + 5 TYP SDO = 60 pF 0.5 SCLK + 24 VCC= 3.0 V SDO
21、 = 0 pF 0.5 SCLK + 12 TYP SDO = 60 pF 0.5 SCLK + 33 Delay time, delay from 17thSCLK rising edge (FS is active), or the 16thfalling edge (FS = 1) to EOC falling edge (See figure 4 and 7) td(SCLK-EOCL)45 TYP Delay time, delay from 16thSCLK falling edge to falling edge (FS = 1), or from the 17thrising
22、edge SCLK to rising edge. (See figure 4, 5, 6, and 7) td(SCLK-INTL)Min t(conv)Delay time, delay from falling edge or FS rising edge to rising edge (See figure 4, 5, 6, and 7) td(CLK-INTH)or td(FSH-INTH)50 Delay time, delay from rising edge to falling edge (See figure 5 and 6) td(CSH-CSTARTL)100 Dela
23、y time, delay from rising edge to EOC falling edge (See figure 5 and 6) td(CSTARTH-EOCL)50 ns Pulse width, low time (See figure 5 and 6) twL(CSTART) Min t(sample) s Delay time, delay from rising edge to falling edge (See figure 6) td(CSTARTH-CSTARTL)Min t(conv)s Delay time, delay from rising edge to
24、 falling edge (See figure 6 and 7) td(CSTARTH-INTL)Max t(conv)TYP s Operation free air temperature TA-55 125 C Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/1060
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