DIN EN ISO 9455-10-2013 Soft soldering fluxes - Test methods - Part 10 Flux efficacy test solder spread method (ISO 9455-10 2012) German version EN ISO 9455-10 2012《软钎焊剂 试验方法 第10部分.pdf

《DIN EN ISO 9455-10-2013 Soft soldering fluxes - Test methods - Part 10 Flux efficacy test solder spread method (ISO 9455-10 2012) German version EN ISO 9455-10 2012《软钎焊剂 试验方法 第10部分.pdf》由会员分享，可在线阅读，更多相关《DIN EN ISO 9455-10-2013 Soft soldering fluxes - Test methods - Part 10 Flux efficacy test solder spread method (ISO 9455-10 2012) German version EN ISO 9455-10 2012《软钎焊剂 试验方法 第10部分.pdf（14页珍藏版）》请在麦多课文档分享上搜索。

1、January 2013 Translation by DIN-Sprachendienst.English price group 10No part of this translation may be reproduced without prior permission ofDIN Deutsches Institut fr Normung e. V., Berlin. Beuth Verlag GmbH, 10772 Berlin, Germany,has the exclusive right of sale for German Standards (DIN-Normen).IC

2、S 25.160.50!$l“1936173www.din.deDDIN EN ISO 9455-10Soft soldering fluxes Test methods Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012);English version EN ISO 9455-10:2012,English translation of DIN EN ISO 9455-10:2013-01Flussmittel zum Weichlten Prfverfahren Teil 10: Bestimmung d

3、er Wirksamkeit des Flussmittels, Ausbreitungsprfung(ISO 9455-10:2012);Englische Fassung EN ISO 9455-10:2012,Englische bersetzung von DIN EN ISO 9455-10:2013-01Flux de brasage tendre Mthodes dessai Partie 10: Essai defficacit du flux, mthode dtalement (ISO 9455-10:2012);Version anglaise EN ISO 9455-1

4、0:2012,Traduction anglaise de DIN EN ISO 9455-10:2013-01SupersedesDIN EN ISO 9455-10:2000-09www.beuth.deDocument comprises 14 pagesIn case of doubt, the German-language original shall be considered authoritative.12.12 DIN EN ISO 9455-10:2013-01 2 A comma is used as the decimal marker. National forew

5、ord This document (EN ISO 9455-10:2012) has been prepared by Technical Committee ISO/TC 44 “Welding and allied processes” in collaboration with Technical Committee CEN/TC 121 “Welding” (Secretariat: DIN, Germany). The responsible German body involved in its preparation was the Normenausschuss Schwei

6、en und verwandte Verfahren (Welding and Allied Processes Standards Committee), Joint Committee NA 092-00-08 AA Weichlten. The ISO 9455-1 to ISO 9455-17 series of standards which specify methods of determining the numerous properties of soft soldering fluxes has been drawn up or is currently under pr

7、eparation in answer to the increase in quality requirements for such products. The DIN Standards corresponding to the International Standards referred to in this document are as follows: ISO 9453 DIN EN ISO 9453 ISO 9454-1:1990 DIN EN 29454-1:1994-02 Amendments This standard differs from DIN EN ISO

8、9455-10:2000-09 as follows: a) normative references have been updated; b) Clause 3 “Symbols” has been included; c) Subclause 6.1 “Solder bath” has been revised; d) Subclause 7.2 “Solder sample” has been revised; e) Clause 11 “Test report” has been revised; f) Table B.1 “Chemical composition of brass

9、 test plates” has been revised. Previous editions DIN 8527-1: 1970-06, 1997-08 DIN 8527-2: 1974-04 DIN EN ISO 9455-10: 2000-09 National Annex NA (informative) Bibliography DIN EN ISO 9453, Soft solder alloys Chemical compositions and forms DIN EN 29454-1:1994-02, Soft soldering fluxes Classification

10、 and requirements Part 1: Classification, labelling and packaging EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN ISO 9455-10 September 2012 ICS 25.160.50 Supersedes EN ISO 9455-10:2000English Version Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO

11、9455-10:2012) Flux de brasage tendre - Mthodes dessai - Partie 10: Essai defficacit du flux, mthode dtalement (ISO 9455-10:2012) Flussmittel zum Weichlten - Prfverfahren - Teil 10: Bestimmung der Wirksamkeit des Flussmittels, Ausbreitungsprfung (ISO 9455-10:2012) This European Standard was approved

12、by CEN on 14 September 2012. CEN members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national s

13、tandards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CEN member into its own language an

14、d notified to the CEN-CENELEC Management Centre has the same status as the official versions. CEN members are the national standards bodies of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hunga

15、ry, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom. EUROPEAN COMMITTEE FOR STANDARDIZATION COMIT EUROPEN DE NORMALISATION EUROPISCHES KOMITEE FR NORMUNG Managemen

16、t Centre: Avenue Marnix 17, B-1000 Brussels 2012 CEN All rights of exploitation in any form and by any means reserved worldwide for CEN national Members. Ref. No. EN ISO 9455-10:2012: EContents PageForeword .1 Scope 2 Normative references .3 Symbols .4 Principle .5 Reagents 6 Apparatus and materials

17、 .7 Test specimens 7.1 Brass test plates 7.2 Solder sample .8 Procedure 8.1 Preparation of test plates 8.2 Test method 8.3 Replicate tests 9 Expression of results .10 Precision 11 Test report .Annex A (informative) Method for the preparation of standard reference rosin (colophony) based liquid fluxe

18、s, having 25 % by mass non-volatile content .Annex B (informative) Chemical composition of brass test plates .Bibliography .EN ISO 9455-10:2012 (E) DIN EN ISO 9455-10:2013-01 23444455666666777891112Foreword This document (EN ISO 9455-10:2012) has been prepared by Technical Committee ISO/TC 44 “Weldi

19、ng and allied processes“ in collaboration with Technical Committee CEN/TC 121 “Welding” the secretariat of which is held by DIN. This European Standard shall be given the status of a national standard, either by publication of an identical text or by endorsement, at the latest by March 2013, and con

20、flicting national standards shall be withdrawn at the latest by March 2013. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and/or CENELEC shall not be held responsible for identifying any or all such patent rights. This docum

21、ent supersedes EN ISO 9455-10:2000. According to the CEN/CENELEC Internal Regulations, the national standards organisations of the following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugosla

22、v Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. Endorsement notice The text of ISO 9455-10:2012 has

23、 been approved by CEN as a EN ISO 9455-10:2012 without any modification. EN ISO 9455-10:2012 (E) DIN EN ISO 9455-10:2013-01 3 1 ScopeThis part of ISO 9455 specifies a method for the determination of the efficacy of a soft soldering flux. The method is known as the solder spread method of filler meta

24、l and is applicable to all flux classes defined in ISO 9454-1.NOTE An alternative method for the determination of the flux efficacy, applicable to liquid fluxes only, known as the wetting balance method, is specified in ISO 9455-16.32 Normative referencesThe following referenced documents are indisp

25、ensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.ISO 9453, Soft solder alloys Chemical compositions and formsISO 9454-1:1990, Soft soldering flu

26、xes Classification and requirements Part 1: Classification, labelling and packaging3 SymbolsAarithmetic mean spread area, in square millimetresH height of spread solder, in millimetresD diameter, in millimetres, when the solder used is considered as a sphere, D = 1,24 V1/3R reproducibilityr repeatab

27、ilityswstandard deviation within laboratorysbstandard deviation between laboratories density, in grams per millilitre, of solder under test at the test temperatureV volume, in millilitres, of the solder used4 PrincipleA specially prepared brass test sheet is treated with a known quantity of the flux

28、 under test and a standard quantity of specified solder alloy. Upon heating, the solder alloy melts and spreads across the surface of the brass test sheet, the extent of spread being a measure of the flux efficacy. The area covered by the solder is determined by means of a planimeter or other suitab

29、le technique.EN ISO 9455-10:2012 (E) DIN EN ISO 9455-10:2013-01 4This test method is applicable to all fluxes. If required, the efficacy of the flux sample under test can be compared with that of a standard flux (see Annex A).NOTE It is possible to use copper as the test surface. However, it is pref

30、erable to use brass as the test surface in order to distinguish between various fluxes because it provides a better surface for differentiation than copper does.5 ReagentsUse only reagents of recognized analytical grade and distilled or demineralized water or water of equivalent purity.5.1 Acid prep

31、aration solution, prepared in a fume cupboard by cautiously mixing the following ingredients in the order given, cooling as necessary. 140 ml water; 225 ml nitric acid ( = 1,42 g/ml); 600 ml sulfuric acid ( = 1,84 g/ml); 5 g sodium chloride; 18 ml copper solution (5.2).Thoroughly mix the solution.Th

32、is preparation solution shall be freshly prepared every day.WARNING The mixture is extremely corrosive and produces hazardous fumes.5.2 Copper solution, prepared by dissolving 10 g pure copper turnings in 100 ml of 50 % by volume nitric acid solution ( = 1,42 g/ml).5.3 Industrial methylated spirits.

33、5.4 Acetone.6 Apparatus and materials6.1 Solder bath, containing not less than 4 kg of molten solder. The liquid solder in the bath shall be at least 25 mm in depth, with a surface area easily capable of accommodating the test specimen. As a minimum, the bath temperature shall be capable of being ma

34、intained at a set temperature of the liquidus temperature of the alloy in the test plus 35 C. The test temperature shall be documented.6.2 Tongs, or other suitable mechanical device, for lowering the brass test plate (7.1), in a horizontal plane, onto the surface of the liquid solder in the bath (6.

35、1) and raising it again, also in a horizontal plane.6.3 Planimeter, suitable for measuring surface areas of the order of 100 mm2.6.4 Microsyringe, or micropipette, capable of delivering 25 l (i.e. 0,025 ml).6.5 Plastic tweezers or tongs, for use in the cleaning procedure for test plates.6.6 Micromet

36、er, as specified in ISO 3611.26.7 Filter paper, for use in cleaning procedure for test plates.EN ISO 9455-10:2012 (E) DIN EN ISO 9455-10:2013-01 5 7 Test specimens7.1 Brass test platesEach plate shall be of dimensions 40 mm 40 mm. Prepare 10 plates, of alloy CuZn37 or CuZn40, cut from brass sheet 0,

37、5 mm thick, for each flux being tested.NOTE 1 Annex B gives the chemical composition of these two brasses.NOTE 2 An alternative is 10 oxidized copper test plates, each of dimensions 40 mm 40 mm, cut from phosphorus deoxidized sheet, 0,5 mm thick, complying with ISO 197-1,1for each flux being tested.

38、NOTE 3 One corner of the test plate can be bent, to facilitate handling with the tongs (6.2).7.2 Solder sampleClean a length of solid solder wire as agreed between the contracting parties, with a diameter of 1 mm 0,05 mm, weighing between 0,49 g and 0,50 g with a filter paper soaked in industrial me

39、thylated spirits (5.3) or acetone (5.4). Wind the length of wire into a tight, flat spiral for use in the test. After cleaning, handle the solder wire only with clean cotton gloves.The solder used for the test and the test temperature shall be selected from one of the following: S-Sn60Pb40 (in accor

40、dance with ISO 9453) at 235 C 3 C; S-Sn96Ag3Cu1 (in accordance with ISO 9453) at 255 C 3 C; any other solder or temperature combinations as agreed between the customer and the flux supplier for test temperatures, see 6.1.8 Procedure8.1 Preparation of test platesImmediately before use, pretreat the 1

41、0 test pieces in the following manner; handle with clean tongs or with a suitable mechanical device (6.2).Degrease the test plates (7.1) thoroughly in acetone (5.4) and allow to dry in clean air.Immerse each test plate separately for approximately 15 s in the acid preparation solution (5.1) using th

42、e plastic tweezers or tongs (6.5). Hold the solution at a temperature between 15 C and 25 C.Wash the test plates in water for a maximum of 5 s.Repeat the acid preparation operation not more than three times, until a uniform matt lustre on the surface of the test plates has been attained.After the fi

43、nal rinsing in water, rinse the test plates in methylated spirits (5.3) and dry them with filter paper (6.7).NOTE This preparation method is applicable to both brass and copper test plates.8.2 Test methodImmediately after the cleaning operation specified in 8.1, take one of the test plates and apply

44、 the flux sample under test to the central region of the plate, in accordance with a) or b):a) for liquid flux samples: measure 0,025 ml 0,001 25 ml of the flux sample by means of the microsyringe or micropipette (6.4);b) for paste and solid flux samples: weigh 0,025 g 0,001 25 g of the flux sample.

45、EN ISO 9455-10:2012 (E) DIN EN ISO 9455-10:2013-01 6Place a solder sample (7.2) in the middle of the test plate. Lower the test plate, with its plane horizontal, on to the surface of the solder in the solder bath of filler metal (6.1).After 5 s of the start of spreading, remove the test plate from t

46、he solder bath, keeping it in a horizontal plane until it has cooled to room temperature.Remove the flux residue with a suitable solvent.Determine the area, in square millimretres, covered by the melted solder alloy by use of the planimeter (6.3), or measure the height of the solder by use of a micr

47、ometer (6.6) and calculate the ratio of spread, expressed as a percentage, by the formula:DHD100whereH is the height of spread solder, in millimetres;D is the diameter, in millimetres, when the solder used is considered as a sphere, D = 1,24 V1/3 ;V is the volume, in millilitres, of the solder used.

48、8.3 Replicate testsUsing the remaining nine test plates, re-prepare as specified in 8.1, repeat the test method specified in 8.2, calculating either the area or the ratio of spread as in the original sample.9 Expression of resultsThe efficacy of the flux sample under test is expressed as the arithmetic mean and