DLA SMD-5962-94522 REV A-2001 MICROCIRCUIT DIGITAL BIPOLAR CMOS PROGRAMMABLE SKEW CLOCK BUFFER TTL COMPATIBLE INPUTS AND OUTPUTS MONOLITHIC SILICON《硅单片 TTL兼容输入及输出 可编程低失真时钟驱动器 氧化物半导.pdf
《DLA SMD-5962-94522 REV A-2001 MICROCIRCUIT DIGITAL BIPOLAR CMOS PROGRAMMABLE SKEW CLOCK BUFFER TTL COMPATIBLE INPUTS AND OUTPUTS MONOLITHIC SILICON《硅单片 TTL兼容输入及输出 可编程低失真时钟驱动器 氧化物半导.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-94522 REV A-2001 MICROCIRCUIT DIGITAL BIPOLAR CMOS PROGRAMMABLE SKEW CLOCK BUFFER TTL COMPATIBLE INPUTS AND OUTPUTS MONOLITHIC SILICON《硅单片 TTL兼容输入及输出 可编程低失真时钟驱动器 氧化物半导.pdf(21页珍藏版)》请在麦多课文档分享上搜索。
1、REVISIONSLTR DESCRIPTION DATE (YR -MO -DA) APPROVEDA Update boilerplate to MIL-PRF-38535 requirements. - jak 01-02-06 Thomas M. HessREVSHEETREV A A A A A ASHEET 15 16 17 18 19 20REV STATUS REV A A A A A A A A A A A A A AOF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14PMIC N/A PREPARED BY Joseph A. K
2、erby DEFENSE SUPPLY CENTER COLUMBUSSTANDARDMICROCIRCUITDRAWINGCHECKED BYThanh V. NguyenCOLUMBUS, OHIO 43216http:/www.dscc.dla.milTHIS DRAWING IS AVAILABLEFOR USE BY ALLDEPARTMENTSAPPROVED BYMonica L. Poelking MICROCIRCUIT, DIGITAL, BIPOLAR CMOS,PROGRAMMABLE SKEW CLOCK BUFFER, TTLAND AGENCIES OF THED
3、EPARTMENT OF DEFENSE DRAWING APPROVAL DATE94-09-28COMPATIBLE INPUTS AND OUTPUTS,MONOLITHIC SILICONAMSC N/A REVISION LEVELASIZEACAGE CODE67268 5962-94522SHEET 1 OF 20DSCC FORM 2233APR 97 5962 -E122-01DISTRIBUTION STATEMENT A . Approved for public release; distribution is unlimited.Provided by IHSNot
4、for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-94522DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 2DSCC FORM 2234APR 971. SCOPE1.1 Scope . This drawing documents two product assurance class levels
5、 consisting of high reliability (device classes Q andM) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in thePart or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in t
6、hePIN.1.2 PIN . The PIN is as shown in the following example:5962 - 94522 01 M X XFederal RHA Device Device Case Lead stock class designator type class outline finishdesignator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3)/ Drawing number1.2.1 RHA designator . Device class
7、es Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels andare marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix Aspecified RHA levels and are marked with the appropriate RHA designator. A dash ( -) indicates a non -RHA d
8、evice.1.2.2 Device type(s) . The device type(s) identify the circuit function as follows:Device type Generic number Circuit function Skew error01 7B991 Programmable skew clock buffer, 0.7 nsTTL compatible inputs and outputs1.2.3 Device class designator . The device class designator is a single lette
9、r identifying the product assurance level asfollows:Device class Device requirements documentationM Vendor self -certification to the requirements for MIL-STD-883 compliant,non -JAN class level B microcircuits in accordanc e with MIL-PRF-38535,appendix AQ or V Certification and qualification to MIL-
10、PRF-385351.2.4 Case outline(s) . The case outline(s) are as designated in MIL-STD-1835 and as follows:Outline letter Descriptive designator Terminals Package styleX CQC C1-N32 32 Square leadless chip carrier1.2.5 Lead finish . The lead finish is as specified in MIL-PRF-38535 for device classes Q and
11、 V or MIL-PRF-38535,appendix A for device class M.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-94522DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 3DSCC FORM 2234APR 971.3 Abso
12、lute maximum ratings . 1 / 2 / 3 /Supply voltage range (V C CN , V CCQ ) . -0.5 V dc to +7.0 V dcDC input voltage range (V IN ) -0.5 V dc to +7.0 V dcOutput current into outputs (low) (I OL ) . +64 mAStorage temperature range (T STG ) . -65 C to +150 CMaximum power dissipation (P D ) . 807 mWLead te
13、mperature (soldering, 10 seconds) . +260 CThermal resistance, junction-to-case ( JC ) . See MIL-STD-1835Junction temperature (T J ) +175 C1.4 Recommended operating conditions . 2 / 3 /Supply voltage range (V CCN , V CCQ ) . +4.5 V dc to +5.5 V dcInput voltage range (V IN ) +0.0 V d c to V CCQOutput
14、voltage range (V OUT ) +0.0 V dc to V CCNHigh level input voltage range (V IH , V IHH ):V IH . 2.0 V dc to V CCQ 4 /V IHH . V CCQ 0.85 dc to V CCQ 5 / 6 /Mid level input voltage range (V IMM ) . V CCQ /2 500 mV dc 5 /Low level input voltage range (V IL , V ILL ):V IL . -0.5 V dc to 0.8 V dc 4 /V ILL
15、 0.0 V dc to 0.85 V dc 5 / 6 /Case operating temperature range (T C ) . -55 C to +125 CInput rise or fall time (t r , t f ):(2.0 V to 0.8 V; 0.8 V to 2.0 V) 0 to 2.5 nsMaximum high level output current (I O H ) -16 mAMaximum low level output current (I OL ) +46 mA_1 / Stresses above the absolute max
16、imum rating may cause permanent damage to the device. Extended operation at themaximum levels may degrade performance and affect reliability.2 / U nless otherwise noted, all voltages are referenced to GND.3 / Unless otherwise specified the values listed above shall apply over the full V CCN , V CCQ
17、and T C recommended operatingrange. For the absolute maximum parameters, the limits shall apply over the full specified V CCN , V CCQ and T C operatingranges and case temperature of -55 C to +125 C.4 / This voltage range applies to the REF and FB inputs only.5 / This voltage range applies to the TES
18、T, FS, and mFn inputs only. These inputs are normally wired to V CCQ or GND or leftunconnected (actual threshold voltages vary as a percentage of V CCQ ). Internal termination resistors hold unconnectedinputs at V CCQ /2. If these inputs are switched, the function and timing of the outputs may glitc
19、h and the phase-lock-loop(PLL) may require an additional t LOCK time before all table I limits are achieved.6 / Negative undershoots of 2.0 V dc are allowed with a pulse width 20 ns.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT
20、 DRAWINGSIZEA 5962-94522DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 4DSCC FORM 2234APR 972. APPLICABLE DOCUMENTS2.1 Government specification, standards, and handbooks . The following specification, standards, and handbooks form apart of this drawing to the extent s
21、pecified herein. Unless otherwise specified, the issues of these documents are those listedin the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited inthe solicitation.SPECIFICATIONDEPARTMENT OF DEFENSEMIL-PRF-38535 - Integrated Circuits,
22、Manufacturing, General Specification for.STANDARDSDEPARTMENT OF DEFENSEMIL -STD -883 - Test Metho d Standard Microcircuits.MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.HANDBOOKSDEPARTMENT OF DEFENSEMIL-HDBK-103 - List of Standard Microcircuit Drawings.MIL -HDBK -780 - Standar
23、d Microcircuit Drawings.(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the StandardizationDocument Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)2.2 Order of precedence . In the event of a conflict between the text of
24、 this drawing and the references cited herein, the textof this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless aspecific exemption has been obtained.3. REQUIREMENTS3.1 Item requirements . The individual item requirements for device class
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