FORD WSS-M11P28-D-2014 ADHESION REQUIREMENTS ADHESIVE FOR BONDING EXTERIOR FRONT AND REAR LAMP ASSEMBLIES TO BE USED WITH FORD WSS-M99P1111 - A .pdf

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1、 ENGINEERING MATERIAL SPECIFICATION Date Action Revisions Rev. 0 2014 01 07 Released R Harris, C McComb, NA Controlled document at www.MATS Copyright 2014, Ford Global Technologies, LLC Page 1 of 6 ADHESION REQUIREMENTS, ADHESIVE FOR WSS-M11P28-D BONDING EXTERIOR FRONT AND REAR LAMP ASSEMBLIES 1. SC

2、OPE This specification defines the performance requirements for an adhesive or adhesive system suitable for bonding front and rear lighting. 2. APPLICATION This specification was released originally for an adhesive or an adhesive system used to bond lenses to bodies in the construction of lamp assem

3、blies. 2.1 LIMITATIONS 2.1.1 Use of thermoplastic sealers and adhesives are not allowed. 2.1.2 Surface treatment (adhesion promoting CPO primer or plasma fluming) of polypropylene is necessary to achieve adequate bonding. 3. REQUIREMENTS Materials meeting these performance specifications are identif

4、ied on the Approved Source List Adhesive bonded lamp assemblies must meet all other exterior lighting system requirements. Initial material approval testing is to be conducted at DV using plaques. PV testing is on full lamp assemblies. See Table 1 for sample sizes and required testing. 3.1 STANDARD

5、REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements for Production Materials (WSS-M99P1111-A). 3.2 ADHESION STRENGTH LAP SHEAR (ASTM D3163, 12.7 mm/min crosshead speed) The lap shear coupons shall consist of typical productio

6、n materials. Clean the surfaces to be bonded with a hot, soapy water solution. The soap shall be free rinsing, similar to that used for glassware. After cleaning, the coupons are blown dry and conditioned at 23 +/- 2 C for 24 h to ensure dryness. Dispense an amount of adhesive on to the housing mate

7、rial coupon that will fill a 25 mm overlap with a minimum bond thickness of 0.76 mm. Shim the interface with 0.76 mm wire or glass beads to maintain the required minimum thickness and overlap. Apply the lens material coupon onto the adhesive/housing coupon and remove any excess adhesive. Maintain pr

8、oper alignment of the assemblies during cure. Follow the cure schedule as recommended by the adhesive manufacturer. Include the manufacturers recommended open time and cure schedule in the test report. Note: Proper alignment of the test assembly is critical. Every effort should be made to maintain u

9、niform tension across the bond area. Cleavage or peel of the bond area could yield inaccurate results. ENGINEERING MATERIAL SPECIFICATION WSS-M11P28-D Copyright 2014, Ford Global Technologies, LLC Page 2 of 6 Evaluate a minimum of three assemblies per condition. Report failure mode and peak load in

10、Newtons and % deformation. Deformation is identified as crosshead travel at maximum load. Normal (Condition for 30 minutes at Min Load, N Min Deformation, % specified temperature prior to test) 3.2.1 Test at 23 +/- 2 C 600 40 3.2.2 Test at 107 +/- 2 C 450 40 3.2.3 Test at -30 +/- 1 C 900 35 Exposed

11、(After environmental aging in paragraphs 3.2.4- 3.2.8 condition samples for 24 h at 23 +/- 2 C prior to lap shear testing) 3.2.4 Heat Age 700 40 (14 days at 107 +/- 2 C) 3.2.5 Humidity 500 40 (14 days at 38 +/- 1 C and 95-100% R.H.) 3.2.6 Water Immersion 500 40 (14 days, FLTM BI 104-01) 3.2.7 Weathe

12、rometer. 700 40 (SAE J2527, 2000 h, 0.55 W/m2 Irradiance) 3.2.8 Thermal Cycle 600 40 (10 cycles, DVO-19766) 1 cycle = 2 h at 50 C Ramp to -40 C (rate 0.75 1.5 C/min) 2 h at -40 C Ramp to 50 C (rate 0.75 1.5 C/min) 3.3 STABILITY When subjected to the following exposures, the adhesive viscosity and ad

13、hesion strength shall be +/- 25% of that obtained when originally tested. 3.3.1 Shelf Life (6 months at 23 +/- 2 C) 3.3.1.3 Viscosity +/- 25% 3.3.1.2 Adhesion strength, Para 3.2.1 3.2.8 +/- 25% 3.3.2 Transit, simulated, (72 h at 80 +/- 2 C) 3.3.2.1 Viscosity +/- 25% 3.3.2.2 Adhesion strength, Para 3

14、.2.1 3.2.8 +/- 25% 3.3.3 Viscosity, original Report (ASTM D3236 - spindle, temperature and speed per suppliers recommendation) ENGINEERING MATERIAL SPECIFICATION WSS-M11P28-D Copyright 2014, Ford Global Technologies, LLC Page 3 of 6 3.4 CREEPAGE No slippage (ASTM D1780, prepare test samples per para

15、 3.2, apply a 4.5 kg dead weight load to test samples and expose to 85 +/- 2 C for 24 h) 3.5 COLD SLAM RESISTANCE No cracking, adhesive (FLTM BV 101-02, 10 cycles of 6 slams or cohesive failure per cycle at -30 +/- 1 C) Prepare test assemblies as illustrated in Figure 1. Test substrates shall consis

16、t of 100 x 250 mm panels Follow the cure schedule as recommended by the adhesive manufacturer. Mechanically attach bonded test assembly to a 0.8 x 300 x 300 mm CRS base panel. Centrally locate test assembly on base panel. Conduct test as outlined per FLTM BV 101-02 following steps 9, 10 and 11. Posi

17、tion panel in slam fixture with reinforcement facing inward. Subject each test assembly to 10 cycles of six slams per cycle at -30 +/- 1 C. 3.6 LAMP ASSEMBLY TESTING Test parts shall be manufactured with production or production representative processes and equipment. Evaluate a minimum of 2 pair (l

18、eft and right) per condition at 23 +/- 2 C. Every lamp shall be pressure tested prior to, and after the specific exposures listed below. 3.6.1 Seal Integrity Under Air Pressure, Baseline No leaks (EX-0224, DVM -14455) 3.6.2 Resistance to Thermal Cycle (EX-0009, DVM -14455) Para 3.2.8: All lamps are

19、lit at point A, off at point B - Reverse lamps are cycled separately Lamp assembly shall not exhibit warpage, degradation in photometrics, or sink marks when subjected to thermal conditioning. They shall not leak when tested for seal integrity under air pressure. 3.6.3 Resistance to Heat Age (14 day

20、s at 107 +/- 2 C, DVM -14455) Lamp assembly shall not exhibit warpage, degradation in photometrics, or sink marks when subjected to heat age conditioning. They shall not leak when tested for seal integrity under air pressure. 3.6.4 Resistance to Vibration (EX-0008, DVM -14455) Lamp assembly shall no

21、t exhibit visible cracks, breakage or deformation when subjected to thermal cycling / vibration exposure. They shall not leak when tested for seal integrity under air pressure. 3.6.5 Resistance to Thermal Shock (Heat soak lamp assembly 4 h at 82 +/- 2 C, immediately immerse the lens in ice water bat

22、h at 0 C, DVM -14455) Lamp assembly shall not exhibit warpage, degradation in photometrics, or sink marks when subjected to thermal shock. They shall not leak when tested for seal integrity under air pressure. ENGINEERING MATERIAL SPECIFICATION WSS-M11P28-D Copyright 2014, Ford Global Technologies,

23、LLC Page 4 of 6 3.6.6 Adhesive Resistance to Reflow / Expulsion (Following a 24 h maximum cure at 23 +/-2 C, expose lamp assembly to 85 C, all lamp functions energized at their highest wattage mode 14V (turn signals flashing at 90 flashes per minute & 70% On), for 24 h of test time. Examine at 6 and

24、 24 h for reflow/expulsion) There shall be no adhesive blistering or flow outside the glue “U” track. For adhesives not complying within 24 hours of maximum cure time, the lamp supplier Control Plan will include a hold time at the supplier equal to or greater than the time required to meet the reflo

25、w/expulsion performance test 4. GENERAL INFORMATION The information given below is provided for clarification and assistance in meeting the requirements of this specification. Contact for questions concerning Engineering Material Specifications. 4.1 SYSTEM COMPONENTS Primers or other surface treatm

26、ents utilized to achieve adequate adhesion of adhesive material to the substrates shall not adversely affect the physical properties of the substrate material. 4.1.1 Substrates As specified on the Engineering Document, all potential combinations shall be evaluated during plaque testing. 4.1.2 Adhesi

27、ve Shall be free from unwanted flow and outgassing from the lamp “glue track” during cure and post cure. The adhesive product code must be noted in the initial submission package and identified on the Tier suppliers drawing. 4.2 CURE SCHEDULES Cure schedules as specified by the adhesive manufacturer

28、. 4.3 VISCOSITY Viscosity should be recorded and referenced for Stability Testing baseline (Para 3.3) and submitted at PPAP for subsequent batch Certificate of Compliance. 4.4 SYSTEM DESIGN REQUIREMENTS EX-0010 = RQT-170000-010973 Exterior Lighting Clearance to Radiant Heat Sources EX-0224 = RQT-170

29、000-011017 Water Ingress and Condensation Prevention EX-0009 = RQT-170000-010972 Resistance to Thermal Cycle EX-0008 = RQT-170000-010971 Vibration Endurance DVM-14455 = Legacy DVM ID 14455 DVO-19766 = As per Para 3.2.8 5.0 SUMMARY OF REVISIONS ENGINEERING MATERIAL SPECIFICATION WSS-M11P28-D Copyrigh

30、t 2014, Ford Global Technologies, LLC Page 5 of 6 COLD SLAM TEST ASSEMBLY Figure 1 ENGINEERING MATERIAL SPECIFICATION WSS-M11P28-D Copyright 2014, Ford Global Technologies, LLC Page 6 of 6 MINIMUM SAMPLE REQUIREMENTS Table 1 TESTS Number of Parts/Test Specimens DV PV 3.2 Adhesion Strength, Plaque Te

31、sting 3.2.1 At Ambient, 23 C 9 plaques*: 3 as received 3 after Shelf Stability 3 after Transit Stability X 3.2.2 At 107 C 9 plaques*: 3 as received 3 after Shelf Stability 3 after Transit Stability X 3.2.3 At -30 C 9 plaques*: 3 as received 3 after Shelf Stability 3 after Transit Stability X 3.2.4 A

32、fter 14 days at 107 C 9 plaques*: 3 as received 3 after Shelf Stability 3 after Transit Stability X 3.2.5 After 14 days Humidity 9 plaques*: 3 as received 3 after Shelf Stability 3 after Transit Stability X 3.2.6 After 14 days Water Immersion 9 plaques*: 3 as received 3 after Shelf Stability 3 after

33、 Transit Stability X 3.2.7 After Weatherometer 18 plaques*, 1 each for 500, 1000, 1500 & 3 for 2000 h exposures Repeated: as received after Shelf Stability after Transit Stability X 3.2.8 After Thermal Cycling 18 plaques*, 1 each for 500, 1000, 1500 & 3 for 2000 h exposures Repeated: as received aft

34、er Shelf Stability after Transit Stability X 3.3.1 Shelf Stability, 6 months at 23 C Identified above X 3.3.2 Transit Stability, 72 h at 80 C Identified above X 3.4 Creep Resistance 3 plaques* X 3.5 Cold Slam Resistance 3 plaques* X 3.6 Assembly Testing 3.6.1 Seal Integrity (leak test baseline) 2 pa

35、ir X 3.6.2 Thermal Cycling (leak test) 2 pair X 3.6.3 Heat Age (leak test) 2 pair X 3.6.4 Vibration (leak test) 2 pair X 3.6.5 Thermal Shock (leak test) 2 pair X 3.6.6 Reflow / Expulsion Resistance 2 pair X * : Replicates identified are for all applicable substrate combinations DV: Testing to be performed on plaques PV: Testing must be performed on parts