ECA 580AA00-1991 Blank Detail Specification for Fixed Metallized Polyethylene-Terephthalate Film Dielectric Chip Capacitors for Direct Current - Encapsulated.pdf
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1、ANSU EIA- 580AA00-1991 APPFIOMD: Novirlnr i, 1981 O O U U O CD v) I w 0 IA S P ECI FI CATI ON Blank Detail Specification for Fixed Metallized Polyethylene- Terephthalate Film Dielectric Chip Capacitors for Direct Current - Encapsulated EIA-580AA00 DECEMBER 1991 ELECTRONIC IN DUSTRIES ASSOCIATION ENG
2、INEERING DEPARTMENT Aooroved kor Use In I. The NECQ Svstem EIA 580AA00 93 3234600 0078935 T I NOTICE EIA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and im
3、provement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or non- member of EIA from manufacturing or selling products not conf
4、orming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than EIA members, whether the standard is to be used either domestically or internationally. Q Recommended Standards and Publications are adopted by EIA w
5、ithout regard to whether their adoption may involve patents on articles, materials, or processes. By such action, EIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Recommended Standard or Publication. This EIA Specification is c
6、onsidered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between the EIA Specification and the IEC document can be made. This Specification does not purport to address all safety p
7、roblems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Speafication to establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use. (From Standards Proposal No. 2356 for
8、mulated under the cognizance of P-2.2 Subcommittee on Plastic and Paper Dielectric) Published by ELECTRONIC INDUSTRIES ASSOCIATION Engineering Department 2001 Pennsylvania Avenue N.W. Washington, D.C. 2ooo6 PRICE: Please refer to the current Catalog Of EIA , Ct D 3 12 1 4.6 Resistance to soldering h
9、eat 4.6.1 Initial measurements 4.6.2 Test conditions 4.6.3 Final measurements Capacitance Method: 1 Visual examination conditions, see 4.2.1 No signs of damage such as cracks. Capacitance - A c 13% of C value measured in 4.6.1 Subaroup C2 D 3 12 1 4.5 Bond Strength Capacitance (with A c 510% of of t
10、he end board in bent position) C value face plating measured in 4.3.2 Visual examination No visible damage. Subaroux, C3 D 4.1 Mounting 66 (See Note 4) 4.2.1 Visual examination 4.3.2 Capacitance 4.3.3 Tangent of loss angle At 1 kHz and 10 kHz for all capacitance values. 4.3.4 insulation resistance N
11、o visible damage. A c 12% of C value measured in Subgroup A2. As in 4.3.3 (Reference values for final measurements in Subgroups C3.1, C3.3 and C3.4). See 1.3 of t Detail Specification. EIA 58OAAOO 91 M 3234600 O078924 O EIA-580AA00 Page 9 SubarouD C3.1 D 4.4 Adhesion Subclause number D or Conditions
12、 AQL Performance IL requirements (See Note 1) (See Note 1) (See Note 2) (See Note 1) % and test ND of test 6 27 1 After mounting (see 4.1) force of 5 N applied for 10 f 1 s. 4.4.3 Intermediate inspection 4.8 Rapid change of temperature 4.8.1 Initial measurements 4.8.2 Test conditions 0 4.8.3 Interme
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