ASHRAE OR-05-12-3-2005 High Density Cooling of Data Centers and Telecom Facilities - Part 2《高密度冷却的数据中心和电信设施-第2部分》.pdf
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1、OR-05-1 2-3 High Density Cooling of Data Centers and Telecom Facilities-Part 2 Donald L. Beaty, PE Member ASHRAE Neil Chauhan Daniel Dyer, PE Associate Member ASHRAE ABSTRACT The rapid growth trend of electronic equipment heat density is causing concern regarding how to cool these high, if not extre
2、me, loads. Successfully cooling these loads is a complex problem that is made even more dicult by the lack ofpracticalpeld experience with high density loads. High density loads amplib the impact on the cooling system of many variables (infrastructure conjgurations, spatial allocations, etc.) thatpr
3、eviously may not have been the focus of the design engineer. The needfor a solution is imme- diate. but (due in part to the dot-com crash) there has been a lack of resources to proactively address the problem. There- fore, the industry has fallen behind and requires accelerated recovery. The compoun
4、ded efect of these issues creates a need for a more holistic approach than thosepreviously utilized with a view to a coordinatedprocess that results in planned solutions meeting the approval of all afected parties. Theprst step toward this holistic approach has been taken by ASHRAE TC9.9 with thepub
5、lication ofrhermal Guidelines for Data Processing Environments. Following on from that publication, this two-part paper examines some of the topics that should be considered as apart of the holistic approach and provides some background on the high density cooling topic in general. INTRODUCTION Over
6、view The topics in this field are not easily related to each other since the typical contributors for the topics are often from different sectors of the industry. Specifically, the following areas will be discussed across the two-part paper: The collaborative process: Compensating for a lack of hist
7、orical data (Part 1) Load calculation at the predesign phase (Part 1) The impact of space planning with respect to cooling difficulty (Part 2) High level presentation of some cooling system choices (Part 2) Retrofitting high density loads into existing facilities (Part 2) This second part of the two
8、-part paper will cover three sections that represent the relative impact of the choices that have to be made with regard to the building structure, cooling system types, and determining the approach for retrofitting existing facilities with computer equipment that is considered to be a high density
9、load. The first section in this paper will discuss the variables involved with the building plan and section designs. This will include both the considerations at a load planning level and the dimensions that can impact the cooling delivery system and performance. The second section will provide a h
10、igh level overview of the different types of cooling systems and delivery options that are considered for modem data centers. The final section in this paper attempts to provide a process for determining the path forward when faced with the challenge ofhaving to retrofit a high density load into an
11、exist- ing data center and will discuss how the process changes with aspects such as the size of the deployment and how more radi- cal changes to the data center may prove to be the more complete solution long term as opposed to cooling through brute force by simply adding capacity. Donald L. Beaty
12、is president and Neil Chauhan and Daniel Dyer are engineers at DLB Associates, Consulting Engineers, Ocean, New Jersey. 932 02005 ASHRAE. Some Definitions AS this two-part paper will show, there is a lot of vague- ness with regard to the thresholds where a load is considered high density. Some secto
13、rs of the industry will focus on kW per rack and other sectors will want to focus on the average watts per square foot (watts per square meter) in a given computer room. For the purposes of this paper, high density cooling will mean loads that have reached a threshold of 5 to 10 kW per rack or an av
14、erage density of 100 to 150 watts per square foot (1 O00 to 1500 watts per square meter) across a computer room. Although the two threshold ranges mentioned are not interchangeably related (i.e., 10 kW per rack represents a much higher load than 150 W/ 1500 W/m2), the values do represent the current
15、 industry perceptions of the range of the high density thresholds. A more tangible method of under- standing the thresholds are to consider that a percentage of higher density racks within a computer room will drive up the average watts per square foot (watts per square meter). The term rack has dif
16、ferent definitions in the telecom industry versus data centers, but for this paper, the broadest definition will be used, which is “an open frame or enclosed cabinet that houses electronic equipment.” This paper is not aimed specifically at any particular type of high density equipment deployment. C
17、ertainly there are many scenarios that could exist, including: New construction versus retrofitting an existing building Retrofit of an existing datacom facility versus retrofit of a building with a different (non-datacom) usage Small-scale deployment versus a large-scale deployment of high density
18、loads (e.g., addition of one to three high density racks versus addition of multiple rows of high density racks) The scenarios listed above all have their own unique chal- lenges and constraints, and in some scenarios, a feasibility study for a high density equipment deployment may result in either
19、extensive infrastructure changes being required or the deployment in a particular scenario may be deemed unfeasi- ble. Do High Density Loads Exist? There are plenty of studies and information showing over- stated loads (i.e., a measured load that is a mere fraction of the design or connected load).
20、There are people that claim they have never seen loads above 25 W/ft2 (250 W/m2) and certainly not above 50 W/fi2 (500 W/m2). These same people would then argue that even if they double or triple that load (which is unlikely) that it does not support the high density levels being projected or claime
21、d. Determining whether high density loads exist based on personal experience or national averages can be very mislead- ing since it could imply that high density loads do not exist. The fact is that high density loads do exist (currently, specific loads of 15 to 25 kW per rack or more have been meas
22、ured). Although high density installations are few, the quantity is increasing. The existence of any high density loads establishes a need to address how to cool those loads. To summarize, the claim is not that all loads or most ofthe loads will be high density, but rather some of the loads will be
23、high density in some of the facilities. Based on the product heat density trend charts, history supports a significant increasing trend of loads at the component, board, and equip- ment level. As a result, the current existence of some high density loads combined with the projected future loads warr
24、ants the development of strategies to effectively handle high density loads. Background on Issues and Influences make this a challenging problem to solve: The following are some of the issues or influences that Within the datacom environment (the term datacom refers to both data centers and telecom
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