ARMY MIL-PRF-55681 F-2004 CAPACITOR CHIP MULTIPLE LAYER FIXED CERAMIC DIELECTRIC ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY GENERAL SPECIFICATION FOR《一般规格有既定可靠性和非既定的可靠.pdf

《ARMY MIL-PRF-55681 F-2004 CAPACITOR CHIP MULTIPLE LAYER FIXED CERAMIC DIELECTRIC ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY GENERAL SPECIFICATION FOR《一般规格有既定可靠性和非既定的可靠.pdf》由会员分享，可在线阅读，更多相关《ARMY MIL-PRF-55681 F-2004 CAPACITOR CHIP MULTIPLE LAYER FIXED CERAMIC DIELECTRIC ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY GENERAL SPECIFICATION FOR《一般规格有既定可靠性和非既定的可靠.pdf（40页珍藏版）》请在麦多课文档分享上搜索。

1、AMSC N/A FSC 5910 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. MIL-PRF-55681F 3 September 2004 SUPERSEDING MIL-PRF-55681E 3 July 1997 PERFORMANCE SPECIFICATION CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED

2、 RELIABILITY, GENERAL SPECIFICATION FOR This specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the general requirements for non-established reliability (non-ER) and established reliability (ER), ceramic diele

3、ctric, multiple layer, chip capacitors. ER capacitors covered by this specification have failure rate levels (FRL) ranging from 1.0 percent to 0.001 percent per 1,000 hours. These FRLs are established at a 90-percent confidence level and maintained at a 10-percent producers risk and are based on lif

4、e tests performed at maximum rated voltage at maximum rated temperature. An acceleration factor of 8:1 has been used to relate life test data obtained at 200 percent of rated voltage at maximum rated temperature, to rated voltage at rated temperature. 1.2 Classification. 1.2.1 Part or Identifying Nu

5、mber (PIN). The PIN is in the following form, and as specified (see 3.1). 1.2.1.1 Style. The style is identified by the three-letter symbol “CDR“ followed by a two-digit number. The letters identify non-ER and ER, ceramic dielectric, fixed, chip capacitors. 1.2.1.2 Rated temperature and voltage-temp

6、erature limits. The rated temperature and voltage-temperature limits are identified by a two-digit symbol. The first letter “B“ indicates the rated temperature of -55C to +125C; the second letter indicates the voltage-temperature limits as shown in table I. 1.2.1.3 Capacitance. The nominal capacitan

7、ce value expressed in picofarads (pF) is identified by a three-digit number; the first two digits represent significant figures and the last digit specifies the number of zeros to follow. When the nominal value is less than 10 pF, the letter “R“ is used to indicate the decimal point and the succeedi

8、ng digit(s) of the group represent significant figure(s). For example, 1R0 indicates 1.0 pF and 0R5 indicates 0.5 pF. * CDR01 BX 100 A K Z M Style (1.2.1.1) Rated temperature and voltage-temperature limits (1.2.1.2) Capacitance (1.2.1.3) Rated voltage (1.2.1.4) Capacitance tolerance (1.2.1.5) Termin

9、ation finish (1.2.1.6) Product level designator (1.2.1.7) INCH-POUND Comments, suggestions, or questions on this document should be addressed to: US Army Communications-Electronics Command and Fort Monmouth, ATTN: AMSEL-LC-LEO-E-EP, Fort Monmouth, NJ 07703-5023, or e-mailed to jeffrey.carvermail1.mo

10、nmouth.army.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at www.dodssp.daps.mil. The requirements to comply with the change in test condition letter in resistance to soldering heat (4.8.13b) for unleaded c

11、apacitors must be completed by 6 months from the date of this document. Before then, use of the previous test condition (Letter B), is authorized. Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without licen

12、se from IHS-,-,-MIL-PRF-55681F 2 TABLE I. Voltage-temperature limits. Symbol Capacitance change with reference to +25C Step A through step D of table XIII Percent rated voltage Step E through step G of table XIII G 90 20 ppm/C 100 90 20 ppm/C P 1/ 0 30 ppm/C 100 0 30 ppm/C R 15 percent 100 +15, -40

13、percent X 15 percent 100 +15, -25 percent Z 15 percent 60 +15, -45 percent 1/ At measurement point F of table XIII, the capacitance measurement may be 0.1 percent or 0.05 pF, whichever is greater, from the +25C reference. 1.2.1.4 Rated voltage. The rated voltage for continuous operation at +125C is

14、identified by a single letter as shown in table II. TABLE II. Rated voltage. Symbol Rated voltage A B K C D E F G H J 50 100 150 200 300 500 1,000 2,000 3,000 4,000 1.2.1.5 Capacitance tolerance. The capacitance tolerance is identified by a single letter as shown in table III. TABLE III. Capacitance

15、 tolerance. Symbol 1/ Capacitance tolerance () B C D F G J K M .10 pF .25 pF .50 pF 1 percent 2 percent 5 percent 10 percent 20 percent 1/ Symbols B, C, and D are applicable for capacitance values of less than 10 pF only. For capacitance values of .10 pF through .50 pF, the capacitance will never be

16、 zero. Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-55681F 3 * 1.2.1.6 Termination finish. The termination finish is identified by a single letter as shown in table IV.

17、 Termination types P (silver-copper-gold) and Q (palladium-gold) are no longer available due to lack of use. Only the user should make substitutions. * TABLE IV. Termination finish. Symbol 1/ Finish M N 2/ S T U W 4/ Y 5/ Z Palladium-silver Silver-nickel-gold Solder coated final with a minimum of 4

18、percent lead Silver Base metallization-barrier metal-solder coated (tin/lead alloy, with a minimum of 4 percent lead) 3/ Base metallization-barrier metal-tinned (tin or tin/lead alloy) Base metallization-barrier metal-tin (100 percent) Base metallization-barrier metal-tinned (tin/lead alloy, with a

19、minimum of 4 percent lead) * 1/ Terminations P and Q are no longer available. 2/ See 6.4.1. 3/ Solder will have a melting point of +200C or less. Solder coat thickness will be a minimum of 60 micro-inches. * 4/ Contact manufacturer for specific composition. W termination may be 100 percent tin and m

20、ay promote tin whisker growth (see 6.4.2). * 5/ Y termination is 100 percent tin and may promote tin whisker growth (see 6.4.2). 1.2.1.7 Product level designator. The product level designator is identified by a single letter as shown in table V. TABLE V. Product level designator. Symbol Product leve

21、l C M P R S non-ER 1.0 1/ 0.1 1/ 0.01 1/ 0.001 1/ 1/ FRL (percent per 1,000 hours). 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification

22、 or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of the documents cited in sections 3 and 4 of this specification, whether or not they are l

23、isted. 2.2 Government documents. * 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or cont

24、ract (See 6.2). Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-55681F 4 DEPARTMENT OF DEFENSE SPECIFICATIONS (See supplement 1 for list of associated specification sheets

25、.) DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Electronic and Electrical Component Parts, Test Methods for. MIL-STD-690 - Failure Rate Sampling Plans and Procedures. MIL-STD-790 - Standard Practice for Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrica

26、l, Electronic, and Fiber Optic Parts Specifications. MIL-STD-810 - Environmental Test Methods and Engineering Guidelines. * (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Av

27、enue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DoDISS cited in th

28、e solicitation. Unless otherwise specified, the issues of documents not listed in the DoDISS are the issues of the documents cited in the solicitation (see 6.2). ELECTRONIC INDUSTRIES ALLIANCE (EIA) EIA-554-1 - Assessment of Average Outgoing Quality Levels in Parts Per Million (ppm).(DoD Adopted). E

29、IA-557 - Statistical Process Control Systems. (DoD Adopted). * (Copies of these documents are available from http:/ or Global Engineering Documents, Attn: Customer Service Department, 15 Inverness Way East, Englewood CO 80112-5776.) * THE INSTITUTE FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUI

30、TS INC. (IPC) J-STD-004 - Requirements for Soldering Fluxes. J-STD-005 - Requirements for Soldering Pastes. J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications. * (Copies of these documents can be ordered online at

31、 www.ipc.org or from the Institute for Interconnecting and Packaging Electronic Circuits (IPC, INC.), 2215 Sanders Road, Suite 200 South, Northbrook, IL 60062.) 2.4 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for related a

32、ssociated specifications, specifications sheets, or MS standards), the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Specification sheets. The individual item re

33、quirements shall be as specified herein and in accordance with the applicable specification sheets. In the event of any conflict between requirements of this specification and the specification sheet, the latter shall govern (see 6.2). 3.2 Qualification. Capacitors furnished under this specification

34、 shall be products which are authorized by the qualifying activity for listing on the applicable qualified products list (QPL) before contract award. In addition, the manufacturer shall obtain certification from the qualifying activity that the product assurance requirements of 4.2 have been met and

35、 are being maintained. Authorized distributors who are approved to MIL-STD-790 distributor requirements by the QPL manufacturer are listed in the QPL. Copyright Communications - Electronics Command Provided by IHS under license with CRAINot for ResaleNo reproduction or networking permitted without l

36、icense from IHS-,-,-MIL-PRF-55681F 5 3.3 QPL system. The manufacturer shall establish and maintain a QPL system for parts covered by this specification. Requirements for this system are specified in MIL-STD-690 (ER parts only) and MIL-STD-790. In addition, the manufacturer shall establish a Statisti

37、cal Process Control (SPC) and Part Per Million (ppm) system that meets the requirements specified in 3.3.1 and 3.3.2. 3.3.1 SPC system. As part of the overall MIL-STD-790 QPL system, the manufacturer shall establish a SPC system that meets the requirements of EIA-557. The manufacturer shall demonstr

38、ate control of the voltage-temperature limits of capacitance in the process. 3.3.2 PPM system. As part of the overall MIL-STD-790 QPL system, the manufacturer shall establish a ppm system for assessing the average outgoing quality of lots in accordance with EIA-554-1. Data exclusion, in accordance w

39、ith EIA-554-1 may be used with approval of the qualifying activity. The ppm system shall identify the ppm rate at the end of each month and shall be based on a six month moving average. Style reporting may include both non-ER and ER style combinations. 3.4 Material. The material shall be as specifie

40、d herein. However, when a definite material is not specified, a material shall be used which enables the capacitors to meet the performance requirements of this specification. Acceptance or approval of any constituent material shall not be construed as a guarantee of the acceptance of the finished p

41、roduct. * 3.4.1 Soldering flux. Soldering flux shall be in accordance with J-STD-004. No acid, acid salts, or type RA fluxes shall be used in preparation for or during soldering. 3.5 Interface and physical dimension requirements. Capacitors shall meet the interface requirements and physical dimensio

42、ns specified (see 3.1). 3.5.1 Terminations. The terminations shall be of solderable metals or metal alloys. Termination finishes, as identified in 1.2.1.6, shall be as specified (see 3.1). 3.5.1.1 Reprocessing of terminations for solderability enhancement. The manufacturer may reprocess the terminat

43、ions of capacitors supplied to this specification for the purpose of solderability enhancement, provided the termination process has been approved by the qualifying activity. 3.5.1.1.1 Reprocessing option. If the manufacturer reprocesses the terminations of the capacitors as a part of normal product

44、ion, or as a corrective action for solderability failure, the reprocessed lot shall be subjected to the group A, subgroup 1, electrical tests. 3.6 Voltage conditioning. When tested as specified in 4.8.3, capacitors shall meet the following requirements: a. Dielectric withstanding voltage (DWV) (at +

45、25C): Shall be as specified in 3.12, with the following exceptions: * (1) For capacitors with a voltage rating of 500 volts, 200 percent of rated voltage shall be applied. * (2) For capacitors with a voltage rating of 1,000 volts, 150 percent of rated voltage shall be applied. * (3) For capacitors w

46、ith a voltage rating greater than 1,000 volts, 120 percent of rated voltage shall be applied. (4) Not applicable if the optional voltage conditioning was performed at or above 250 percent of rated voltage. b. Insulation resistance (IR) (at +25C): Shall be as specified in 3.9. c. Capacitance (at +25C

47、): Shall be as specified in 3.7. d. Dissipation factor (DF) (at +25C): Shall be as specified in 3.8. 3.7 Capacitance. When measured as specified in 4.8.4, the capacitance shall be within the applicable tolerance specified (see 3.1). Copyright Communications - Electronics Command Provided by IHS unde

48、r license with CRAINot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-55681F 6 3.8 DF. When measured as specified in 4.8.5, the DF shall not exceed 2.5 percent for the BR, BX, and BZ characteristics, 0.15 percent for the BP characteristic, and 0.05 percent for

49、 the BG characteristic. 3.9 IR. When measured as specified in 4.8.6, the IR shall be not less than the following: a. At +25C (except high frequency styles) (see 3.1): 100,000 megohms or 1,000 megohm-microfarads, whichever is less. b. At +125C (except high frequency styles) (see 3.1): (1) BR, BX, and BZ characteristics: Shall be not less than 10,000 megohms or 100 megohm-microfarads, whichever is less (see 3.1).