NAVY MIL-M-85677-1987 MOUNTING ELECTRICAL EQUIPMENT MT-6330 ARC《MT-6330 ARC型电子装配设备》.pdf

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1、MIL-M-85677 58 = 7797706 0176605 8 MI L - 14-85 6 7 7 AS ) 7 JULY 1987 MILITARY SPECIFICATION MOUNTING, ELECTRICAL EQUIPMENT MT-6330/ARC This specification is approved for use within the Naval Air Systems Command, Department of the Navy and is available for use by all Departments and Agencies of the

2、 Department of Defense. 1. SCOPE 1.1 Scope. This specification establishes the design, performance, and acceptance requirements for MT-6330/ARC Electrical Equipment Mounting hereinafter referred to as the mounting. support and interconnecting wiring for the RT-l250A/ARC receiver-transmi tter AM-7177

3、A/ARC radio frequency amplifier, and the F-l556/ARC bandpass filter AN/ARC-182 (V) uni ts. The mounting covered herein provides 2. APPLICABLE DOCUMENTS 2.1 Government docunien ts. 2.1.1 Specification and standards. The fol lowing specifications and standards form a part of this specification to the

4、exterit specified herein. Unless otherwise specified, the issues of these documents shall be those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solici tation. Beneficial comments (recommendtions, addi tions, dele

5、tions) and any pertinent data which may be of use in improving this document should be addressed to: Commaning Officer, Naval Air Engineering Center, Systems Engineering and Standardiza- tion Department (SESD) Code 53, Lakehurst, NJ 08733-5100, by using the sel f-addressea Standardization Document I

6、mprovement Proposal (D Form 1426) appearing at the end of this document or by letter. DISTRIBUTION STATEMENT A: Approved for public release; distribution is un1 imi ted. AMSC N/A FSC 5821 ./ 1. . THIS DOCUMENT CONTAINS ,!,LA PAGES. Provided by IHSNot for ResaleNo reproduction or networking permitted

7、 without license from IHS-,-,-SPEC1 FI CATIONS Federal QQ-P -41 6 Mi 1 i tary NI L-6-508 7 MIL-W-5Ob8 MIL-E-5400 MI L-T-5422 MIL-C-5541 MI L - E - 1 75 5 5 MIL-T-18303 141 L - N - 183 O 7 MIL-S-25879 MI L-C-26482 MI L - M-3 U5 1 O liir L - c-3 8 9 9 9 HI L-C-39018 MI L- t 1-4 6 8 5 5 MI L -P -5 51 1

8、0 MIL-M-85b77 58 M 9799906 OL76bOb T MIL-M-85677( AS) Plating Cadmium, (Electro deposited) Bonding, Electrical , and Lightning Protection, for Aerospace Systems Wiring; Aerospace vehicle Electronic Equipment, Airborne, General Specification for Testing, Environmental , Aircraft Electronic Equipment

9、Chemical conversion coatings on aluminum alloys Electronic and Electrical Equipment, Accessories, and Repair Parts, Packaging and Packing of Test Procedures; Preproduction, Acceptance and Life for Aircraft Electronic Equipment, Format for Nomencl ature and I denti fi cation for El ectroni cy Aeronau

10、tical, and Aeronautical Support Equipment Including Ground Support; Equipment Switch, Coaxial , Radio Frequency Transmission Li ne Connector, Electrical , (Circular, Miniature, Quick Disconnect, Environment Resisting), Receptacles and Plugs, General Specification for Microcircuits General Specificat

11、ion for Connectors, Electrical, Circular, Miniature, High Density, Quick Disconnect, Environmental Resistant, Removable Crimp Contacts, General Specification for Capacitor, Fixed Electrolytic (Al uminum Oxide) , General Specification for Human Engineering Requirements for Military Systems, Equipment

12、 and Facilities Printed Wiring Boards 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-M-5677 58 7777706 0376607 3 MI L-F.4-856 7 7 ( AS 1 2 MI L-C-83 723 STANDARD Mi 1 i tary MIL-STD-129 MI L-STD-2 75 M1.L-STD-415 MIL-STD-454 MIL-STD-461 MI L-S

13、TD-462 MI L-STD-471 MIL-STD-704 MIL-STD-781 MIL-STD-785 MIL-STD-883 MIL-STD-965 MI L-STD-1472 MIL-STD-1562 MIL-STD-1679 MIL-STD-2074 MI L-STD-2076 MI L-STD-2077 MI L-STD-2084 Connectors, Electrical, (Circular, Environment Resisting), Receptacles and Plugs, General Specification for Marking for Shipm

14、ent and Storage Printed Wiring for Electronic Equipment Test Provisions for Electronic Systems and Associated Equipment, Design Cri teria for Standard General Requirements for Electronic Equi pmen t Electromagnetic Emission and Susceptibility Measurements for the Control of Electromagnetic Interfere

15、nce Electromagnetic Interference Characteristics, Measurement of Maintainability Demonstration Electric Power, Aircraft, Characteristics and Uti1 ization of Re1 iabi 1 i ty Tests; Exponential Di sxri bution Re1 i abi 1 i ty Program for Systenis and Equipment Deve1 opmerit and Production Test Methods

16、 and Procedures for Microelectronics Parts Control Program Human Engineering Design Cri teria for Mi 1 i Lary Systems, Equipment and Facilities Lists of Standard Microcircuits Weapon System Software Development Failure Classification for Reliability Testing Unit Under Test Compatibility with Automat

17、ic Test Equipment, General Requirements for Test Program Sets, General Requirements for Maintainability of Avionics and Electronic Systems and Equipment, General Requirements for 3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-flIL-fl-85b77 58 9494

18、70b 017bbO 3 M 2,I.z Other Government documents. The following other Government documents form a part of this specification to the extent specified herein. Unless otherwise specified, the issues shall be those in effect on the date of the sol ici tation. OCUMENTS Naval Air Systems Command EI-669 AD-

19、1115 WS-6536 Department of the Navy NAVMAT P-4855.1 NAVNAT P-9492 Avionics Instal lation Instructions for Radio Set AN /ARG182 Electromagnetic Compatibility Design Guide for Avionics and Related Ground Support Equipment Process Specification Procedures and Requirements for Preparations and Soldering

20、 of Electrical Connections Navy Power Supply Re1 iabi 1 i ty Navy Manufacturing Screening Program (Copies of specifications, standards and other Government documents required by contractors in connection with specific acquisition functions should be obtained from the contracting activity or as direc

21、ted by the contracting activity. 1 2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein, (except for associated detail specifications, specification sheets or MS standards), the text of this specification shall take precedence. No

22、thirig in this specification, however, shall supersede applicable laws and regulations unless a specific exemption has been obtained, 3 , REQUIREMENTS 3.1 Item description. The mounting covered herein shall provide support and interconnecting wiring for the RT-lZSOA/ARC receiver- transmi tter, AM-71

23、77A/ARC radio frequency amp1 ifier, and the F-l556/ARC fil ter, bandpass AN/ARC-l2(V) units, The MT-6330/ARC with the above units instal led shall have provisions for attaching directly to the MT-2653/ARC. This mounting shall provide vibration isolation and cooling facilities as necessary such that

24、the asserribly has environmental capability, comparable to that of the AN/ARC-51 system, as specified hereih. swi tciiing and fault sensing circuitry in conjunction with the attached unit functions to provide the performance and switching as delineated in the system specification. This mounting shal

25、l also include 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-M-5677 58 9997906 0376609 5 3.1.1 Module complement. The mounting shall contain the following shop replaceable assemblies (SRAs) : a. Al - Chassis Assembly b. A2 - Audio/Control Cir

26、cuit Card c. d. A4 - Regulator Assembly A3 - Pulse Blanker Assembly e. A5 - Cooler Assembly 3.2 First article. When specified in the contract or purchase order (see 6.2.1), a sample shalr be subjected to first article inspection (see 4.4 and 6.3). 3.3 Parts. In the selection of parts, the prime cons

27、iderations are ful fillme- performance requirements, logistics supportability, and reliability assurance in a cost effective design. in parts selection. The following shall govern a. Subassemblies shall be designed and fabricated to be repairable. Maximum economic standardization of parts and materi

28、als shall be exercised. Parts selection shall be made in the following order of precedence: ( 1 ) Mi 1 i tary Standard parts s ha1 1 be sel ec ted in accordance wi th MIL-STD-454. (2) Nonstandard parts previously qualified for other programs, (3) Nonstandard parts. b. Nonstandard parts and nonestabl

29、ished reliability military standard parks shall be screened to the requirements of the most similiar military standard or standard nonestablished reliability part integrated circuits and hybrids shall use MIL-STD-883, Method 5004, Class B, as a basis for tailored screens. Purchase specifications sha

30、ll specifically delineate screening requirements. 3.3.1 Component rescreening. The contractor shall conduct 100 percent incoming inspection of a11 active components used in production equipment and spares. Functiorial and parametric checks of active components will be performed at the components rat

31、ed temperature extremes and at ambient. Components which are not compliant with their specifications shall not be used in the ARC-182. 3.3.2 Parts derating and application. All parts used shall be applied well within their ratings. The derating shall encompass the appropriate and meaningful applicat

32、ion conditions such as vol tage, current, power, temperature, mechanical, and duty cycle. Electronic and electromechanical parts shall conform to Table I electronic parts derating for worst case electrical and environmental stress unless formal written approval is received from the procuring activit

33、y prior to incorporation into the design. Part level stress analysis shall be used to verify that all parameter stresses are Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-U-85677 58 M 49494Ob OL7bbLO L M Parame ter MIL-M-85677 (AS) Maximum Allo

34、wable Application Stress TABLE I. Electronic parts derating, Power Current Vol tage Junction Temperature Power Vol tage Junction Temperature Part Type Capacitor 50% of rating 75% of rating 60% of rating 55% of rating 60% of rating - 21 - 2/ Resistors Power Junction Temperature Diodes 75% of rating -

35、 21 Transistors Integrated Circuits Digital Li near Trans formers, I nducti ve Devices Applied Vol tage (Ripple Vol tage for Tantal um) 50% of rating - 11 Power Vol tage 50% of rating I 70% of rating Fan-Out, Fan-In Junction Temperature 80% of rating - 2/ Parts shall be use at a winding temperature

36、of at least 30 degrees below rated temperature. In addi tion, the maximum vol tage between windings or between a winding and a Shield shall be not greater than 60% of rated voltage for the steady state conditions and 90% of rated voltage with transients. General purpose inductors, audio and power tr

37、ansformers shall be applied at no more than 70% of rated current. - i/ For solid tantalum and all electrolytic capacitors, the maximum applied voltage shall be not greater than 70 percent of the vendor rated value. “Applied voltage“ is the sum of the applied peak ripple voltage and the applied DC vo

38、ltage. For high Q ceramic capacitors, the applied voltage shall be riot greater than 80 percent of the vendor rated value. 21 Semiconductor devices shall be mounted and operated in such manner to - insure worst-case junction temperature does not exceed 110 degrees C at +Il degrees C ambient temperat

39、ure. approval. mounted and operated with worst case junction temperatures not to exceed 150 degrees C at +71 degrees C ambient temperatures. Any deviation requires procuring activity Power semiconductor devices, on a very selective basis, may be a . 1 . e 6 Provided by IHSNot for ResaleNo reproducti

40、on or networking permitted without license from IHS-,-,-a a a wi thin the derated values at worst case circuit and environmental conditions. The following limitations on parts usage shall apply: a. Prohibited application (1) Non-hermetical ly sealed semiconductors except power transistors (2) Photo

41、couplers (photo transistors) (3) Hot carrier (Schottky) power rectifiers (4) Microcircuit sockets (5) Non-hermetically sealed wet tantalum capacitors 3.3.3 Parts control program. The contractor shall establish and maintain a parts control program in accordance with the requirements of MIL-STD-965, P

42、rocedure I and as specified herein. The program shall control part standardization and the criteria for the selection, application, and testing of parts to achieve the reliability required. As a minimum, a parts program equivalent to that specified herein shall be required of subcontractors and supp

43、liers. procuring activity) approval of all non-standard parts used in the equipment. Standard parts are defined in MIL-E-5400. requirements for standard parts, microelectronic parts are standard only if: 3.3.4 Non-standard parts approval, The contractor shall obtain (from the In addition to the MIL-

44、E-5400 a. The device is listed in MIL-STD-1562, and b. Sources (at least two) are listed on the Qualified Parts List (QPL), and c. The part is procured from one of the qualified sources, and d. Quality level “B“ (orbetter) of MIL-M-38510 is required. The approval procedure shall be in accordance wit

45、h MIL-E-5400 and MIL-STD-965, Procedure I. In addition to the requirements of MIL-E-5400, approval of non- .standard parts will be based on: a. Suitability for the application b. c . Conformance to this specification and to MIL-E-5400 I n terchangeabi 1 i ty d. Screening (burn-in) method 3.3.5 Sampl

46、es of non-standard parts. Samples of non-standard parts and materials are not required unless specified in the contract. non-standard parts samples are specifiea in the contract, the sample shall be in accordance with MIL-E-5400. (See 6.2.1) Where 3.3.6 Cab1 itig and connections. 7 Provided by IHSNo

47、t for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-M-85677 58 W 4777706 0176bL2 5 W MI t-M-85677 (AS 3,3,6.1 Cables and connectors. The mounting shall provide for the use of cables and connectors iri accordance with MIL-E-5400. The design Of the connectors shall be

48、such that improper assembly, mating, or installation is impossible. Non-RF connectors shall meet the requirements of MIL-C-38999 with the exception of the filter and HPA interface connectors. All external connectors shall be scoop-proof, have cadmium plating finish in accordance with QQ-P-416 (over

49、a sui table underplating) to withstand a 500 hour salt test, and provide 360 degrees circumferential grounding techniques for groundng prior to contact engagement. The HPA and filter interface connectors shall meet the requirements of MIL-C-26482 or MIL-C-83723. 3.3.6.2 Interconnection cabling, The mounting shall be capable of required operation using external wiring in accordance with the applicable requirements of MIL-W-5088. The externa