DLA DSCC-VID-V62 09637-2011 MICROCIRCUIT LINEAR CMOS MICROPOWER STEP UP SWITCHING VOLTAGE REGULATOR MONOLITHIC SILICON.pdf
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1、 REVISIONSLTR DESCRIPTION DATE APPROVEDPrepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY RICK OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Original date of drawing YY-MM-DD CHECKED BY RAJESH
2、 PITHADIA TITLE MICROCIRCUIT, LINEAR, CMOS, MICROPOWER, STEP UP SWITCHING VOLTAGE REGULATOR, MONOLITHIC SILICON 11-06-29 APPROVED BY CHARLES F. SAFFLE SIZE A CODE IDENT. NO. 16236 DWG NO. V62/09637 REV PAGE 1 OF 10 AMSC N/A 5962-V054-11 Provided by IHSNot for ResaleNo reproduction or networking perm
3、itted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09637 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a CMOS micropower, step up switching voltage regulator microcircuit, with an operating temperature r
4、ange of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/09637 - 01 X B Drawing Device type Ca
5、se outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 MAX630 CMOS micropower, step up switching voltage regulator 1.2.2 Case outline(s). The case outline(s) are as specified herein. Outline letter Number of pins JEDEC PUB 95 P
6、ackage style X 8 MS-012-AA Small outline1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish designator Material A Hot solder dip B Tin-lead plateC Gold plateD PalladiumE Gold flash palladium Z Other Provided by IHSNot for
7、 ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09637 REV PAGE 3 1.3 Absolute maximum ratings. 1/ Supply voltage (VS) 18 V Input voltage (LBR, CX, IC, VFBpins) -0.3 V to (+VS+ 0.3 V) Output volta
8、ge, LX and LBD 18 V LX output current 525 mA (peak) LBD output current . 50 mA Power dissipation (PD) . 441 mW 2/ Junction temperature range (TJ) 150C Storage temperature range (TSTG) -65C to +160C Lead temperature (soldering, 10 seconds) . +300C Electrostatic discharge (ESD): Human body model (HBM)
9、 . 2,000 V Moisture sensitivity level (MSL) Level 1 1.4 Recommended operating conditions. 3/ Supply voltage (VS) . +6.0 V Operating free-air temperature range (TA) . -55C to +125C 1.5 Thermal data table. Case outline letter X X Units PC board Single layer Multi-layer 4/ Power dissipation (PD), maxim
10、um at +70C 471 606 mW Power dissipation (PD) derating above +70C 5.9 7.6 mW/C Thermal resistance, junction to case (JC) 40 38 C/W Thermal resistance, junction to ambient (JA) 170 132C/W 1/ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These a
11、re stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ Derate 5.88 mW/C above
12、+50C. 3/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. 4/ Package thermal resistances were obtained using the method desc
13、ribed in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maxim- Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO
14、. 16236 DWG NO. V62/09637 REV PAGE 4 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices JESD51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages (Applications for copies should be addressed to the JEDEC Office, 3103 Nort
15、h 10th Street, Suite 240-S, Arlington, VA 22201-2107 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C.
16、 ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as s
17、pecified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal
18、connections shall be as shown in figure 2. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09637 REV PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Symbol C
19、onditions +VS= +6.0 V, IC= 5.0 A unless otherwise specifiedTemperature, TA Device type Limits Unit Min Max Supply voltage +VSOperating +25C 01 2.0 16.5 V Startup 1.9-55C to +125C 2.2 16.5 Internal reference voltage VREF+25C 01 1.29 1.33 V -55C to +125C 1.25 1.37 Switch current ISWV3= 400 mV +25C 01
20、75 mA Supply current at +VSpin ISI3= 0 mA +25C 01 125 A -55C to +125C 200 Efficiency +25C 01 85 typical % Line regulation 0.5 VOUT VS VOUT2/ +25C 01 0.2 %VOUT-55C to +125C 0.5 Load regulation VS= +5 V, PL= 0 to 150 mW 2/ +25C 01 0.5 %VOUTVS= 0.5VO, PL= 0 to 150 mW 2/ -55C to +125C 1.0 Operating freq
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