DLA SMD-5962-98539-2000 MICROCIRCUIT LINEAR RADIATION HARDENED SINGLE HIGH SPEED OPERATIONAL AMPLIFIER MONOLITHIC SILICON《微型电路 线型 辐射加固 单路高速 运算放大器 单块硅》.pdf
《DLA SMD-5962-98539-2000 MICROCIRCUIT LINEAR RADIATION HARDENED SINGLE HIGH SPEED OPERATIONAL AMPLIFIER MONOLITHIC SILICON《微型电路 线型 辐射加固 单路高速 运算放大器 单块硅》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-98539-2000 MICROCIRCUIT LINEAR RADIATION HARDENED SINGLE HIGH SPEED OPERATIONAL AMPLIFIER MONOLITHIC SILICON《微型电路 线型 辐射加固 单路高速 运算放大器 单块硅》.pdf(15页珍藏版)》请在麦多课文档分享上搜索。
1、REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV STATUS REV OF SHEETS SHEET 12 3 4 5 6 7 8 9 1011 1213 14 PMlC NIA PREPAREDBY L.G. Traylor DEFENSE SUPPLY CENTER COLUMBUS STANDARD CHECKED BY COLUMBUS, OHIO 43216 MICROCIRCUIT DRAWING Rajesh Pithadia APPROVED BY THIS DRAWING IS AVAILABLE Raymond
2、FOR USE BY ALL DEPARTMENTS HARDENED, SINGLE, HIGH SPEED, AND AGENCIES OF THE DEPARTMENT OF DEFENSE MICROCIRCUIT, LINEAR, RADIATION DRAWING APPROVAL DATE OPERATIONAL AMPLIFIER MONOLITHIC SILICON 00-05-26 AMSC NIA REVISION LEVEL 5962-98539 DSCC FORM 2233 APR 97 DISTRIBUTION STATEMENT A. Approved for p
3、ublic release; distribution is unlimited. 5962-E282-00 Licensed by Information Handling Services1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and
4、lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 m. The PIN is as shown in the following example: 1 Y 5962 98539 I I I I I I II Federal RHA Device Device Case Lea
5、d stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) I (see 1.2.3) V Drawing number 1.2.1 RHA desimator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA d
6、esignator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device tvpe(s). The device type(s) identify the circuit function as follows: Device tvpe Generic numbe
7、r Circuit function o1 LM1 18 Radiation hardened high speed, single, operational amplifier 1.2.3 Device class desimator. The device class designator is a single letter identifying the product assurance level as follows: Device class 11 Device requirements documentation M Vendor self-certification to
8、the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q orV Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive
9、desimator Terminals Packacle stvle G MACY 1 -X8 8 P GDlPl-T8 or CDIP2-T8 8 Z GDFPl -G1 O 10 Can Dual-in-line Flat pack with gull wing leads 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. - 11 Non RHA dev
10、ices are covered by MIL-M-3851 Oll 01. STANDARD MICROCIRCUIT DRAWING IA I I 5962-98539 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4321 6-5000 REVISION LEVEL SHEET 7 APR 97 Licensed by Information Handling Services1.3 Absolute maximum ratinas. I/ Positive supply voltage (+Vcc) +20.0 V Negative sup
11、ply voltage (-Vcc) . -20.0 V Differential input current fl O mA 21 Input voltage (VIN) . f15 V 31 Power dissipation (PD): 41 Case G . 750 mW at TA = +25“C Case P . 1 O00 mW at TA = +25“C Case Z 600 mW at TA = +25“C Output short circuit duration Continuous Storage temperature range -65C I TA I +150C
12、Junction temperature (TJ) . +175“C Lead temperature (soldering, 1 O seconds) +3OO0C Thermal resistance, junction-to-case (eJC): Case G . 48“CMl Case P . 17“CMl Case Z 22“CMl Thermal resistance, junction-to-ambient ()JA): Case G . 16O“CMl (still air at 0.5 W) Case P . 120“CMl Case Z 198“CMl 86“C/W (5
13、00 linear feet per minute air flow at 0.5 W) 66“C/W (500 linear feet per minute air flow at 0.5 W) 124“CMl (500 linear feet per minute air flow at 0.5 W) 1.4 Recommended operatina conditions. Supply voltage (fVcc) f20 V Ambient operating temperature range (TA) . -55C I TA I +125“C 1.5 Radiation feat
14、ures. s/ Maximum total dose available (dose rate = 50 - 300 rads (Si) / s) . 30 Krads - 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. differential input voltage in exces
15、s of 1 V is applied between the inputs unless some limiting resistance is used. - 2/ The inputs are shunted with back-to-back diodes for overvoltage protection. Therefore, excessive current will flow if a - 3/ For supply voltages less than f15 V, the absolute maximum input voltage is equal to the su
16、pply voltage. - 4/ The maximum power dissipation must be derated at elevated temperatures and is dictated by TJ maximum, eJA maximum, and TA. The maximum allowable power dissipation at any temperature is PD max = (TJ max - TA) / or the number given in the absolute maximum ratings, whichever is lower
17、. Radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883, method 1 O1 9, condition A. - 5/ These parts may be dose rate sensitive in a space environment and demonstrate enhanced low dose rate effect. STANDARD MICROCIRCUIT DRAWING IA I I
18、 5962-98539 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4321 6-5000 REVISION LEVEL SHEET R DSCC FORM 2234 APR 97 Licensed by Information Handling Services2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a par
19、t of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE
20、 MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-973 - Configuration Management. MIL-STD-1835 - Interface Standard For Microcircuit Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE
21、MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMDs). MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, P
22、A 191 11 -5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtaine
23、d. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
24、fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Desian, construction, and phvsical dimensions. The design, construction, and physical dimensi
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