ISO 9455-13-1996 Soft soldering fluxes - Test methods - Part 13 Determination of flux spattering《软钎焊剂 试验方法 第13部分 钎剂飞溅量的测定》.pdf

《ISO 9455-13-1996 Soft soldering fluxes - Test methods - Part 13 Determination of flux spattering《软钎焊剂 试验方法 第13部分 钎剂飞溅量的测定》.pdf》由会员分享，可在线阅读，更多相关《ISO 9455-13-1996 Soft soldering fluxes - Test methods - Part 13 Determination of flux spattering《软钎焊剂 试验方法 第13部分 钎剂飞溅量的测定》.pdf（7页珍藏版）》请在麦多课文档分享上搜索。

1、INTERNATIONAL STANDARD IS0 9455-l 3 First edition 1996-l 2-l 5 Soft soldering fluxes - Test methods - Part 13: Determination of flux spattering Flux de brasage tendre - Mbthodes dessai - Partie 13: Dktermination des projections de flux Reference number IS0 9455-l 3:1996(E) Copyright International Or

2、ganization for Standardization Provided by IHS under license with ISONot for ResaleNo reproduction or networking permitted without license from IHS-,-,-IS0 9455-13:1996(E) Foreword IS0 (the International Organization for Standardization) is a worldwide fed- eration of national standards bodies (IS0

3、member bodres). The work of preparing lnternationai Standards IS normally carned out through IS0 technrcal committees. Each member body interested In a subject for which a technical committee has been established has the right to be represented on that committee. International organizations. governm

4、ental and non-governmental, in liarson with ISO, also take part In the work. ISO collaborates closely with the International Electrorechnrcar Commrssron (IEC) on all matters of electrotechnrcal standardizatron. Draft International Standards adopted by the technical committees are crrculated to the m

5、ember bodies for voting. Publicatron as an lnternatronal Standard requires approval by at least 75 % of the member bodies casting a vote. International Standard IS0 9455-l 3 was prepared by Technical Committee ISOIK 44, Welding and allied processes, Subcommittee SC 12, Soldering and brazing material

6、s. IS0 9455 consists of the following parts under the general trtle Soft soldering fluxes - Test methods: - Part I: Determination of non-volatile matter, gravimetric method - Part 2: Determination of non-volatile matter, ebulliometric method - Part 3: Determination of acid value, potentiometric and

7、visual titration methods - Part 5: Copper mirror test - Part 6: Determination and detection of halide (excluding fluoride) content - Part 8: Determination of zinc content - Part 9: Determination of ammonia content - Part 10: Flux efficacy tests, solder spread method 0 IS0 1996 All rrghts reserved. U

8、nless otherwtse specified, no part of thus publrcatron may be reproduced or utilized In any form or by any means, electronrc or mechanical, rncludrng photocopyrng and mrcrofilm, wrthout permission in writing from the publisher. International Organrzatron for Standardrzatron Case Postale 56 l Cl-l-1

9、211 Geneve 20 l Switzerland Printed in Swrtzerland ii Copyright International Organization for Standardization Provided by IHS under license with ISONot for ResaleNo reproduction or networking permitted without license from IHS-,-,-0 IS0 - - - - - - - IS0 9455-13:1996(E) Part 11: Solubility of flux

10、residues Part 12: Steel tube corrosion test Part 13: Determination of flux spattering Part 14: Assessment of tackiness of flux residues Part 15: Copper corrosion test Part 16: Flux efficacy tests, wetting balance method Part 17: Surface insulation resistance, comb test and electrochemical migration

11、test of flux residues. III Copyright International Organization for Standardization Provided by IHS under license with ISONot for ResaleNo reproduction or networking permitted without license from IHS-,-,-INTERNATIONAL STANDARD 0 IS0 IS0 9455-13:1996(E) Soft soldering fluxes - Test methods - Part 13

12、: Determination of flux spattering 1 Scope This part of IS0 9455 describes a method for estimating the tendency of a flux to spatter in use. It IS a qualitative (comparative) method and is only applicable to liquid fluxes, as defined in IS0 9454-l. The method is not applicable to flux cored solder w

13、ire, or to solder pastes. 2 Normative references The following standards contain provisions which, through reference in this text, constitute provisions of this part of IS0 9455. At the time of publication, the editions indicated were valid. All standards are subject to revision, and parties to agre

14、ements based on this part of IS0 9455 are encouraged to investigate the possibility of applying the most recent editions of the standards indicated below. Members of IEC and IS0 maintain registers of currently valid International Standards. IS0 3574: 1986, Cold-reduced carbon steel sheet of commerci

15、al and drawing qualities. IS0 9453: 1990, Soft solder alloys - Chemical compositions and forms. IS0 9454-1:1990, Soft soldering fluxes - Classification and requirements - Part I: Classification, labelling and packaging. 3 Principle A measured amount of the liquid flux under test is placed on a speci

16、men plate of sheet steel. The plate is heated on a solder bath and the plate examined visually for evidence of spattering of the flux. 4 Apparatus and materials Usual laboratory apparatus and, in particular, the following. 4.1 Solder bath, of rectangular cross-section, approximately 150 mm x 100 mm,

17、 containing at least 4 kg of tin- lead solder (such as IS0 9453, grade S-Sn63Pb37) having a liquidus less than 200 “C. The depth of the solder shall be such that the liquid surface of the solder is not greater than 5 mm from the bath rim. The bath shall be capable of being maintained at a temperatur

18、e of (400 f IO) “C. 1 Copyright International Organization for Standardization Provided by IHS under license with ISONot for ResaleNo reproduction or networking permitted without license from IHS-,-,-IS0 9455-13:1996(E) 0 IS0 4.2 Specimen plates, cut from 1 mm thick unalloyed steel sheet, deep drawi

19、ng quality, conforming to IS0 3574. The plates are to be cut to size, such that the length and width are 10 mm larger than the corresponding dimensions of the solder bath (4.1). 4.3 Silicon carbide cloth, 180 grade. 5 Procedure Adjust the temperature of the solder in the solder bath (4.1) to (400 +

20、10) “C. Ensure that the level of the solder in the bath is 4 mm f 1 mm below the level of the rim of the bath. Carry out the following procedure on three specimen plates (4.2) Using the silicon carbide cloth (4.3), clean the surface of each specimen plate immediately before testing in order to remov

21、e all oxidation and contamination from the steel. By means of a fine graduated pipette, transfer (0,l f 0,Ol) ml of the liquid test flux to the centre of one of the specimen plates. Immediately after application of the flux, carefully place the specimen plate, flux upwards, on the rim of the solder

22、bath, such that it covers the rim completely. During these operations, ensure that the solder bath is located in still air conditions. Remove the plate after 3 min and examine it visually for evidence of spattering Repeat this procedure for each of the two remaining specimen plates, whilst maintaini

23、ng the solder bath temperature at (400 f 10) “C. 6 Expression of results The average result obtained from the three tests is assessed, compared with figure 1, and reported as either “no spattering” or “spattering occurs”. Alternatively, a reference flux of known satisfactory performance may be subje

24、cted to the same procedure as described in clause 5, and the average spattering rating of the test flux reported as “equal to”, “better than” or “worse than” the average for the reference flux. 7 Test report The test report shall include the following information: a) the identification of the flux t

25、est sample; b) the test method used (i.e. reference to this part of IS0 9455); c) the results obtained from the test, either in absolute terms, or by comparison with a reference flux, the details of which should be given; d) any unusual features noted in the test; e) details of any operation not spe

26、cified in the method, or any optional operation which may have influenced the result. 2 Copyright International Organization for Standardization Provided by IHS under license with ISONot for ResaleNo reproduction or networking permitted without license from IHS-,-,-0 IS0 IS0 9455-13:1996(E) No spatt

27、ering of flux Flux spattering occurs Figure 1 - Spattering of soldering flux 3 Copyright International Organization for Standardization Provided by IHS under license with ISONot for ResaleNo reproduction or networking permitted without license from IHS-,-,-IS0 9455-13:1996(E) ICS 25.160.50 Descriptors: soldering, soldering fluxes, tests, determination, properks. Pme based on 3 pages Copyright International Organization for Standardization Provided by IHS under license with ISONot for ResaleNo reproduction or networking permitted without license from IHS-,-,-