FORD ESF-M11A19-A-2012 SOLDER PASTE (63% TIN) TO BE USED WITH FORD WSS-M99P1111-A .pdf
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1、 ENGINEERING MATERIAL SPECIFICATION Date Action Revisions 2012 07 25 N-Status No replacement A. Wedepohl, NA 2005 02 03 Revised Inserted 3.0; Deleted 1966 12 12 Released F6-2929 Controlled document at www.MATS Copyright 2012, Ford Global Technologies, LLC Page 1 of 2 SOLDER PASTE (63% TIN) NOT FOR N
2、EW DESIGN ESF-M11A19-A 1. SCOPE The material defined by this specification is a self fluxing solder paste. 2. APPLICATION This specification was released originally for material used for soldering electrical connections and other applications where the use of a corrosive flux must be avoided. 3. REQ
3、UIREMENTS The solder is a homogeneous suspension of a pre-alloyed solder powder in a formulated screening and fluxing vehicle. The powder shall be free of lumps and pulverized to 100 mesh or finer. 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform
4、to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.1 COMPOSITION Solder 79 - 83 Flux Remainder 3.1.1 Solder Composition (ASTM B 32, Grade 63 B) Tin 62.0 - 64.0 Zinc 0.005 max Antimony 0.20 - 0.50 Bismuth 0.25 max Copper 0.08 max Iron 0.02 max Aluminum 0.005 max Total
5、Other Elements 0.08 max Lead Remainder 3.1.2 Flux Analysis Flux 43% min Vehicle Remainder 3.2 PHYSICAL PROPERTIES 3.2.1 Liquidus 183 +/- 3 C Solidus (Eutectic) 183 +/- 3 C ENGINEERING MATERIAL SPECIFICATION ESF-M11A19-A Copyright 2012, Ford Global Technologies, LLC Page 2 of 2 3.2.2 Specific Gravity
6、 3.5 min (ASTM D 70) 3.2.3 Viscosity, at 25 C 285,000 - 345,000 cP (mPa.s) Test Method: Machine mix at 400 - 450 RPM for 2 1/2 to 3 1/2 minutes with a single egg-beater type agitator, then measure viscosity with a Brookfield Viscometer Model RVF, #7 Spindle, 10 RPM. 3.3 CORROSION ACTIVITY None Test
7、Method: Use a copper coupon (5 samples) 35 mm sq. 0.33 mm thick. Clean the coupon with stainless steel wool, and carefully vapor degrease it with CC1 4. Place the coupons in tightly sealed glass jars until needed. Weigh the solder paste samples on an analytical balance to a weight of 0.5 +/- 0.01 g.
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