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    FORD ESF-M11A19-A-2012 SOLDER PASTE (63% TIN) TO BE USED WITH FORD WSS-M99P1111-A .pdf

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    FORD ESF-M11A19-A-2012 SOLDER PASTE (63% TIN) TO BE USED WITH FORD WSS-M99P1111-A .pdf

    1、 ENGINEERING MATERIAL SPECIFICATION Date Action Revisions 2012 07 25 N-Status No replacement A. Wedepohl, NA 2005 02 03 Revised Inserted 3.0; Deleted 1966 12 12 Released F6-2929 Controlled document at www.MATS Copyright 2012, Ford Global Technologies, LLC Page 1 of 2 SOLDER PASTE (63% TIN) NOT FOR N

    2、EW DESIGN ESF-M11A19-A 1. SCOPE The material defined by this specification is a self fluxing solder paste. 2. APPLICATION This specification was released originally for material used for soldering electrical connections and other applications where the use of a corrosive flux must be avoided. 3. REQ

    3、UIREMENTS The solder is a homogeneous suspension of a pre-alloyed solder powder in a formulated screening and fluxing vehicle. The powder shall be free of lumps and pulverized to 100 mesh or finer. 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform

    4、to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.1 COMPOSITION Solder 79 - 83 Flux Remainder 3.1.1 Solder Composition (ASTM B 32, Grade 63 B) Tin 62.0 - 64.0 Zinc 0.005 max Antimony 0.20 - 0.50 Bismuth 0.25 max Copper 0.08 max Iron 0.02 max Aluminum 0.005 max Total

    5、Other Elements 0.08 max Lead Remainder 3.1.2 Flux Analysis Flux 43% min Vehicle Remainder 3.2 PHYSICAL PROPERTIES 3.2.1 Liquidus 183 +/- 3 C Solidus (Eutectic) 183 +/- 3 C ENGINEERING MATERIAL SPECIFICATION ESF-M11A19-A Copyright 2012, Ford Global Technologies, LLC Page 2 of 2 3.2.2 Specific Gravity

    6、 3.5 min (ASTM D 70) 3.2.3 Viscosity, at 25 C 285,000 - 345,000 cP (mPa.s) Test Method: Machine mix at 400 - 450 RPM for 2 1/2 to 3 1/2 minutes with a single egg-beater type agitator, then measure viscosity with a Brookfield Viscometer Model RVF, #7 Spindle, 10 RPM. 3.3 CORROSION ACTIVITY None Test

    7、Method: Use a copper coupon (5 samples) 35 mm sq. 0.33 mm thick. Clean the coupon with stainless steel wool, and carefully vapor degrease it with CC1 4. Place the coupons in tightly sealed glass jars until needed. Weigh the solder paste samples on an analytical balance to a weight of 0.5 +/- 0.01 g.

    8、 Place each weighed sample on a coupon and put the entire sample (paste plus coupon) in an oven at 205 C until all of the flux is burned off. Be sure that all of the samples are at the same level in the oven. At this point, the soldered coupons are removed from the oven, allowed to cool to room temp

    9、erature, and placed into a humidity cabinet (98 +/- 2% R.H. at 39 +/- 1 C for 72 hours). There shall be no evidence of corrosion when the samples are viewed under a low power microscope (20X). 3.4 SOLDERABILITY Area, min Total 271 mm 2 Partial 129 mm Test Method: Use a copper coupon 35 mm sq. 0.33 m

    10、m thick. Clean the coupon with stainless steel wool, carefully vapor degrease with CC1 4; and oxidize it in an electric oven for 1 1/2 hours at 210 C. Be sure to have the coupons at the same level in the oven. After the oxidation is completed, remove the coupons from the oven and place them in clean

    11、 tightly sealed glass jars until needed. A holding pot of molten solder is brought up to a temperature of 204 C. A piece of aluminum is floated on top of the molten solder; the thickness of the aluminum being 1.57 mm. At this point, solder paste samples are weighed on an analytical balance to a weig

    12、ht of 0.5 +/- 0.01 g. The paste samples are placed on the oxidized copper coupon, and the entire sample (paste plus coupon) is immediately placed on the aluminum. The solder is left to spread until all of the flux is burned off. The coupon is then placed in the flux remover, cleaned and marked. The

    13、spread is then measured by a K & E Planimeter (Model 4236). Seven samples are tested and four readings taken on each spread. The average on each coupon and on the seven samples is then computed. After spreading, the solder pulls back from the area of maximum spread (dewetting) so that two areas of s

    14、pread are measured on each coupon. The maximum is recorded as “Total“ and the minimum as “Partial“. 4. GENERAL INFORMATION The information given below is provided for clarification and assistance in meeting the requirements of this specification. Contact for questions concerning Engineering Material Specifications. This material has a tendency to separate and should be stirred before loading into the applicator.


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